Abstract: Substantilly fully imidized polyimidesiloxanes which are based on a mixture consisting essentially of a biphenyl tetracarboxylic dianhydride and a benzophenone tetracarboxylic dianhydride, are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from the mixture of dianhydrides, a difunctional siloxane monomer and an organic diamine. Diamines can be used to provide an asymmetrical structure in the polyimidesiloxane polymer chain. The polyimidesiloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable. The products of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.

Abstract: There is provided a siloxane-imide copolymer composition having at least one polymeric block with a low glass transition temperature and at least one polymeric block with a high glass transition temperature.

Abstract: There is provided a siloxane-imide copolymer composition having at least one polymeric block with a low glass transition temperature and at least one polymeric block with a high glass transition temperature.

Abstract: The fast crystallizing polyalkyleneterephthalate resin compositions disclosed herein contain 0.05-4 percent by weight of a sodium salt of a hydrocarbon acid having the formula R.degree.(COO).sub.y Na.sub.z wherein R.degree. is a hydrocarbon group having a valency of y and having 1-25 carbon atoms therein, preferably 1-10 carbon atoms, y is an integer having a value of at least one, advantageously 1-10 and preferably 1-3, and z is an integer having a value of at least one and no greater than the value of y, this sodium salt of the hydrocarbon acid being in the form of a complex with a polymeric compound, which contains at least two recurring units of the formula --CH.sub.2 CH.sub.2 O--, together with reinforcing agents, fillers and/or additives and optionally a flow promoter selected from low molecular weight organic esters or polymers containing a recurring structure of [(CH.sub.2).sub.x O--].sub.

Abstract: There is provided a crystalline silicone-imide block copolymer comprising at least one imide-disiloxane block, wherein the imide portion of said imide-disiloxane block has a symmetrical aromatic radical as its nucleus, and at least one polydiorganosiloxane has at least about five siloxy units.

Abstract: The resins described herein are polyimide-epoxy thermoset resins prepared by reacting a polyepoxide in two steps, first with a solution of a polyimide dianhydride and subsequently with a polyimide diamine, there being enough polyepoxide added initially to react completely with all the anhydride groups and preferably enough polyepoxide added initially to react with both the anhydride and amide groups. "Polyimide dianhydride" is an anhydride-terminated polyimide and "polyimide diamine" is an amine-terminated polyimide as represented by the respective formulas: ##STR1## and ##STR2## wherein Ar', Ar and n are as defined hereinafter. For use in the present compositions, the polyimide dianhydride has an anhydride activity of at least 0.17 as defined herein, and the ratio of epoxy equivalent to anhydride plus amine equivalents is at least 1/1.

Abstract: The compositions disclosed herein comprise a mixture of:(1) An unsaturated polyester resin; such as the polymeric ester of maleic acid or anhydride and a glycol such as ethylene glycol; and(2) The reaction product of a polyepoxy compound, such as the diglycidyl ether of bisphenol-A, and an unsaturated monocarboxylic acid, such as acrylic or methacrylic acid, in which reaction product there remains unreacted at the time of mixing with said polyester resin at least 5 percent of the original epoxy groups of said polyepoxy compound.This mixture when molded or cured gives improvement with respect to thermal and humid aging as compared to similar compositions in which the epoxy groups of said reaction product are substantially all reacted prior to mixture with said unsaturated polyester resin. The flexural strength, in particular, of the compositions are better retained on aging without adverse effect on other properties.

Abstract: The fast crystallizing polyalkyleneterephthalate resin compositions disclosed herein contain 0.05-4 percent by weight of lithium bromide, chloride or iodide in the form of a selected complex of the lithium halide (LiX) and an organic compound, such as a polymeric compound, which contains at least two recurring units of the formula --CH.sub.2 CH.sub.2 O-- together with reinforcing agents, fillers and/or additives and optionally a flow promoter selected from low molecular weight organic esters or block copolymers containing a recurring structure of [(CH.sub.2).sub.x O--].sub.m wherein x is an integer of no more than 5 and m is an integer ranging from 2, preferably from 200 to about 5,000. The amount of complex is such as to give 0.05 to 4 percent, preferably 0.1-2 percent by weight of LiX based on the weight of polyalkyleneterephthalate.

