Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A conductive mechanism includes two bases, an inner conductive spring and an outer conductive spring. The two bases are opposite to each other. Each of the bases includes a surface and a partition wall protruding relative to the surface. The inner conductive spring is disposed at inner sides of the two partition walls of the two bases. The outer conductive spring is disposed at outer sides of the two partition walls of the two bases. At least one of two ends of each of the inner conductive spring and the outer conductive spring rotatably abuts against the surface of one of the bases.

Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.

Abstract: A surface finishing method comprises applying coatings of a hydrophobic material and a water-borne material to a surface of a metal substrate. First, a patterned coating of a first one of the hydrophobic or water-borne materials is applied to a surface of the metal substrate to partially cover the surface. A second fill coating of the other of the hydrophobic or water borne materials is then applied after the first patterned coating whereby the water borne material and the hydrophobic material repel and the second fill coating coats the surface of the metal substrate in areas uncoated by the first coating.

Abstract: A substrate with a Micro-Arc Oxidation (MAO) layer or an electrophoretic deposition (ED) layer on a first side of the substrate and an electrically insulating layer on a second side of the substrate.

Abstract: Examples disclosed herein provide a system including a holder to secure a removable module. In one example, the removable module includes a plug comprising holes. The system further includes a receptacle mounted on a printed circuit board (PCB). As an example, the receptacle includes elastic members to make contact with the holes in the plug when the receptacle is to accommodate the plug of the removable module. As an example, the holder is slidable over the receptacle to constrain the elastic members of the receptacle to maintain contact with the holes in the plug of the removable module.

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

Abstract: Examples disclosed herein provide a system including a holder to secure a removable module. In one example, the removable module includes a plug comprising holes. The system further includes a receptacle mounted on a printed circuit board (PCB). As an example, the receptacle includes elastic members to make contact with the holes in the plug when the receptacle is to accommodate the plug of the removable module. As an example, the holder is slidable over the receptacle to constrain the elastic members of the receptacle to maintain contact with the holes in the plug of the removable module.

Abstract: The present disclosure provides a liquid crystal display panel, which includes a first control line, a second control line, a plurality of sub pixel columns and a plurality of strip common electrodes, the first control line and the second control line are spacedly disposed in parallel along a X axis direction, the plurality of sub pixel columns and the plurality of strip common electrodes are spacedly disposed in parallel along a Y axis direction, each of the strip common electrodes covers at least one of the sub pixel columns, the strip common electrodes in odd columns are connected to the first control line, the strip common electrodes in even columns are connected to the second control line. In addition the present disclosure further provides an electronic device. The liquid crystal display panel may achieve the columns between the sub pixel columns or the pixel columns to rotate.

Abstract: A surface finishing method comprises applying coatings of a hydrophobic material and a water-borne material to a surface of a metal substrate. First, a patterned coating of a first one of the hydrophobic or water-borne materials is applied to a surface of the metal substrate to partially cover the surface. A second fill coating of the other of the hydrophobic or water borne materials is then applied after the first patterned coating whereby the water borne material and the hydrophobic material repel and the second fill coating coats the surface of the metal substrate in areas uncoated by the first coating.

Abstract: A substrate with a Micro-Arc Oxidation (MAO) layer or an electrophoretic deposition (ED) layer on a first side of the substrate and an electrically insulating layer on a second side of the substrate.

Abstract: A material may include a substrate, a light metal layer on the substrate and an oxidized layer on the light metal layer. In some cases, the substrate may include a fiber material and a thermoplastic binding polymer. In other cases, the substrate may include a light metal and a fiber material.

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

Abstract: A method of molding is described in which a film and a substrate are positioned between first and second mold parts. The first mold part is compressed against the film and the second mold part is compressed against the substrate to form the film and substrate into a molded product. The compressing forms a texture in a surface of the film.

Abstract: A wire saw with sawteeth strip updating structure is provided. A buckling structure is designed in the wire saw. The buckling structure is hidden the handle portion of the saw and includes a connecting unit and a combining unit. The connecting unit can be buckled or unbuckled from the combining unit. The sawteeth strip is connected to the combining unit in a tense state. In updating, the user only needs to push a guide sheet to release the connecting unit from the combining unit. Then the sawteeth strip is taken out easily from the saw for updating a new one. The operation is unnecessary to clamp the saw by a great force for the updating operation.

Abstract: A clamping structure of an electronic device for fastening an electronic device to a host inside of electronic equipment includes a supporting device and a tray. The supporting device has a space, which has a clamping tab, an L-shape orientation member, a guiding tab, and a fixed lock that are disposed therein. The tray is accommodated with an electronic device, the bottom of which has a clamping slot. One side of the tray has a projection and a track projection. The tray is disposed in the space of the supporting device and is moved a predetermined distance. The fixed lock, the guiding tab, the L-shape orientation member, and the clamping tab of the supporting device are respectively clamped to the track projection, the projection and the clamping slot of the tray. Therefore, the electronic device is convenient for assembling, detaching, and maintenance.