Patents by Inventor Chung Hyun Ryu

Chung Hyun Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210207417
    Abstract: The invention relates to a door closer having high usability and capable of saving installation cost. The door closer according to an example embodiment of the inventive concept includes a first closer part combined with a doorframe and a door to provide a rotational force in a direction in which the door is closed, and a second closer part to reduce a rotational speed of the door by a damping force of a viscous fluid contained thereinside when the door is closed by the first closer part.
    Type: Application
    Filed: November 29, 2017
    Publication date: July 8, 2021
    Applicant: SCWINNERS CO., LTD.
    Inventors: Hong Doo KOO, Chung Hyun RYU
  • Publication number: 20200413528
    Abstract: Provided is a memory device. The memory device includes a module board on which one or more semiconductor devices are disposed and a conductive plate mounted on a first side of the module board. The conductive plate includes a shielding region and a non-shielding region. A pad is disposed in the shielding region of the conductive plate.
    Type: Application
    Filed: March 18, 2020
    Publication date: December 31, 2020
    Inventors: Chung Hyun Ryu, In Sub Kwak, Min Woo Gu
  • Patent number: 10679701
    Abstract: A solid state drive (SSD) device includes nonvolatile memory devices, a controller, a main power supply circuit and an auxiliary reprogram device. The controller controls the nonvolatile memory devices. The main power supply circuit provides an operation voltage to the nonvolatile memory devices and the controller using a supply voltage provided through a power line. The auxiliary reprogram device provides an auxiliary supply voltage to the nonvolatile memory devices and the controller and generates a reprogram command. The controller is configured to, if the SSD is not powered, perform periodically at a first period a reprogram operation on the nonvolatile memory devices.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: June 9, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Won Park, Ho-Jin Chun, Chung-Hyun Ryu
  • Patent number: 10306779
    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yu-Sung Kim, Ji-Yong Kim, Chung-Hyun Ryu
  • Patent number: 10181723
    Abstract: Methods of operating a power supply switching circuit including selecting a first power supply signal for provisioning through the power supply switching circuit to a electronic storage device. A current draw can be detected via the first power supply signal that exceeds a predetermined current limit and a second power supply signal can be coupled to the first power supply signal for provisioning through the power supply switching circuit to the electronic storage device responsive to the current draw exceeding the predetermined current limit.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: January 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-Sung Lee, Chung-Hyun Ryu, Sang-Hun Jeon, Jae-Woong Choi, Sang-Sik Heo
  • Patent number: 10120593
    Abstract: A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 6, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-beom Byun, Hu Zhao, Jong-gyu Park, Do-il Kong, Chung-hyun Ryu, Eok-soo Shim
  • Patent number: 10094887
    Abstract: Provided are an auxiliary power supply test method and an electronic apparatus to which the same is applied. The auxiliary power supply test method includes: applying a charging disable signal, which interrupts a charging operation by an auxiliary power supply unit for a predetermined period of time, to the auxiliary power supply unit; monitoring a charging voltage of the auxiliary power supply unit in a time interval in which the charging disable signal is applied to the auxiliary power supply unit; determining whether the auxiliary power supply unit is defective, based on whether the monitored charging voltage is less than a predetermined threshold voltage, wherein the auxiliary power supply unit supplies auxiliary power, obtained based on the charging voltage, to a system power supply line in a case of a sudden power-off.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: October 9, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-sung Lee, Hyoung-taek Lim, Chung-hyun Ryu, Jong-wook Jeong, Su-yong An
  • Patent number: 10050518
    Abstract: A power supply circuit may include a first power converter that may be configured to generate a first inner supply voltage having a first voltage level based on a first external supply voltage and to output the first inner supply voltage to a first node that is coupled to the first node, a second power converter that may be configured to generate a second inner supply voltage having the first voltage level based on a second external supply voltage and to output the second inner supply voltage to a second node that is coupled to the second node, a first diode that may include an anode coupled to the first node and a cathode coupled to the second node, and a second diode that may include an anode coupled to the second node and a cathode coupled to the first node.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: August 14, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyoung-Taek Lim, Chung-Hyun Ryu
  • Publication number: 20180059761
    Abstract: Embodiments include a method of managing power and performance of an electronic device, the method comprising: providing a plurality of capacitors configured to be electrically connected to a power rail of the electronic device to supply auxiliary power to the electronic device when interrupt occurs in input power supplied to the electronic device; monitoring states of the capacitors; and controlling operations of the electronic device based on the results of the monitoring.
