Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A knockdown heat dissipation unit includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body to form a large area of thermal contact face. According to the structural design of the knockdown heat dissipation unit, the number of the heat pipes can be increased or reduced according to the heat dissipation requirement of a user. Also, the number of the heat pipes can be flexibly adjusted according to the size of a heat source to enhance the heat dissipation effect.

Abstract: A knockdown heat dissipation unit includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body to form a large area of thermal contact face. According to the structural design of the knockdown heat dissipation unit, the number of the heat pipes can be increased or reduced according to the heat dissipation requirement of a user. Also, the number of the heat pipes can be flexibly adjusted according to the size of a heat source to enhance the heat dissipation effect.

Abstract: A heat pipe structure includes a flat tubular body having a hollow section for contacting a heat source and at least one non-hollow section. A working fluid is contained in the hollow section and a capillary structure is disposed in the hollow section. The hollow section has a first outer side and a second outer side opposite to the first outer side. The non-hollow section is positioned on the first and second outer sides of the hollow section or a periphery thereof. The non-hollow section has a connection face for connecting with at least one retainer member.