Abstract: The process described herein comprises the preparation of polyimides by the reaction of aromatic dianhydrides and aromatic diisocyanates in the presence of a metal acetylacetonate, such as Al, Co, Fe, Ni, Zr, etc. By using appropriate proportions, the polyimides may be end-capped with either anhydride or isocyanate groups. The use of the acetylacetonate permits the use of lower temperatures for imide ring closure thereby avoiding undesirable coreaction between anhydride groups and certain solvents. "Polyimide dianhydride" is an anhydride-terminated polyimide; and "polyimide diisocyanate" is an isocyanate-terminated polyimide as represented by the respective formulas: ##STR1## wherein Ar', Ar and n are as defined hereinafter. By this process, the polyimide dianhydride product has an anhydride activity of at least 0.17 as defined herein regardless of the type of solvent used.

Abstract: The resins described herein are polyimide-epoxy thermoset resins prepared by reacting a polyepoxide with a solution of an admixture of a polyimide dianhydride with another polyimide component, either a polyimide dianhydride or a polyimide diamine, at least one of which polyimide components is insoluble in the particular solvent in the absence of the other polyimide component or components. "Polyimide dianhydride" is an anhydride-terminated polyimide and "polyimide diamine" is an amine-terminated polyimide as represented by the respective formulas: ##STR1## wherein Ar', Ar and n are as defined hereinafter. For use in the present compositions, the polyimide dianhydride has an anhydride activity of at least 0.17 as defined herein, and the ratio of epoxy equivalent to anhydride plus amine equivalents is at least 1/1.

Abstract: The fast crystallizing polyalkyleneterephthalate resin compositions disclosed herein contain 0.05-4 percent by weight of NaSCN in the form of a selected complex of sodium thiocyanate (NaSCN) and an organic compound, such as a polymeric compound, which contains at least two recurring units of the formula -CH.sub.2 CH.sub.2 O- together with reinforcing agents, fillers and/or additives and optionally a flow promoter selected from low molecular weight organic esters or block copolymers containing a recurring structure of [(CH.sub.2).sub.x O--].sub.m wherein x is an integer of no more than 5 and m is an integer ranging from 2, preferably from 200 to about 5,000. The amount of complex is such as to give 0.05 to 4 percent, preferably 0.1-2 percent by weight of NaSCN based on the weight of polyalkyleneterephthalate.

Abstract: The fast crystallizing polyalkyleneterephthalate resin compositions disclosed herein contain 0.025-2 percent by weight of NaI in the form of a selected complex of sodium iodide (NaI) and an organic compound, such as a polymeric compound, which contains at least two recurring units of the formula --CH.sub.2 CH.sub.2 O-- together with reinforcing agents, fillers and/or additives and optionally a flow promoter selected from low molecular weight organic esters or block copolymers containing a recurring structure of [(CH.sub.2).sub.x O--].sub.m wherein x is an integer of no more than 5 and m is an integer ranging from 2, preferably from 200 to about 5,000. The amount of complex is such as to give 0.025-2 percent, preferably 1-2 percent by weight of NaI based on the weight of polyalkyleneterephthalate.

Abstract: The compositions disclosed herein comprise blends of polyethyleneterephthalate (PET) having improved impact strength and heat resistance without any sacrifice of other properties such as flexural strength, humidity resistance, low mold shrinkage, etc. These compositions comprise ternary blends of 30-95 percent, preferably 35-95 percent by weight of PET, 1-30 percent, preferably 3-15 percent by weight of an aromatic polycarbonate (PC); and 1-12, preferably 2.5-10 percent of a copolyester of terephthalic acid with ethylene glycol and cyclohexane-1,4-dimethanol.