Abstract: A semiconductor device having at least an electronic component and its fabrication method are disclosed. The fabrication method comprises: applying a conductive material on each one of at least a paired solder pads arranged on a substrate by screen printing, with a recess formed in the conductive material on each one of the at least a paired solder pads, so as to expose a portion of each one of the at least a paired solder pads, wherein the recesses on the at least a paired solder pads are formed in position corresponding to each other; and mounting at least an electronic component having two opposing conductive terminals on the at least a paired solder pads, in a manner that the two opposing conductive terminals are introduced into the corresponding recesses of the conductive material so as for the electronic component to be electrically connected to the at least a paired solder pads via the conductive material by reflow.

Abstract: A heat dissipation semiconductor package is disclosed according to the present invention. The heat dissipation semiconductor package comprises: a substrate that has a plurality of solder pads and at least one ground pad; a semiconductor chip that is mounted on the substrate and electrically connects to the solder pads; a plurality of passive elements that are mounted on the solder pads of the substrate; at least one metal bump or passive element of zero resistance, which are mounted on the at least one ground pad of the substrate; and a heat sink, which is capable of being mounted on the passive elements, and the at least one passive element of zero resistance or the metal bump, and the heat sink is electrically connecting to the at least one passive element of zero resistance or the metal bump, and then is further electrically coupling with the at least one ground pad of the substrate to form a ground return circuit, thus provides a shielding effect on electromagnetic interference (EMI).