Patents by Inventor CHUNG-HYUN LEE

CHUNG-HYUN LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240179541
    Abstract: A method of a first communication node may comprise: transmitting, to a second communication node, an initiation signal indicating to initiate a collection procedure of training data for a neural network; transmitting, to the second communication node, an information signal including network parameters of the first communication node; receiving, from the second communication node, the training data in response to the information signal; training the neural network using the training data; determining optimal network parameters using the trained neural network; and performing communication with the second communication node using the optimal network parameters.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 30, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ji Eun YU, Kwang Myeong YANG, Kyu Yeon LEE, Cha Hyeon EOM, Hyung Je LEE, Chung Yong LEE, Duk Hyun YOU, Hoon Dong NOH
  • Patent number: 11975855
    Abstract: A propulsion module of an air mobility vehicle may include a door provided in the housing and opening or closing the opening portion of the housing by a sliding motion of the door; a propeller for providing propulsion to the air mobility vehicle; a link assembly having a first end portion connected to the housing and a second end portion connected to the propeller to pull the propeller into the internal space of the housing through the opening portion or pull the propeller outside the internal space through the opening portion; and a door opening and closing portion coupled to the door and configured for providing an opening and closing force to the door according to an inward-pulling motion or an outward-pulling motion of the propeller.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: May 7, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Chung Sik Yim, Yong Hyun Nam, Jae Young Choi, Sang Hyun Jung, Dae Hee Lee, Jae Seung Lee, Kyu Hoon Cho
  • Publication number: 20240129766
    Abstract: A throttle control method for a mobile device include collecting input data, generating a first set of user experience indices according to the input data, and checking whether a user experience index of the first set of user experience indices satisfies a UEI threshold. The input data includes common information data, current configuration data and a plurality of throttle control parameters. Each user experience index of the first set of user experience indices is corresponding to at least one of throttle control parameter of the plurality of throttle control parameters.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 18, 2024
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Hung-Yueh Chen, Byeng Hyun Kim, JUNG SHUP SHIN, Shih-Hsin Chen, Chih-Chieh Lai, Chung-Pi Lee, JUNGWOO LEE, Yu-Lun Chang
  • Publication number: 20240120475
    Abstract: The present disclosure relates to a cathode active material for an all-solid-state battery with a controlled particle size and a method for preparing the same. In particular, the cathode active material includes lithium and a transition metal, wherein the cathode active material has a single peak in the range of 1 ?m to 10 ?m as a result of particle size distribution (PSD) analysis.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 11, 2024
    Inventors: Sung Woo NOH, Hong Seok MIN, Sang Heon LEE, Jeong Hyun SEO, Im Sul SEO, Chung Bum LIM, Ju Yeong SEONG, Je Sik PARK
  • Publication number: 20240068044
    Abstract: Provided is a marker composition for predicting the prognosis of cancer and a method for predicting the prognosis of cancer using same and, more particularly, to a marker composition for predicting the prognosis of cancer comprising an agent for measuring an expression level of mRNA or protein thereof of at least one gene selected from the group consisting of ESR1, BEST1, ACTA2, HIPK2, IGSF9, ASCC2, JUN, PPP2R5A, SMAD3, CREBBP, EP300, and DDX5, to a method for predicting the prognosis of cancer using same, and to a method for providing information for determining a strategy for treating cancer.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 29, 2024
    Inventors: Tae Hyun HWANG, Sunho PARK, Jae Ho CHEONG, Sung Hak LEE, Chung-Kang Sam WANG, Ryan Matthew POREMBKA
  • Patent number: 11656186
    Abstract: Disclosed is a method for analyzing a shape of a wafer. The method includes measuring external shapes of a plurality of wafers, detecting a first point having a maximum curvature in an edge region of each wafer from measured values acquired in the measuring the external shapes of the wafers, detecting a second point spaced apart from the first point in a direction towards an apex of a corresponding one of the wafers, measuring a first angle formed between a first line configured to connect the first point and the second point and a front side of the corresponding one of the wafers, forming a thin film layer on a surface of each wafer, measuring a thickness profile of the thin film layer, and confirming a wafer in which a maximum value of the thickness profile of the thin film layer is the smallest among the wafers.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: May 23, 2023
    Assignee: SK SILTRON CO., LTD.
    Inventor: Chung Hyun Lee
  • Publication number: 20220279810
    Abstract: A confectionery product comprising of a layer of gummy confectionery, made up of one or more sections, which coat a non-edible object or container. This container is purposed to house a children's toy and support the layer of confectionery. Methods of preparing the confectionery-coated object also are provided.
    Type: Application
    Filed: August 7, 2020
    Publication date: September 8, 2022
    Inventors: Chung Hyun Lee, David Johnston Smith, Diwata Katrina Dinglasa Santillan, Ethan Luke Harrold, Ethan Hutchinson
  • Publication number: 20220018788
    Abstract: Disclosed is a method for analyzing a shape of a wafer. The method includes measuring external shapes of a plurality of wafers, detecting a first point having a maximum curvature in an edge region of each wafer from measured values acquired in the measuring the external shapes of the wafers, detecting a second point spaced apart from the first point in a direction towards an apex of a corresponding one of the wafers, measuring a first angle formed between a first line configured to connect the first point and the second point and a front side of the corresponding one of the wafers, forming a thin film layer on a surface of each wafer, measuring a thickness profile of the thin film layer, and confirming a wafer in which a maximum value of the thickness profile of the thin film layer is the smallest among the wafers.
