Abstract: A testing method for testing an integrated circuit device includes the steps of forming compliant bumps on bonding pads on a substrate of the device such that each of the compliant bumps has a polymeric body formed on a corresponding one of the bonding pads and a metal layer formed on the polymeric body, and such that the metal layer has a probe-contacting surface formed with a plurality of recesses, and testing electrical continuity between the metal layer of each of the compliant bumps and a corresponding circuit of the device by contacting a probe of a testing apparatus with the recessed probe-contacting surface of the metal layer.

Abstract: A pipe cutter includes a first handle and a second handle with a pivotable blade connected thereto which has teeth defined in a lateral side thereof. The second handle has a fixed jaw extending laterally therefrom to which the first handle is pivotally connected. A control member is pivotally connected to the first handle and has an initial pawl extend therefrom so as to engage with the teeth when the blade is not pivoted relative to the fixed jaw. The distal end of the control member has a pawls so as to engage with the teeth when the blade is pivoted toward the fixed jaw. A link mechanism is connected between the blade and the second handle so that when pushing the link mechanism by a cam device extending from the first handle, the blade is pivoted toward the fixed jaw to position a pipe to be cut between the fixed jaw and the blade.