Abstract: A heat dissipating system includes a wind tunnel, a first electronic element, and a second electronic element. The wind tunnel defines a top air inlet channel and a separated bottom, and a top air discharging channel and a separated bottom air discharging channel. Air entering the bottom air inlet channel dissipates heat produced by the first electronic element to the top air discharging channel, to flow out of the wind tunnel. Air entering the top air inlet channel flows to the bottom air discharging channel to dissipate heat produced by the second electronic element, this arrangement avoids heated air from one element being exhausted onto another element.

Abstract: A heat dissipating system includes a wind tunnel, a first electronic element, and a second electronic element. The wind tunnel defines a top air inlet channel and a separated bottom, and a top air discharging channel and a separated bottom air discharging channel. Air entering the bottom air inlet channel dissipates heat produced by the first electronic element to the top air discharging channel, to flow out of the wind tunnel. Air entering the top air inlet channel flows to the bottom air discharging channel to dissipate heat produced by the second electronic element, this arrangement avoids heated air from one element being exhausted onto another element.

Abstract: An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.

Abstract: An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.

Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.

Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.

Abstract: A heat dissipation module includes a heat sink. A plurality of grooves are defined in a bottom surface of the heat sink, a heat pipe is accommodated in each groove of the heat sink, and a heat conducting pad made of phase change material is adhered to the bottom surface of the heat sink to cover the grooves and the heat pipes. The heat conducting pad is a solid material at an ambient room temperature. When heated to a temperature higher than a transition temperature of the heat conducting pad, the heat conducting pad softens to fill spaces between the heat conducting pad, the heat sink, and the heat pipes.