Patents by Inventor Chung-Hsin Fu

Chung-Hsin Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12276849
    Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 15, 2025
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: QianBing Yan, Min-Sheng Kao, ChunFu Wu, Yueh-Kuo Lin, LinChun Li, Chung-Hsin Fu
  • Patent number: 12248173
    Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: March 11, 2025
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Chung-Hsin Fu, Min-Sheng Kao, ChunFu Wu, Yi-Tseng Lin, Chih-Wei Yu, Chien-Tzu Wu, QianBing Yan, Yueh-Kuo Lin
  • Publication number: 20250023642
    Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.
    Type: Application
    Filed: September 25, 2024
    Publication date: January 16, 2025
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: Min-Sheng KAO, ChunFu WU, Chung-Hsin FU, QianBing YAN, LinChun LI, Chih-Wei YU, Chien-Tzu WU, Yi-Tseng LIN
  • Patent number: 12136952
    Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: November 5, 2024
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Min-Sheng Kao, ChunFu Wu, Chung-Hsin Fu, QianBing Yan, LinChun Li, Chih-Wei Yu, Chien-Tzu Wu, Yi-Tseng Lin
  • Publication number: 20240210635
    Abstract: Disclosed is an optical emission assembly including a body, an adapter, two light-emitting assemblies, a multiplexer and a converging lens. The body is provided with a first positioning groove, a second positioning groove, an accommodation groove, and a through hole. The accommodation groove communicates with the first and second positioning grooves and the through hole. A groove bottom of the first positioning groove communicates with a groove bottom of the second positioning groove. The adapter is connected to the body and disposed corresponding to the through hole. When the two light-emitting assemblies are installed in the first and second positioning grooves, each light-emitting chip of each light-emitting assembly emits beams towards the accommodation groove to make the multiplexer disposed at the bottom of the accommodation groove combine the beams into one beam. The converging lens is disposed in the through hole to converge the one beam on the adapter.
    Type: Application
    Filed: June 2, 2023
    Publication date: June 27, 2024
    Applicants: DONGGUAN XUNTAO ELECTRONIC CO., LTD., Dongguan Luxshare Technologies Co., Ltd
    Inventors: Chung-Hsin FU, Min-Sheng KAO, Yi-Tseng LIN, Chih-Wei YU
  • Publication number: 20240210639
    Abstract: Disclosed is an optical emission assembly including a heat dissipation base, an adapter, a light-emitting assembly, a multiplexer, a cooling chip, a converging lens, a housing, and a heat-conducting glue. The heat dissipation base includes a first heat dissipation plate and a second heat dissipation plate forming a T-shaped or an L-shaped structure. The light-emitting assembly and the multiplexer are disposed on the second heat dissipation plate. The multiplexer combines light beams emitted by light-emitting chips of the light-emitting assembly into one light beam, and then the one light beam enters the adapter through the converging lens. The cooling chip is disposed on the first heat dissipation plate. The heat dissipation base and the cooling chip are disposed in the housing, and the cooling chip corresponds to a through hole of the housing. The heat-conducting glue is filled in the through hole and between the cooling chip and the housing.
    Type: Application
    Filed: June 2, 2023
    Publication date: June 27, 2024
    Applicants: DONGGUAN XUNTAO ELECTRONIC CO., LTD., Dongguan Luxshare Technologies Co., Ltd
    Inventors: Chung-Hsin FU, Min-Sheng KAO, Yi-Tseng LIN, Chih-Wei YU
  • Publication number: 20240004150
    Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.
    Type: Application
    Filed: December 5, 2022
    Publication date: January 4, 2024
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: QianBing YAN, Min-Sheng KAO, ChunFu WU, Yueh-Kuo LIN, LinChun LI, Chung-Hsin FU
  • Publication number: 20230333317
    Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.
    Type: Application
    Filed: December 22, 2022
    Publication date: October 19, 2023
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: Chung-Hsin FU, Min-Sheng KAO, ChunFu WU, Yi-Tseng LIN, Chih-Wei YU, Chien-Tzu WU, QianBing YAN, Yueh-Kuo LIN
  • Publication number: 20230122313
    Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.
    Type: Application
    Filed: August 10, 2022
    Publication date: April 20, 2023
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: Min-Sheng KAO, ChunFu WU, Chung-Hsin FU, QianBing YAN, LinChun LI, Chih-Wei YU, Chien-Tzu WU, Yi-Tseng LIN
  • Patent number: 11428874
    Abstract: A composite connector for optical power meter is provided, which includes a fixation base and an active connection base. The fixation base is installed on an optical power meter; the fixation base includes a left hole, a right hole and a central hole. The active connection base includes a bottom plate, an active pin, a first fiber socket and a second fiber socket. The first fiber socket and the second fiber socket are disposed on the bottom plate. The active pin penetrates through the bottom plate and is inserted into the left hole, whereby a first circle, whose center is at the active pin and circumference passes through the first fiber socket as well as the second fiber socket, overlaps a second circle, whose center is at the left hole and circumference passes through the central hole, in the normal direction of the active connection base.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: August 30, 2022
    Assignee: LUXNET CORPORATION
    Inventors: Chung-Hsin Fu, Ya-Chuan Lin
  • Publication number: 20210396938
    Abstract: A composite connector for optical power meter is provided, which includes a fixation base and an active connection base. The fixation base is installed on an optical power meter; the fixation base includes a left hole, a right hole and a central hole. The active connection base includes a bottom plate, an active pin, a first fiber socket and a second fiber socket. The first fiber socket and the second fiber socket are disposed on the bottom plate. The active pin penetrates through the bottom plate and is inserted into the left hole, whereby a first circle, whose center is at the active pin and circumference passes through the first fiber socket as well as the second fiber socket, overlaps a second circle, whose center is at the left hole and circumference passes through the central hole, in the normal direction of the active connection base.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 23, 2021
    Inventors: CHUNG-HSIN FU, YA-CHUAN LIN
  • Patent number: 9991674
    Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: June 5, 2018
    Assignee: LUXNET CORPORATION
    Inventors: Pi-Cheng Law, Po-Chao Huang, Hsing-Yen Lin, Chung-Hsin Fu, Hua-Hsin Su
  • Publication number: 20180019569
    Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.
