Patents by Inventor Chung-Jun Chu

Chung-Jun Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8431837
    Abstract: A waterproof jacket assembly applied in a communication device is disclosed. The communication device includes an enclosure defining a first through hole for a transmission wire passing through. The waterproof jacket assembly is mounted on the enclosure corresponding to the first through hole, and includes a sleeve, an elastic waterproof element and a cover board. The sleeve defines a receiving cavity in communication with the first through hole. The elastic waterproof element is received in the receiving cavity and helically wrapped around the transmission wire. The transmission wire passes through the cover board and the cover board engages with the sleeve to drive the elastic waterproof element to fill in the receiving cavity.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: April 30, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chung-Jun Chu
  • Patent number: 8313273
    Abstract: A hook assembly comprises a body, a securing portion, a hanging portion, a connection portion and a pair of arc-shaped wings. The securing portion and the hanging portion are respectively extending from two opposite sides of the body. The securing portion comprises an extending portion and a hook portion parallel with the body. The extending portion is extending between the body and the hook portion. The connection portion is extending from the body, the wings are respectively extending from two opposite sides of the connection portion. Junction portions between the connection portion and the body and between the wings and the connection portion are cut, and the connection portion and the pair of the wings are respectively folded along corresponding junction portions resulting in the connection portion with the pair of wings together defining a receiving space to receive the body and the securing portion.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: November 20, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chung-Jun Chu
  • Patent number: 8276655
    Abstract: A heat conducting apparatus adopts a design of two oblique slide blocks disposed between and contacted with two objects for conducting heat from one of the two objects to another. The two oblique slide blocks can be adjusted freely according to the different heights of the two objects to conduct the heat produced by a heat generating component to a heat dissipating structure.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: October 2, 2012
    Assignee: Chemtron Research LLC
    Inventor: Chung-Jun Chu
  • Publication number: 20120228450
    Abstract: A hook assembly comprises a body, a securing portion, a hanging portion, a connection portion and a pair of arc-shaped wings. The securing portion and the hanging portion are respectively extending from two opposite sides of the body. The securing portion comprises an extending portion and a hook portion parallel with the body. The extending portion is extending between the body and the hook portion. The connection portion is extending from the body, the wings are respectively extending from two opposite sides of the connection portion. Junction portions between the connection portion and the body and between the wings and the connection portion are cut, and the connection portion and the pair of the wings are respectively folded along corresponding junction portions resulting in the connection portion with the pair of wings together defining a receiving space to receive the body and the securing portion.
    Type: Application
    Filed: July 5, 2011
    Publication date: September 13, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHUNG-JUN CHU
  • Publication number: 20110255247
    Abstract: A heat sink assembly with shielding frame is mounted on a circuit board and includes a heat sink, a shielding frame and a heat transmitting film. The circuit board comprises at least one electronic component and a plurality of latching slots surrounding the electronic component. The heat sink includes a base and a plurality of heat fins extending upwardly from the base. A plurality of slots are defined between the plurality of heat fins. The shielding frame includes a hollow frame, a plurality of latch portions and a plurality of limitation portions. The plurality of latch portions are disposed on one end of the hollow frame and evenly spaced apart from each other. The plurality of limitation portions extend from the other end of the hollow frame. The shielding frame cooperates with the heat sink to shield the electronic component from electromagnetic interference (EMI).
    Type: Application
    Filed: August 9, 2010
    Publication date: October 20, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chung-Jun CHU
  • Publication number: 20110226526
    Abstract: A waterproof jacket assembly applied in a communication device is disclosed. The communication device includes an enclosure defining a first through hole for a transmission wire passing through. The waterproof jacket assembly is mounted on the enclosure corresponding to the first through hole, and includes a sleeve, an elastic waterproof element and a cover board. The sleeve defines a receiving cavity in communication with the first through hole. The elastic waterproof element is received in the receiving cavity and helically wrapped around the transmission wire. The transmission wire passes through the cover board and the cover board engages with the sleeve to drive the elastic waterproof element to fill in the receiving cavity.
    Type: Application
    Filed: November 29, 2010
    Publication date: September 22, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHUNG-JUN CHU
  • Patent number: 7845395
    Abstract: A heat-dissipating casing structure includes a base seat, a heat-dissipating module, and a casing. The heat-dissipating module is disposed on the base seat. The heat-dissipating module has a first heat-conducting block and a heat pipe, and one side of the heat pipe connects to the first heat-conducting block. The casing has an installed portion, and the casing is slidably assembled on the base seat for connecting the other side of the heat pipe with the casing via the installed portion. When the casing is slidably assembled on the base seat, the heat pipe is connected with the casing via the installed portion. Hence, the heat-dissipating module is assembled and replaced easily and rapidly. Moreover, the heat from a heat-generating element on the base seat is transmitted to the casing through the heat pipe for increasing heat-dissipating efficiency.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: December 7, 2010
    Assignee: Cooler Master Co., Ltd.
    Inventor: Chung-Jun Chu
  • Publication number: 20090229808
    Abstract: A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved.
    Type: Application
    Filed: January 7, 2009
    Publication date: September 17, 2009
    Inventor: Chung-Jun CHU
  • Publication number: 20090159240
    Abstract: A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 25, 2009
    Inventor: Chung-Jun CHU
  • Publication number: 20090101324
    Abstract: A heat conducting apparatus adopts a design of two oblique slide blocks disposed between and contacted with two objects for conducting heat from one of the two objects to another. The two oblique slide blocks can be adjusted freely according to the different heights of the two objects to conduct the heat produced by a heat generating component to a heat dissipating structure.
    Type: Application
    Filed: August 28, 2008
    Publication date: April 23, 2009
    Inventor: Chung-Jun CHU
  • Publication number: 20090009969
    Abstract: A heat-dissipating casing structure includes a base seat, a heat-dissipating module, and a casing. The heat-dissipating module is disposed on the base seat. The heat-dissipating module has a first heat-conducting block and a heat pipe, and one side of the heat pipe connects to the first heat-conducting block. The casing has an installed portion, and the casing is slidably assembled on the base seat for connecting the other side of the heat pipe with the casing via the installed portion. When the casing is slidably assembled on the base seat, the heat pipe is connected with the casing via the installed portion. Hence, the heat-dissipating module is assembled and replaced easily and rapidly. Moreover, the heat from a heat-generating element on the base seat is transmitted to the casing through the heat pipe for increasing heat-dissipating efficiency.
    Type: Application
    Filed: July 2, 2007
    Publication date: January 8, 2009
    Applicant: COOLER MASTER CO., LTD.
    Inventor: CHUNG-JUN CHU