Abstract: An intelligent monitoring system for care place is illustrated. The system includes a thermal camera capturing a thermal image of the care place; an image processing unit obtaining user's position and number of user according to region in which temperature is higher than a preset temperature in the thermal image; a temperature recording unit extracting and records user's temperature from the thermal image. When there is only one user, a abnormal event determining unit of the system determines whether an abnormal event occurs according to user's temperature changing rate. When there are several users, the abnormal event determining unit determines whether the abnormal event occurs according to both of the temperature changing rates of the users and an average temperature of the users. If the abnormal event occurs, the warning unit generates a warning signal.

Abstract: A wafer level package structure for temperature sensing elements, which includes a wafer cover and a substrate. The wafer cover is formed of infrared penetrable material. The wafer cover has a plurality of package walls, and the plurality of package walls form a plurality of first grooves and a plurality of second grooves in the wafer cover. The substrate includes a plurality of chip areas, a plurality of soldering areas, and a plurality of pin areas. The plurality of chip areas are disposed a temperature sensing chip respectively and correspond to the plurality of first grooves respectively and the plurality of soldering areas solder with respect to the plurality of package walls, such that the plurality of chip areas and the plurality of first grooves form a plurality of vacuum sealed spaces respectively.

Abstract: A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.

Abstract: A wafer level package structure for temperature sensing elements, which includes a wafer cover and a substrate. The wafer cover is formed of infrared penetrable material. The wafer cover has a plurality of package walls, and the plurality of package walls form a plurality of first grooves and a plurality of second grooves in the wafer cover. The substrate includes a plurality of chip areas, a plurality of soldering areas, and a plurality of pin areas. The plurality of chip areas are disposed a temperature sensing chip respectively and correspond to the plurality of first grooves respectively and the plurality of soldering areas solder with respect to the plurality of package walls, such that the plurality of chip areas and the plurality of first grooves form a plurality of vacuum sealed spaces respectively.

Abstract: A device package method and structure thereof. The method includes steps of: providing a base and a cover, and placing a sensing device on the bottom of cavity base; placing sealant between the cover and edge part of the base, and then covering the cover on the base; irradiating a laser on the edge part for melting the sealant, so as to bond the cover and edge part; and enabling the sealed space formed between the cover and the cavity base to be in vacuum. Therefore, sensing element with high sensitivity can be packaged and manufactured efficiently.

Abstract: An intelligent monitoring system for care place is illustrated. The system includes a thermal camera capturing a thermal image of the care place; an image processing unit obtaining user's position and number of user according to region in which temperature is higher than a preset temperature in the thermal image; a temperature recording unit extracting and records user's temperature from the thermal image. When there is only one user, a abnormal event determining unit of the system determines whether an abnormal event occurs according to user's temperature changing rate. When there are several users, the abnormal event determining unit determines whether the abnormal event occurs according to both of the temperature changing rates of the users and an average temperature of the users. If the abnormal event occurs, the warning unit generates a warning signal.

Abstract: A care service transaction method and system thereof. The method includes the following steps: first, a thermal camera and a control apparatus are disposed in a care place. Health data of the user is then received, and a care condition is determined based on the health data, and a transaction amount is determined based on the care condition. The control apparatus is set to control the thermal camera based on the care condition, upon reception of paid information. Therefore, the user can buy suitable intelligent care service, such as care in various time periods, various areas or various care levels, upon his/her demand.

Abstract: A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.

Abstract: A laser lighting device, including a laser light source and a light pipe, is disclosed. The laser light source can produce a laser beam with a diffusion angle not larger than 30 degrees. The light pipe is disposed in a light path of the laser beam, and has a light incident surface, a light exiting surface and several cut planes. The light incident surface is opposite to the laser light source, and the cut planes are located between the light incident and light exiting surfaces. Each of the cut planes is normal to the longitudinal direction of the light pipe, and has an area smaller than that of the light exiting surface but larger than that of the light incident surface. The areas of the cut planes increase sequentially along the longitudinal direction. The laser beam will be effectively collimated by the light pipe after passing through the light pipe.

Abstract: A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.

Abstract: A light guide plate with an adjustable illumination angle and an illumination device using the same are provided. The light guide plate has a first surface and a second surface opposite to the first surface. The second surface further has a plurality of deformable microstructures thereon. The deformable microstructures will be deformed when an external force is applied to the deformable microstructures. The illumination device has a light source and a light guide plate that is disposed next to the light source. A light beam emitted from the light source enters into the light guide plate and leaves the light guide plate via reflecting or refracting by the deformable microstructures. By applying a different external force to the light guide plate, the deformation of the deformable microstructures will be varied. Therefore, the illumination angle of the light beam could be changed according to the deformation of the deformable microstructures.

Abstract: A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.

Abstract: A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode component and an encapsulation layer. The encapsulation layer is disposed surrounding the light emitting diode component. The encapsulation layer comprises an encapsulation gel layer and a plurality of micro-particles distributed in the encapsulation gel layer. The difference between the refractive index of the encapsulation gel layer and the refractive index of the micro-particles is smaller than or equal to 0.05.

Abstract: A device and method, which are utilized in an optical apparatus, for protecting eyes are disclosed. The optical apparatus includes a scanning-mirror component and a visible light source which is optically coupled to the scanning-mirror component. The optical apparatus emits a visible light beam to the scanning-mirror component by using the visible light source. The scanning-mirror component then reflects the visible light beam to emit the visible light beam to a scanning region. The device and the method for protecting eyes can determine at least one eye region in the scanning region, and then make the optical apparatus stop emitting the visible light beam at least within the eye region.

Abstract: A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.

Abstract: A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The adhesive layer is disposed between the electrode portion and the circuit portion to form an electrical connection therebetween. The adhesive layer is a material, which comprises a metal compound, with a Negative Coefficient of Thermal Expansion (Negative CTE). Because of the material with a Negative CTE, the alignment shift can be avoided after the chip and the substrate are adhered together.

Abstract: A light guide plate with an adjustable illumination angle and an illumination device using the same are provided. The light guide plate has a first surface and a second surface opposite to the first surface. The second surface further has a plurality of deformable microstructures thereon. The deformable microstructures will be deformed when an external force is applied to the deformable microstructures. The illumination device has a light source and a light guide plate that is disposed next to the light source. A light beam emitted from the light source enters into the light guide plate and leaves the light guide plate via reflecting or refracting by the deformable microstructures. By applying a different external force to the light guide plate, the deformation of the deformable microstructures will be varied. Therefore, the illumination angle of the light beam could be changed according to the deformation of the deformable microstructures.

Abstract: A light emitting diode (LED) is provided. The LED comprises a semiconductor composite layer stacked laterally and a phosphor substrate. The phosphor substrate covers a lateral surface of the semiconductor composite layer.

Abstract: A light emitting diode device is provided. The light emitting diode device comprises a light emitting diode element, an encapsulation layer, and a plurality of pillars. The encapsulation layer is disposed on the light emitting diode element, and the pillars are disposed on the encapsulation layer. The pillars are formed by a light transmissible material.