    Type: Application
    Filed: April 6, 2017
    Publication date: March 1, 2018
    Inventors: Su-Yong AN, Byung-Ok KANG, Chung-Hyun RYU
  • Patent number: 9894805
    Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: February 13, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Yong Kim, Yu-Sung Kim, Chung-Hyun Ryu, Sung-Ki Lee
  • Publication number: 20170140825
    Abstract: A solid state drive (SSD) device includes nonvolatile memory devices, a controller, a main power supply circuit and an auxiliary reprogram device. The controller controls the nonvolatile memory devices. The main power supply circuit provides an operation voltage to the nonvolatile memory devices and the controller using a supply voltage provided through a power line. The auxiliary reprogram device provides an auxiliary supply voltage to the nonvolatile memory devices and the controller and generates a reprogram command. The controller is configured to, if the SSD is not powered, perform periodically at a first period a reprogram operation on the nonvolatile memory devices.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 18, 2017
    Inventors: JI-WON PARK, HO-JIN CHUN, CHUNG-HYUN RYU
  • Publication number: 20170105290
    Abstract: A substrate support frame includes a body having an upper surface for supporting a first module substrate and a lower surface for supporting a second module substrate, and including a plurality of extending portions that define a cavity for receiving semiconductor devices mounted on first and second module substrates, a curved portion protruding outwardly from a first one of the extending portions of the body corresponding to a position of a flexible substrate that electrically connects the first and second module substrates to each other, the curved portion having a curved sectional shape protruding toward the flexible substrate, and a fastening hole penetrating through the first one of the extending portions of the body and configured to receive a screw to couple the body to at least one of the first and second module substrates.
    Type: Application
    Filed: October 4, 2016
    Publication date: April 13, 2017
    Inventors: Yu-Sung Kim, Ji-Yong Kim, Chung-Hyun Ryu
  • Publication number: 20170105314
    Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
    Type: Application
    Filed: August 5, 2016
    Publication date: April 13, 2017
    Inventors: Ji-Yong Kim, Yu-Sung Kim, Chung-Hyun Ryu, Sung-Ki Lee
  • Publication number: 20170084332
    Abstract: A power supply circuit may include a first power converter that may be configured to generate a first inner supply voltage having a first voltage level based on a first external supply voltage and to output the first inner supply voltage to a first node that is coupled to the first node, a second power converter that may be configured to generate a second inner supply voltage having the first voltage level based on a second external supply voltage and to output the second inner supply voltage to a second node that is coupled to the second node, a first diode that may include an anode coupled to the first node and a cathode coupled to the second node, and a second diode that may include an anode coupled to the second node and a cathode coupled to the first node.
    Type: Application
    Filed: June 29, 2016
    Publication date: March 23, 2017
    Inventors: Hyoung-Taek LIM, Chung-Hyun RYU
  • Publication number: 20170067968
    Abstract: Provided are an auxiliary power supply test method and an electronic apparatus to which the same is applied. The auxiliary power supply test method includes: applying a charging disable signal, which interrupts a charging operation by an auxiliary power supply unit for a predetermined period of time, to the auxiliary power supply unit; monitoring a charging voltage of the auxiliary power supply unit in a time interval in which the charging disable signal is applied to the auxiliary power supply unit; determining whether the auxiliary power supply unit is defective, based on whether the monitored charging voltage is less than a predetermined threshold voltage, wherein the auxiliary power supply unit supplies auxiliary power, obtained based on the charging voltage, to a system power supply line in a case of a sudden power-off.
    Type: Application
    Filed: June 17, 2016
    Publication date: March 9, 2017
    Inventors: Woo-sung Lee, Hyoung-taek Lim, Chung-hyun Ryu, Jong-wook Jeong, Su-yong An
  • Publication number: 20170063082
    Abstract: Methods of operating a power supply switching circuit including selecting a first power supply signal for provisioning through the power supply switching circuit to a electronic storage device. A current draw can be detected via the first power supply signal that exceeds a predetermined current limit and a second power supply signal can be coupled to the first power supply signal for provisioning through the power supply switching circuit to the electronic storage device responsive to the current draw exceeding the predetermined current limit.
    Type: Application
    Filed: June 23, 2016
    Publication date: March 2, 2017
    Inventors: WOO-SUNG LEE, CHUNG-HYUN RYU, SANG-HUN JEON, JAE-WOONG CHOI, SANG-SIK HEO
  • Publication number: 20160342346
    Abstract: A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.
    Type: Application
    Filed: May 20, 2016
    Publication date: November 24, 2016
    Inventors: Jae-beom Byun, Hu Zhao, Jong-gyu Park, Do-il Kong, Chung-hyun Ryu, Eok-soo Shim
  • Patent number: 7757959
    Abstract: The present invention relates to a SiP having reduced influence between a conductor and an antenna, and a method of designing the SiP. The SiP includes an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP, and a first planar conductor having at least one slit formed therein. Therefore, the present invention minimizes the amount of current or electromagnetic field induced on the conductor by the current or electromagnetic field of the antenna, thus reducing the influence of the conductor on the operating characteristics of the antenna.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: July 20, 2010
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Joungho Kim, Gawon Kim, Chung Hyun Ryu
  • Publication number: 20080149736
    Abstract: The present invention relates to a SiP having reduced influence between a conductor and an antenna, and a method of designing the SiP. The SiP includes an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP, and a first planar conductor having at least one slit formed therein. Therefore, the present invention minimizes the amount of current or electromagnetic field induced on the conductor by the current or electromagnetic field of the antenna, thus reducing the influence of the conductor on the operating characteristics of the antenna.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 26, 2008
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Joungho KIM, Gawon KIM, Chung Hyun RYU