Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.

Abstract: A three-dimensional printing nozzle, a three-dimensional printing nozzle assembly, and a three-dimensional printing apparatus are provided. The three-dimensional printing nozzle includes a nozzle body having an inlet and an outlet, a driving unit disposed in the nozzle body, a first heating unit, and a first heat dissipation unit. A particle forming material is adapted to enter the nozzle body from the inlet. The driving unit is configured for pushing the particle forming material to move from the inlet to the outlet. The first heating unit is disposed in the nozzle body for heating and melting the particle forming material and extrudes a melted forming material out of the nozzle body from the outlet through the driving unit. The first heat dissipation unit is disposed in the nozzle body and located between the first heating unit and the inlet to reduce heat transmitted from the first heating unit to the inlet.

Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.

Abstract: A molybdenum disulfide sensor includes a flexible substrate, a patterned circuit layer and at least a molybdenum disulfide sheet. The flexible substrate has a gas flow channel. The patterned circuit layer is formed on the flexible substrate, and the patterned circuit layer includes a first electrode and a second electrode. The second electrode is faced toward the first electrode, and a gap is formed between the first electrode and the second electrode. The molybdenum disulfide sheet is located in the gap and is connected with the first electrode and the second electrode.

Abstract: A three-dimensional printing nozzle structure including a heater, a nozzle, a feed tube and a baffle member is provided. The heater has a first through hole. The nozzle is connected to the heater and has a second through hole. The feed tube passes through the first through hole and has a feed channel. The first through hole, the second through hole and the feed channel are aligned with each other. A filament moves along the feed channel to pass through the heater. The heater heats and melts the filament, and the filament that has been melted moves from the feed channel into the second through hole to be extruded. The baffle member is disposed inside the first through hole and located between the feed channel and the second through hole. The baffle member is configured to adjust a degree of communication between the feed channel and the second through hole.

Abstract: A method of making a breath sensing tube includes: (A) dispersing a nanowire material in a solution in a dielectriphoretic bath, such that the nanowire material is formed into individual nanowires and nanowire aggregates; (B) adsorbing the nanowire aggregates on a bath electrode through dielectrophoresis so as to obtain a nanowire-containing solution containing the individual nanowires; contacting sensor electrodes of a substrate with the nanowire-containing solution; and subjecting the nanowire-containing solution to dielectrophoresis, so that one of the individual nanowires is adsorbed to the sensor electrodes to interconnect the sensor electrodes.

Abstract: A molybdenum disulfide sensor includes a flexible substrate, a patterned circuit layer and at least a molybdenum disulfide sheet. The flexible substrate has a gas flow channel. The patterned circuit layer is formed on the flexible substrate, and the patterned circuit layer includes a first electrode and a second electrode. The second electrode is faced toward the first electrode, and a gap is formed between the first electrode and the second electrode. The molybdenum disulfide sheet is located in the gap and is connected with the first electrode and the second electrode.

Abstract: A method of making a breath sensing tube includes: (A) dispersing a nanowire material in a solution in a dielectriphoretic bath, such that the nanowire material is formed into individual nanowires and nanowire aggregates; (B) adsorbing the nanowire aggregates on a bath electrode through dielectrophoresis so as to obtain a nanowire-containing solution containing the individual nanowires; contacting sensor electrodes of a substrate with the nanowire-containing solution; and subjecting the nanowire-containing solution to dielectrophoresis, so that one of the individual nanowires is adsorbed to the sensor electrodes to interconnect the sensor electrodes.