Patents by Inventor Chung Ju YU

Chung Ju YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and method of manufacturing the same
    Patent number: 11811957
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: November 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Chung Ju Yu, Jui-Hsien Wang, Chai-Chi Lin, Hong Jie Chen
  • ELECTRONIC PACKAGE
    Publication number: 20230216174
    Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chung Ju YU, Shao-Lun YANG, Chun-Hung YEH, Hong Jie CHEN, Tsung-Wei LU, Wei Shuen KAO
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220377161
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Chung Ju YU, Jui-Hsien WANG, Chai-Chi LIN, Hong Jie CHEN
  • SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
    Publication number: 20220373670
    Abstract: At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically connected to the detecting module. The control module is configured to receive a signal from the detecting module and to control the wearable device in response to the signal.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 24, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Chung Ju YU, Wei-Fan WU, Chai-Chi LIN, Hong Jie CHEN