Patents by Inventor Chung Hua University

Chung Hua University has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130163807
    Abstract: An electro-acoustic transducer includes an insulative flexible substrate, a base, and a magnetic field generator. The base includes a cavity and a magnetic portion disposed below the cavity. The insulative flexible substrate is configured to cover the cavity. The magnetic field generator can be disposed on the insulative flexible substrate and corresponds to the cavity. The magnetic field generator can produce a magnetic field and a reverse magnetic field to cause the magnetic field generator and the magnetic portion of the base to attract and repel each other, thereby vibrating the insulative flexible substrate.
    Type: Application
    Filed: December 24, 2012
    Publication date: June 27, 2013
    Applicant: CHUNG HUA UNIVERSITY
    Inventor: CHUNG HUA UNIVERSITY
  • Publication number: 20130133425
    Abstract: A thermal convection-type accelerometer includes a first insulating substrate, a circuit formed on the first insulating substrate, a first acceleration-sensing device coupled with the circuit, and a first supporting layer attached on the insulating substrate. The first acceleration-sensing device includes two temperature-sensing components and a heater disposed between the temperature-sensing components. The temperature-sensing components and the heater are directly formed on the first supporting layer.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 30, 2013
    Applicant: CHUNG HUA UNIVERSITY
    Inventor: Chung Hua University
  • Publication number: 20130034925
    Abstract: An RFID based thermal bubble type accelerometer includes a flexible substrate, an embedded system on chip (SOC) unit, an RFID antenna formed on the substrate and coupled to a modulation/demodulation module in the SOC unit, a cavity formed on the flexible substrate, and a plurality of sensing assemblies, including a heater and two temperature-sensing elements, disposed along the x-axis direction and suspended over the cavity. The two temperature-sensing elements, serially connected, are separately disposed at two opposite sides and at substantially equal distances from the heater. Two sets of sensing assemblies can be connected in differential Wheatstone bridge. The series-connecting points of the sensing assemblies are coupled to the SOC unit such that an x-axis acceleration can be obtained by a voltage difference between the connecting points. The x-axis acceleration can be sent by the RFID antenna to a reader after it is is modulated and encoded by the modulation/demodulation module.
    Type: Application
    Filed: October 9, 2012
    Publication date: February 7, 2013
    Applicant: Chung Hua University
    Inventor: Chung Hua University