Patents by Inventor Chung-Hsin Chen

Chung-Hsin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060217114
    Abstract: A customer service module used to handle a service for maintenance and repair of a wireless communication device requested by a customer is disclosed. The customer service module comprises a database storing at least a set of status information comprising a set of failure status information and a set of maintenance and repair status information and corresponding to an identification serial number of the wireless communication device. A failure information inputting interface at a service terminal is used to input the set of failure status information and a maintenance and repair status inputting interface at a maintenance and repair terminal is used to input the set of maintenance and repair status information. A status displaying interface is located at the service terminal and the maintenance and repair terminal respectively and used to display the set of failure status information or the set of maintenance and repair information according to the identification serial number.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 28, 2006
    Inventor: Chung-Hsin Chen
  • Patent number: 6718220
    Abstract: A method and system of monitoring apparatuses of manufacturing integrated circuit (IC) detects the problems during wafers processing by replaying the apparatus events. First, the method and system download the data of apparatus events, and then calculate the achievement indices. Then, the method and system establish the control chart to determined limitative rules, and execute the replaying system by establishing the computer interface system therewith to detect the abnormal point so as to proceed a rectification. The method and system of monitoring apparatuses of manufacturing IC review the past achievements by establishing a model for replaying apparatus history and achievements, and foresee the future problems by establishing control charts and a knowledge archive of rules.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: April 6, 2004
    Assignee: Windbond Electronics Corporation
    Inventor: Chung-Hsin Chen
  • Patent number: 6714001
    Abstract: A dispatching method of manufacturing integrated circuit (IC) by push and pull two-way is to decide the dispatching orders of lots of wafers in each workstation. First, the priorities of lots of wafers is determined, and then the dispatching method of manufacturing IC by push and pull two-way is proceeded to run several push steps and pull steps. The push step is to dispatch wafers directly from upper process, no matter the lower units are crowded or delayed. On the other hand, the pull step is first to concern deficiencies in the lower unit, and then to dispatch wafers from the upper units. After proceeding the push steps and the pull steps, the other lots of wafers are dispatched by their original priorities. The dispatching method of manufacturing IC by push and pull two-way has the advantage of increasing the utilities of equipments.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: March 30, 2004
    Assignee: Winbond Electronics Corporation
    Inventors: Henry Fang, Chung-Hsin Chen
  • Publication number: 20030100131
    Abstract: A dispatching method of manufacturing integrated circuit (IC) by push and pull two-way is to decide the dispatching orders of lots of wafers in each workstation. First, the priorities of lots of wafers is determined, and then the dispatching method of manufacturing IC by push and pull two-way is proceeded to run several push steps and pull steps. The push step is to dispatch wafers directly from upper process, no matter the lower units are crowded or delayed. On the other hand, the pull step is first to concern deficiencies in the lower unit, and then to dispatch wafers from the upper units. After proceeding the push steps and the pull steps, the other lots of wafers are dispatched by their original priorities. The dispatching method of manufacturing IC by push and pull two-way has the advantage of increasing the utilities of equipments.
    Type: Application
    Filed: November 28, 2001
    Publication date: May 29, 2003
    Applicant: WINBOND ELECTRONICS CORP.
    Inventors: Henry Fang, Chung-Hsin Chen
  • Publication number: 20030100970
    Abstract: A method and system of monitoring apparatuses of manufacturing integrated circuit (IC) detects the problems during wafers processing by replaying the apparatus events. First, the method and system download the data of apparatus events, and then calculate the achievement indices. Then, the method and system establish the control chart to determined limitative rules, and execute the replaying system by establishing the computer interface system therewith to detect the abnormal point so as to proceed a rectification. The method and system of monitoring apparatuses of manufacturing IC review the past achievements by establishing a model for replaying apparatus history and achievements, and foresee the future problems by establishing control charts and a knowledge archive of rules.
    Type: Application
    Filed: November 29, 2001
    Publication date: May 29, 2003
    Applicant: WINBOND ELECTRONICS CORPORATION
    Inventor: Chung-Hsin Chen