Patents by Inventor Chung-Hsing Yu

Chung-Hsing Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device and method
    Patent number: 11943939
    Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Kai Hsu, Jerry Chang Jui Kao, Chin-Shen Lin, Ming-Tao Yu, Tzu-Ying Lin, Chung-Hsing Wang
  • Method of forming power grid structures
    Patent number: 11935833
    Abstract: A method of forming an IC structure includes forming first and second power rails at a power rail level. First metal segments are formed at a first metal level above the power rail level. Each first metal segment of the plurality of first metal segments overlap one or both of the first power rail or the second power rail. First vias are formed between the power rail level and the first metal level. Second metal segments are formed at a second metal level above the first metal level. At least one second metal segment of the plurality of second metal segments overlaps the first power rail. At least one second metal segment of the plurality of second metal segments overlaps the second power rail. A plurality of second vias are formed between the first metal level and the second metal level.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hiranmay Biswas, Chi-Yeh Yu, Kuo-Nan Yang, Chung-Hsing Wang, Stefan Rusu, Chin-Shen Lin
  • Bone screw, method for manufacturing the bone screw, and tool for mounting and removing the bone screw
    Patent number: 9060824
    Abstract: A bone screw includes a front portion, a rear portion, and a shaft portion. The shaft portion is fixedly joined to the front portion and the rear portion, so as to form an integral bone screw. The Young's modulus of the shaft portion is smaller than that of the front portion and that of the rear portion.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: June 23, 2015
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chi-Sheng Chien, Tsung-Chih Yu, Chung-Hsing Yu, Shien-Nan Kuo
  • BONE SCREW, METHOD FOR MANUFACTURING THE BONE SCREW, AND TOOL FOR MOUNTING AND REMOVING THE BONE SCREW
    Publication number: 20130131733
    Abstract: A bone screw includes a front portion, a rear portion, and a shaft portion. The shaft portion is fixedly joined to the front portion and the rear portion, so as to form an integral bone screw. The Young's modulus of the shaft portion is smaller than that of the front portion and that of the rear portion.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 23, 2013
    Applicant: Metal Industries Research&Development Centre
    Inventors: Chi-Sheng CHIEN, Tsung-Chih Yu, Chung-Hsing Yu, Shien-Nan Kuo