Patents by Inventor Chung-Hua Fu

Chung-Hua Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9551569
    Abstract: Apparatus and method for curvature and thin film stress measurement are disclosed. The apparatus comprises two light sources and a detector. Two light beams from the two light sources with an angle are not parallel. The two light beams are collimated and projected onto a specimen with a pitch. The detector receives the light beams reflected from the specimen. The curvature of the specimen is calculated via a distance between spots of the light beams on the detector or a size variation of one of the spots.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: January 24, 2017
    Assignee: Hermes-Epitek Corporation
    Inventors: Chung-Yuan Wu, Robert Champetier, Chung-Hua Fu, Bu-Chin Chung
  • Publication number: 20160102968
    Abstract: Apparatus and method for curvature and thin film stress measurement are disclosed. The apparatus comprises two light sources and a detector. Two light beams from the two light sources with an angle are not parallel. The two light beams are collimated and projected onto a specimen with a pitch. The detector receives the light beams reflected from the specimen. The curvature of the specimen is calculated via a distance between spots of the light beams on the detector or a size variation of one of the spots.
    Type: Application
    Filed: October 13, 2014
    Publication date: April 14, 2016
    Inventors: Chung-Yuan WU, Robert Champetier, Chung-Hua FU, Bu-Chin CHUNG
  • Patent number: 8501510
    Abstract: An optoelectronic component with three-dimension quantum well structure and a method for producing the same are provided, wherein the optoelectronic component comprises a substrate, a first semiconductor layer, a transition layer, and a quantum well structure. The first semiconductor layer is disposed on the substrate. The transition layer is grown on the first semiconductor layer, contains a first nitride compound semiconductor material, and has at least a texture, wherein the texture has at least a first protrusion with at least an inclined facet, at least a first trench with at least an inclined facet and at least a shoulder facet connected between the inclined facets. The quantum well structure is grown on the texture and shaped by the protrusion, the trench and the shoulder facet.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: August 6, 2013
    Assignee: Hermes-Epitek Corp.
    Inventors: Benson Chao, Chung-Hua Fu, Shih-Chieh Jang
  • Patent number: 8294163
    Abstract: An optoelectronic component with three-dimension quantum well structure and a method for producing the same are provided, wherein the optoelectronic component comprises a substrate, a first semiconductor layer, a transition layer, and a quantum well structure. The first semiconductor layer is disposed on the substrate. The transition layer is grown on the first semiconductor layer, contains a first nitride compound semiconductor material, and has at least a texture, wherein the texture has at least a first protrusion with at least an inclined facet, at least a first trench with at least an inclined facet and at least a shoulder facet connected between the inclined facets. The quantum well structure is grown on the texture and shaped by the protrusion, the trench and the shoulder facet.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: October 23, 2012
    Assignee: Hermes-Epitek Corp.
    Inventors: Benson Chao, Chung-Hua Fu, Shih-Chieh Jang
  • Publication number: 20120231569
    Abstract: An optoelectronic component with three-dimension quantum well structure and a method for producing the same are provided, wherein the optoelectronic component comprises a substrate, a first semiconductor layer, a transition layer, and a quantum well structure. The first semiconductor layer is disposed on the substrate. The transition layer is grown on the first semiconductor layer, contains a first nitride compound semiconductor material, and has at least a texture, wherein the texture has at least a first protrusion with at least an inclined facet, at least a first trench with at least an inclined facet and at least a shoulder facet connected between the inclined facets. The quantum well structure is grown on the texture and shaped by the protrusion, the trench and the shoulder facet.
    Type: Application
    Filed: May 17, 2012
    Publication date: September 13, 2012
    Applicant: HERMES-EPITEK CORP.
    Inventors: BENSON CHAO, CHUNG-HUA FU, SHIH-CHIEH JANG
  • Publication number: 20110186810
    Abstract: An optoelectronic component with three-dimension quantum well structure and a method for producing the same are provided, wherein the optoelectronic component comprises a substrate, a first semiconductor layer, a transition layer, and a quantum well structure. The first semiconductor layer is disposed on the substrate. The transition layer is grown on the first semiconductor layer, contains a first nitride compound semiconductor material, and has at least a texture, wherein the texture has at least a first protrusion with at least an inclined facet, at least a first trench with at least an inclined facet and at least a shoulder facet connected between the inclined facets. The quantum well structure is grown on the texture and shaped by the protrusion, the trench and the shoulder facet.
    Type: Application
    Filed: February 1, 2010
    Publication date: August 4, 2011
    Applicant: HERMES-EPITEK CORP.
    Inventors: BENSON CHAO, CHUNG-HUA FU, SHIH-CHIEH JANG