Patents by Inventor Chung-Hwa Feng

Chung-Hwa Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging flip chip and method of forming pre-solders on substrate thereof
    Patent number: 7726544
    Abstract: A method of forming pre-solders on a substrate is provided. Firstly, a substrate is provided. The substrate includes an upper surface and a lower surface. There are several metal circuits and a solder mask both on the upper and the lower surfaces. Each solder mask covers parts of the corresponding metal circuits and parts of the corresponding surface for exposing parts of several pads of the corresponding metal circuits. Then, a patterned photo-resist film is formed on the upper surface. The patterned photo-resist film has several openings for exposing the upper-surface pads. Afterwards, several metal materials are formed in the opening by printing. Thereon, the metal materials are reflown to form several pre-solders on the upper-surface pads. Finally, the patterned photo-resist film is removed.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: June 1, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Jen-Kuang Fang, Chung-Hwa Feng
  • Method of packaging flip chip and method of forming pre-solders on substrate thereof
    Publication number: 20060124703
    Abstract: A method of forming pre-solders on a substrate is provided. Firstly, a substrate is provided. The substrate includes an upper surface and a lower surface. There are several metal circuits and a solder mask both on the upper and the lower surfaces. Each solder mask covers parts of the corresponding metal circuits and parts of the corresponding surface for exposing parts of several pads of the corresponding metal circuits. Then, a patterned photo-resist film is formed on the upper surface. The patterned photo-resist film has several openings for exposing the upper-surface pads. Afterwards, several metal materials are formed in the opening by printing. Thereon, the metal materials are reflown to form several pre-solders on the upper-surface pads. Finally, the patterned photo-resist film is removed.
    Type: Application
    Filed: December 5, 2005
    Publication date: June 15, 2006
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jen-Kuang Fang, Chung-Hwa Feng