Patents by Inventor Chung-Hsuan WU

Chung-Hsuan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220128485
    Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.
    Type: Application
    Filed: November 23, 2020
    Publication date: April 28, 2022
    Inventors: Chia-Feng HSIAO, Chung-Hsuan WU, Shuo-Yu CHEN, Nai-Ying LO, Yi-Hui TSENG, Chen-Hui HUANG, Yung-Yu YANG, Tzu-Ping KAO
  • Patent number: 10843407
    Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: November 24, 2020
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Publication number: 20190248071
    Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.
    Type: Application
    Filed: May 25, 2018
    Publication date: August 15, 2019
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Publication number: 20190248070
    Abstract: A three-dimensional printing nozzle, a three-dimensional printing nozzle assembly, and a three-dimensional printing apparatus are provided. The three-dimensional printing nozzle includes a nozzle body having an inlet and an outlet, a driving unit disposed in the nozzle body, a first heating unit, and a first heat dissipation unit. A particle forming material is adapted to enter the nozzle body from the inlet. The driving unit is configured for pushing the particle forming material to move from the inlet to the outlet. The first heating unit is disposed in the nozzle body for heating and melting the particle forming material and extrudes a melted forming material out of the nozzle body from the outlet through the driving unit. The first heat dissipation unit is disposed in the nozzle body and located between the first heating unit and the inlet to reduce heat transmitted from the first heating unit to the inlet.
    Type: Application
    Filed: May 2, 2018
    Publication date: August 15, 2019
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Chi-Wen Hsieh, Chung-Hsuan Wu, Yang-Teh Lee
  • Patent number: 10161922
    Abstract: A molybdenum disulfide sensor includes a flexible substrate, a patterned circuit layer and at least a molybdenum disulfide sheet. The flexible substrate has a gas flow channel. The patterned circuit layer is formed on the flexible substrate, and the patterned circuit layer includes a first electrode and a second electrode. The second electrode is faced toward the first electrode, and a gap is formed between the first electrode and the second electrode. The molybdenum disulfide sheet is located in the gap and is connected with the first electrode and the second electrode.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: December 25, 2018
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chien-Chong Hong, Chung-Hsuan Wu, Shih-Pang Wang
  • Publication number: 20180272623
    Abstract: A three-dimensional printing nozzle structure including a heater, a nozzle, a feed tube and a baffle member is provided. The heater has a first through hole. The nozzle is connected to the heater and has a second through hole. The feed tube passes through the first through hole and has a feed channel. The first through hole, the second through hole and the feed channel are aligned with each other. A filament moves along the feed channel to pass through the heater. The heater heats and melts the filament, and the filament that has been melted moves from the feed channel into the second through hole to be extruded. The baffle member is disposed inside the first through hole and located between the feed channel and the second through hole. The baffle member is configured to adjust a degree of communication between the feed channel and the second through hole.
    Type: Application
    Filed: April 25, 2017
    Publication date: September 27, 2018
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Kwan Ho, Chi-Chieh Wu, Chung-Hsuan Wu
  • Patent number: 9890468
    Abstract: A method of making a breath sensing tube includes: (A) dispersing a nanowire material in a solution in a dielectriphoretic bath, such that the nanowire material is formed into individual nanowires and nanowire aggregates; (B) adsorbing the nanowire aggregates on a bath electrode through dielectrophoresis so as to obtain a nanowire-containing solution containing the individual nanowires; contacting sensor electrodes of a substrate with the nanowire-containing solution; and subjecting the nanowire-containing solution to dielectrophoresis, so that one of the individual nanowires is adsorbed to the sensor electrodes to interconnect the sensor electrodes.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: February 13, 2018
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chien-Chong Hong, Kuan-Wen Chen, Wei-Han Wang, Chung-Hsuan Wu
  • Publication number: 20170191971
    Abstract: A molybdenum disulfide sensor includes a flexible substrate, a patterned circuit layer and at least a molybdenum disulfide sheet. The flexible substrate has a gas flow channel. The patterned circuit layer is formed on the flexible substrate, and the patterned circuit layer includes a first electrode and a second electrode. The second electrode is faced toward the first electrode, and a gap is formed between the first electrode and the second electrode. The molybdenum disulfide sheet is located in the gap and is connected with the first electrode and the second electrode.
    Type: Application
    Filed: May 6, 2016
    Publication date: July 6, 2017
    Inventors: Chien-Chong HONG, Chung-Hsuan WU, Shih-Pang WANG
  • Publication number: 20160160373
    Abstract: A method of making a breath sensing tube includes: (A) dispersing a nanowire material in a solution in a dielectriphoretic bath, such that the nanowire material is formed into individual nanowires and nanowire aggregates; (B) adsorbing the nanowire aggregates on a bath electrode through dielectrophoresis so as to obtain a nanowire-containing solution containing the individual nanowires; contacting sensor electrodes of a substrate with the nanowire-containing solution; and subjecting the nanowire-containing solution to dielectrophoresis, so that one of the individual nanowires is adsorbed to the sensor electrodes to interconnect the sensor electrodes.
    Type: Application
    Filed: June 10, 2015
    Publication date: June 9, 2016
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chien-Chong HONG, Kuan-Wen CHEN, Wei-Han WANG, Chung-Hsuan WU