    Type: Application
    Filed: October 13, 2020
    Publication date: January 20, 2022
    Inventor: Chung Hyun LEE
  • Patent number: 9905656
    Abstract: Provided is a semiconductor substrate including a seed layer disposed on a substrate, a buffer layer disposed on the seed layer, a plurality of nitride semiconductor layers disposed on the buffer layer, and at least one stress control layer between the plurality of nitride semiconductor layers. The buffer layer includes a plurality of step regions and at least one heterogeneous region. The plurality of step regions includes the same nitride semiconductor material. The heterogeneous region includes a different nitride semiconductor material from the step regions.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: February 27, 2018
    Assignee: SK Siltron Co., Ltd.
    Inventors: Kye-Jin Lee, Ho-Jun Lee, Young-Jae Choi, Jung-Hyun Eum, Chung-Hyun Lee
  • Publication number: 20170141195
    Abstract: Provided is a semiconductor substrate including a seed layer disposed on a substrate, a buffer layer disposed on the seed layer, a plurality of nitride semiconductor layers disposed on the buffer layer, and at least one stress control layer between the plurality of nitride semiconductor layers. The buffer layer includes a plurality of step regions and at least one heterogeneous region. The plurality of step regions includes the same nitride semiconductor material. The heterogeneous region includes a different nitride semiconductor material from the step regions.
    Type: Application
    Filed: January 3, 2017
    Publication date: May 18, 2017
    Inventors: Kye-Jin LEE, Ho-Jun LEE, Young-Jae CHOI, Jung-Hyun EUM, Chung-Hyun LEE
  • Patent number: 9583575
    Abstract: Provided is a semiconductor substrate including a seed layer disposed on a substrate, a buffer layer disposed on the seed layer, a plurality of nitride semiconductor layers disposed on the buffer layer, and at least one stress control layer between the plurality of nitride semiconductor layers. The buffer layer includes a plurality of step regions and at least one heterogeneous region. The plurality of step regions includes the same nitride semiconductor material. The heterogeneous region includes a different nitride semiconductor material from the step regions.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: February 28, 2017
    Assignee: LG SILTRON INC.
    Inventors: Kye-Jin Lee, Ho-Jun Lee, Young-Jae Choi, Jung-Hyun Eum, Chung-Hyun Lee
  • Publication number: 20150357418
    Abstract: Provided is a semiconductor substrate including a seed layer disposed on a substrate, a buffer layer disposed on the seed layer, a plurality of nitride semiconductor layers disposed on the buffer layer, and at least one stress control layer between the plurality of nitride semiconductor layers. The buffer layer includes a plurality of step regions and at least one heterogeneous region. The plurality of step regions includes the same nitride semiconductor material. The heterogeneous region includes a different nitride semiconductor material from the step regions.
    Type: Application
    Filed: January 3, 2014
    Publication date: December 10, 2015
    Applicant: LG SILTRON INC.
    Inventors: Kye-Jin LEE, Ho-Jun LEE, Young-Jae CHOI, Jung-Hyun EUM, Chung-Hyun LEE
  • Patent number: 8879320
    Abstract: A method of programming a multi-level cells (MLC) commonly coupled to a word line in a non-volatile memory device includes shadow-programming first MLC to a first shadow state, shadow-programming second MLC to a second shadow state less than the first shadow state, and then main-programming the first MLC from the first shadow state to a first final state and main-programming the second MLC from the second shadow state to the second final state less than the first final state.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: November 4, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chung-Hyun Lee, Ki-Hwan Choi
  • Publication number: 20130135929
    Abstract: A method of programming a multi-level cells (MLC) commonly coupled to a word line in a non-volatile memory device includes shadow-programming first MLC to a first shadow state, shadow-programming second MLC to a second shadow state less than the first shadow state, and then main-programming the first MLC from the first shadow state to a first final state and main-programming the second MLC from the second shadow state to the second final state less than the first final state.
    Type: Application
    Filed: September 12, 2012
    Publication date: May 30, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: CHUNG-HYUN LEE, KI-HWAN CHOI
  • Patent number: D1009402
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: January 2, 2024
    Assignee: Zuru (Singapore) Pte. Ltd.
    Inventors: Mathew Peter Mowbray, Chung Hyun Lee, David Johnston Smith, Diwata Katrina Dinglasa Santillan, Ethan Luke Harrold, Ethan Hutchinson
  • Patent number: D1012421
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: January 30, 2024
    Assignee: Zuru (Singapore) Pte. Ltd.
    Inventors: Mathew Peter Mowbray, Chung Hyun Lee, David Johnston Smith, Diwata Katrina Dinglasa Santillan, Ethan Luke Harrold, Ethan Hutchinson
  • Patent number: D1023504
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: April 23, 2024
    Assignee: Zuru (Singapore) Pte. Ltd.
    Inventors: Mathew Peter Mowbray, Chung Hyun Lee, David Johnston Smith, Diwata Katrina Dinglasa Santillan, Ethan Luke Harrold, Ethan Hutchinson