Abstract: A multi-band dual-polarized antenna structure is provided. The multi-band dual-polarized antenna structure includes a first antenna array, a second antenna array and a third antenna array. The first antenna array is arranged in a first row and operating at a first frequency. The second antenna array is arranged in a second row, operates at a second frequency and has a first polarized direction. The third antenna array is arranged in the second row, operates at the second frequency and has a second polarized direction different from the first polarized direction.

Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

Abstract: An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

Abstract: The invention provides an antenna module of improved performances; the antenna module may comprise a plurality of first antennas for signaling at a first band, and a plurality of second antennas for signaling at a second band different from the first band. Each said first antenna may comprise a main radiator which resonates at a mode-one frequency and a mode-two frequency different from the mode-one frequency; and the main radiator may be configured such that the mode-one frequency may be in the first band, and the mode-two frequency may not be in the first band and the second band.

Abstract: The invention provides an antenna for multi-broadband and multi-polarization communication, which may include a plurality of radiators configured to jointly function as one or more dipoles, and a plurality of parasitic elements. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands, and may comprise an arm and a ground wall connecting the arm and a ground plane. The arm may comprise an arm plate and a folded arm. The ground wall may comprise a meandering portion causing a distance between the arm and the ground plane to be shorter than a length of a current conduction path along the ground wall between the arm and the ground plane. On a geometric reference surface, a projection of each parasitic element may extend between two gaps which clamp a projection of an associated one of the radiators.

Abstract: A millimeter wave antenna device includes an antenna array, a first parasitic element and a second parasitic element. The antenna array includes m×n antennas and is disposed in an antenna area. The first parasitic element is disposed beside a first side of the antenna area. The second parasitic element is disposed beside a second side of the antenna area. None of the first parasitic element and the second parasitic element overlaps with the antenna area.

Abstract: The invention provides an antenna module of improved performances; the antenna module may comprise a plurality of first antennas for signaling at a first band, and a plurality of second antennas for signaling at a second band different from the first band. Each said first antenna may comprise a main radiator which resonates at a mode-one frequency and a mode-two frequency different from the mode-one frequency; and the main radiator may be configured such that the mode-one frequency may be in the first band, and the mode-two frequency may not be in the first band and the second band.

Abstract: A multi-band dual-polarized antenna structure is provided. The multi-band dual-polarized antenna structure includes a first antenna array, a second antenna array and a third antenna array. The first antenna array is arranged in a first row and operating at a first frequency. The second antenna array is arranged in a second row, operates at a second frequency and has a first polarized direction. The third antenna array is arranged in the second row, operates at the second frequency and has a second polarized direction different from the first polarized direction.

Abstract: An antenna device may include a first antenna, a second antenna, a switch unit and a radio frequency chain circuit. The first antenna may be used to wirelessly transceive a first signal, and include a first feeding point used to transceive the first signal through a conductive path. The second antenna may be used to wirelessly transceive a second signal, and include a second feeding point used to transceive the second signal through a conductive path. The switch unit may be coupled among the first feeding point, the second feeding point and the radio frequency chain circuit and be used to selectively transceive one of the first signal and the second signal. The radio frequency chain circuit may be used to transceive and process the signal transceived by the switch unit. A nearest gap between the first antenna and the second antenna may be less than 30 millimeters.

Abstract: An antenna assembly includes a first antenna element coupled to RF circuitry via a first feeder, and a second antenna element coupled to the RF circuitry via a second feeder. The first feeder and the second feeder have different shapes. The first antenna element and the second antenna element radiate in different frequency bands and in a direction parallel to a ground plane. The ground plane is disposed on at least one layer in a substrate that includes a plurality of layers parallel to one another. The first antenna element is disposed on first one or more of the layers and the second antenna element is disposed on second one or more of the layers, which are different from the first one or more of the layers. Another antenna assembly includes a first subarray of the first antenna elements and a second subarray of the second antenna elements.

Abstract: An antenna device includes a first dipole antenna, a second loop shaped antenna, a first feed line and a second feed line. The first dipole antenna operates at a first frequency band. The first dipole antenna includes a first portion and a second portion. The second loop shaped antenna operates at a second frequency band different from the first frequency band. A first terminal of the second loop shaped antennal is coupled to a second terminal of the first portion of the first dipole antenna. A second terminal of the second loop shaped antenna is coupled to a first terminal of the second portion of the first dipole antenna. The first feed line is coupled to the second terminal of the first portion of the first dipole antenna. The second feed line is coupled to the first terminal of the second portion of the first dipole antenna.

Abstract: The present disclosure provides a semiconductor package device comprising: (1) a substrate comprising a first area and a second area; (2) a semiconductor device on the first area of the substrate; (3) an antenna pattern on the second area of the substrate; (4) a first electronic component on the antenna pattern; and (5) a first package body encapsulating the first area of the substrate and the semiconductor device and exposing the antenna pattern, the first electronic component and the second area of the substrate. An upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.

Abstract: The present disclosure provides for a semiconductor package device. The semiconductor package device includes a substrate, a first antenna, an electronic component, a package body and a second antenna. The substrate includes a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The first antenna is disposed on the first surface of the substrate. The electronic component is disposed on the second surface of the substrate. The package body is disposed on the second surface of the substrate and encapsulates the electronic component. The package body has a first lateral surface substantially coplanar with the first lateral surface of the substrate. The second antenna is disposed on the first lateral surface of the substrate and on the first lateral surface of the package body.

Abstract: The present disclosure provides a semiconductor package device comprising: (1) a substrate comprising a first area and a second area; (2) a semiconductor device on the first area of the substrate; (3) an antenna pattern on the second area of the substrate; (4) a first electronic component on the antenna pattern; and (5) a first package body encapsulating the first area of the substrate and the semiconductor device and exposing the antenna pattern, the first electronic component and the second area of the substrate. An upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.

Abstract: The present disclosure provides a semiconductor package device comprising a substrate, a semiconductor device, a first electronic component, an antenna pattern and a first package body. The substrate has a first area and a second area. The semiconductor device is disposed on the first area of the substrate. The first electronic component is disposed on the second area of the substrate. The antenna pattern is disposed on the second area of the substrate and electrically connected to the first electronic component. The first package body encapsulates the first area of the substrate and the semiconductor device and exposes the antenna pattern, the first electronic component and the second area of the substrate.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: The present disclosure relates to an antenna structure including a first metal member and a second metal member. The first metal member includes a protruding portion. The second metal member defines a recess portion. The first metal member is separated from the second metal member. The protruding portion of the first metal member extends at least partially into the recess portion of the second metal member. The first metal member and the second metal member are located along a same plane.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: A chip with an integrated circuit testing function includes a selecting unit positioned before a flip-flop of a scan chain, where the scan chain connects a scan-in pad, a scan-out pad and the flip-flop. When the chip is packaged and the scan-in pad does not connect to a pin of a package, the selecting unit selects a scan-in signal from another scan chain and transmits the scan-in signal from the another scan chain to the flip-flop; and when the chip is packaged and the scan-in pad connects to a pin of the package, the selecting unit selects a scan-in signal from the scan-in pad and transmits the scan-in signal from the scan-in pad to the flip-flop.

Abstract: An integrated circuit testing method includes: respectively connecting a plurality of pads in a chip to generate a plurality of scan chains, wherein each scan chain connects two pads and at least one flip-flop in the chip; providing at least a selecting unit, wherein the selecting unit determines a mode according to a plurality of available scan chains after the chip is packaged; and determining a target scan chain to be connected with a target flip-flop corresponding to the selecting unit according to the mode determined by the selecting unit.