Patents by Inventor Chung-Jen Tsai
Chung-Jen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113071Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
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Publication number: 20240100352Abstract: A phototherapy device includes a base, at least one light conversion device and a light source module. The base has an installation slot. The light conversion device is detachably arranged in the installation slot. Each light conversion device includes a plurality of light conversion patterns. The light source module is arranged on a side of the base and configured to provide an excitation beam to the light conversion patterns, so that each of the light conversion patterns emits a converted beam. In this way, the light conversion device of the phototherapy device can be replaced according to the user's needs.Type: ApplicationFiled: September 19, 2023Publication date: March 28, 2024Inventors: CHUNG-JEN OU, YU-MIN CHEN, MING-WEI TSAI, CHIEN-CHIH CHEN
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Patent number: 8300420Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.Type: GrantFiled: May 24, 2009Date of Patent: October 30, 2012Assignee: Zhen Ding Technology Co., Ltd.Inventors: Chung-Jen Tsai, Hung-Yi Chang, Chia-Cheng Chen, Meng-Chieh Hsu, Cheng-Hsien Lin
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Patent number: 8227175Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.Type: GrantFiled: May 17, 2009Date of Patent: July 24, 2012Assignee: Zhen Ding Technology Co., Ltd.Inventors: Chung-Jen Tsai, Yu-Cheng Huang, Hung-Yi Chang, Cheng-Hsien Lin
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Patent number: 8067696Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.Type: GrantFiled: February 20, 2009Date of Patent: November 29, 2011Assignee: Zhen Ding Technology Co., Ltd.Inventors: Chung-Jen Tsai, Chia-Cheng Chen, Hung-Yi Chang, Tung-Yao Kuo, Cheng-Hsien Lin
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Patent number: 7799603Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.Type: GrantFiled: May 14, 2009Date of Patent: September 21, 2010Assignee: Foxconn Advanced Technology Inc.Inventors: Chung-Jen Tsai, Chia-Cheng Chen, Hung-Yi Chang, Tung-Yao Kuo, Cheng-Hsien Lin
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Publication number: 20100051332Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.Type: ApplicationFiled: May 24, 2009Publication date: March 4, 2010Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: CHUNG-JEN TSAI, HUNG-YI CHANG, CHIA-CHENG CHEN, MENG-CHIEH HSU, CHENG-HSIEN LIN
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Publication number: 20100051331Abstract: A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.Type: ApplicationFiled: May 19, 2009Publication date: March 4, 2010Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: CHUNG-JEN TSAI, HUNG-YI CHANG, CHIA-CHENG CHEN, CHENG-HSIEN LIN
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Publication number: 20100044237Abstract: A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled.Type: ApplicationFiled: April 19, 2009Publication date: February 25, 2010Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: CHUNG-JEN TSAI, YU-CHENG HUANG, HUNG-YI CHANG, CHENG-HSIEN LIN
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Publication number: 20100038116Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.Type: ApplicationFiled: February 20, 2009Publication date: February 18, 2010Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: CHUNG-JEN TSAI, CHIA-CHENG CHEN, HUNG-YI CHANG, TUNG-YAO KUO, CHENG-HSIEN LIN
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Publication number: 20100035187Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.Type: ApplicationFiled: May 17, 2009Publication date: February 11, 2010Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: Chung-Jen Tsai, Yu-Cheng Huang, Hung-Yi Chang, Cheng-Hsien Lin
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Publication number: 20100003784Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.Type: ApplicationFiled: May 14, 2009Publication date: January 7, 2010Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: CHUNG-JEN TSAI, CHIA-CHENG CHEN, HUNG-YI CHANG, TUNG-YAO KUO, CHENG-HSIEN LIN