    Type: Application
    Filed: November 17, 2016
    Publication date: January 18, 2018
    Inventors: Pi-Cheng LAW, Po-Chao HUANG, Hsing-Yen LIN, Chung-Hsin FU, Hua-Hsin SU
  • Patent number: 9568695
    Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: February 14, 2017
    Assignee: LUXNET CORPORATION
    Inventors: Yun-Cheng Huang, Chung Hsin Fu, Chi-Min Ting, Nai-Xin Chen
  • Patent number: 9419717
    Abstract: A replaceable transmitting module is disposed on an optical connector. The replaceable transmitting module comprises a plurality of optical sub-assemblies disposed independently respectively, and at least one positioning mount disposed on the optical connector. The optical sub-assemblies comprises at least one edge-emitting laser diode, a second cover disposed on the edge-emitting laser diode, and a second lens disposed on the second cover and corresponding to the edge-emitting laser diode. The positioning mount comprises a base and a plurality of positioning portions which are disposed on the base and to fix the optical sub-assemblies, respectively.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: August 16, 2016
    Assignee: LUXNET CORPORATION
    Inventors: Yun-Cheng Huang, Chung-Hsin Fu, Huang-Shen Lin, Yi-Ping Hung, Nai-Hsin Chen, Chi-Min Ting, Chien-Hua Chiu
  • Patent number: 9400359
    Abstract: An optical transmitter package structure, comprising: a base, a circuit substrate, and a cylindrical light-coupling mechanism. The optical transmitter package structure of the present invention has following advantageous effects: once the packaging process of the optical transmitter of the present invention is completed, the resulting structure is compact and airtight. Consequently, the optical transmitter is well protected against moisture during use and has a long service life; the optical transmitter of the present invention has a sturdy overall structure which is resistant to damage by improper operation during assembly.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: July 26, 2016
    Assignee: Luxnet Corporation
    Inventors: Chung Hsin Fu, Ya Chuan Lin, Shu Chun Chang, Yun Cheng Huang, Hua Hsin Su
  • Publication number: 20150253520
    Abstract: A transmitting device package structure comprises a base mounted with a transmitting module, a circuit board, and a cylindrical element. The base comprising a plane part mounted with a transmitting module, and an assembling part disposed on one side of the plane part. The circuit board comprises a board body, an electrical connection side disposed on one end of the board body and connected with the transmitting module, and an electrical connection port disposed an end of the board body opposite to the electrical connection side. The cylindrical element is mounted on the assembling part. The cylindrical element comprises a cylindrical body connected to the external optical fiber, and a coupling lens disposed inside the cylindrical body or one side of the cylindrical body, and the coupling lens couples the optical signal emitted from the transmitting module to the external optical fiber.
    Type: Application
    Filed: June 13, 2014
    Publication date: September 10, 2015
    Inventors: Yun-Cheng Huang, Chung-Hsin Fu, Hua-Hsin Su, Huang-Shen Lin, Nai-Hsin Chen
  • Publication number: 20150256259
    Abstract: A replaceable transmitting module is disposed on an optical connector. The replaceable transmitting module comprises a plurality of optical sub-assemblies disposed independently respectively, and at least one positioning mount disposed on the optical connector. The optical sub-assemblies comprises at least one edge-emitting laser diode, a second cover disposed on the edge-emitting laser diode, and a second lens disposed on the second cover and corresponding to the edge-emitting laser diode. The positioning mount comprises a base and a plurality of positioning portions which are disposed on the base and to fix the optical sub-assemblies, respectively.
    Type: Application
    Filed: June 13, 2014
    Publication date: September 10, 2015
    Inventors: Yun-Cheng Huang, Chung-Hsin Fu, Huang-Shen Lin, Yi-Ping Hung, Nai-Hsin Chen, Chi-Min Ting, Chien-Hua Chiu
  • Patent number: 9129883
    Abstract: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: September 8, 2015
    Assignee: LUXNET CORPORATION
    Inventors: Yun-Cheng Huang, Chien-Wen Lu, Chung Hsin Fu, Chi-Min Ting, Tsing-Chow Wang
  • Publication number: 20140294351
    Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.
    Type: Application
    Filed: October 18, 2013
    Publication date: October 2, 2014
    Applicant: LuxNet Corporation
    Inventors: Yun-Cheng Huang, Chung Hsin Fu, Chi-Min Ting, Nai-Xin Chen