Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A housing structure located in an electronic communication device to hold a SIM card and a flash memory card includes a SIM card holding bracket and a flash memory card holding bracket. The SIM card holding bracket has two elastic clips on two opposite sides thereof to clamp and hold the SIM card and make electric contacts of the SIM card to face outward to be in contact with the electronic communication device to establish electric connection. The SIM card holding bracket has an inner side in contact with one lateral surface of the flash memory card holding bracket which has an opening on one side to receive the flash memory card into the housing structure to establish electric connection with the electronic communication device.

Abstract: A composite actuating device is provided for use on an electronic device, such as an electronic notepad or an electronic dictionary machine. The composite actuating device of the invention includes a casing, a cover adapted to be reclosably hinged to the casing and having a locking structure provided in one end thereof, and a power switch mounted in the casing, a button which can trigger the power switch when operated; and a latching device which is capable of locking the cover in closed position on the casing when engaged with the locking structure on the cover, the latching device being linked to the button such that the latching device is disengaged from the locking structure on the cover when the button is operated to trigger the power switch. This allows the actions of unlocking the cover and switching on the power of the electronic device to be simultaneously achieved simply by operating one button by the user.

Abstract: A power-on protective structure for expansion cards installed in a portable computer or the like is provided. The power-on protective structure allows the replacement of the expansion card currently installed in the portable computer to be carried out only when the power supply to the expansion card is disconnected so that the data stored in the expansion card will not be damaged or lost due to inadvertent detachment of the expansion card from the portable computer while the power is still on. The power-on protective structure includes a casing; a battery compartment formed in the casing for accommodating at least one battery therein; a receptacle formed in the casing for accommodating an expansion card therein; a first cover for covering the battery compartment; and a second cover for covering the receptacle.