Patents by Inventor Chung-Kai CHENG
Chung-Kai CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11964881Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.Type: GrantFiled: July 27, 2020Date of Patent: April 23, 2024Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Pu-Wei Wu, Yi-Chieh Hsieh, Han-Yi Wang, Kuang-Chih Tso, Tzu-Ying Chan, Chung-Kai Chang, Chi-Shih Chen, Yu-Ting Cheng
-
Patent number: 11319410Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: GrantFiled: January 11, 2018Date of Patent: May 3, 2022Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu Huang, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng
-
Patent number: 11198792Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.Type: GrantFiled: July 14, 2017Date of Patent: December 14, 2021Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Kai Cheng, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Po-Yu Huang, Shun-Jen Chiang
-
Patent number: 11034797Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.Type: GrantFiled: March 30, 2018Date of Patent: June 15, 2021Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Meng-Yen Chou, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
-
Publication number: 20210079161Abstract: The present disclosure relates to a polyimide precursor composition comprising an antic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.Type: ApplicationFiled: November 23, 2020Publication date: March 18, 2021Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Meng-Yen CHOU, Chung-Jen WU, Chang-Hong HO, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
-
Patent number: 10731004Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.Type: GrantFiled: November 30, 2017Date of Patent: August 4, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chang-Hong Ho, Chung-Jen Wu, Meng-Yen Chou, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
-
Patent number: 10696793Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.Type: GrantFiled: August 15, 2019Date of Patent: June 30, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Ghiang, Po-Yu Huang, Chung-Kai Cheng
-
Patent number: 10626220Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: GrantFiled: November 29, 2017Date of Patent: April 21, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Chang-Hong Ho, Chung-Jen Wu, Meng-Yen Chou, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
-
Patent number: 10590305Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.Type: GrantFiled: June 29, 2017Date of Patent: March 17, 2020Assignee: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu Huang, Chih-Min An, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng
-
Publication number: 20200055986Abstract: The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.Type: ApplicationFiled: August 15, 2019Publication date: February 20, 2020Applicant: ETERNAL MATERIALS CO., LTD.Inventors: CHUNG-JEN WU, MENG-YEN CHOU, CHANG-HONG HO, SHUN-JEN GHIANG, PO-YU HUANG, CHUNG-KAI CHENG
-
Publication number: 20180282577Abstract: The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.Type: ApplicationFiled: July 14, 2017Publication date: October 4, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Chung-Kai CHENG, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Po-Yu HUANG, Shun-Jen CHIANG
-
Publication number: 20180282482Abstract: The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.Type: ApplicationFiled: March 30, 2018Publication date: October 4, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Meng-Yen CHOU, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng
-
Publication number: 20180194899Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: ApplicationFiled: January 11, 2018Publication date: July 12, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu HUANG, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Shun-Jen CHIANG, Chung-Kai CHENG
-
Publication number: 20180148541Abstract: The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P?, D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.Type: ApplicationFiled: November 30, 2017Publication date: May 31, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Chang-Hong HO, Chung-Jen WU, Meng-Yen CHOU, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
-
Publication number: 20180148544Abstract: The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1?): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.Type: ApplicationFiled: November 29, 2017Publication date: May 31, 2018Applicant: ETERNAL MATERIAL CO., LTD.Inventors: Chang-Hong HO, Chung-Jen WU, Meng-Yen CHOU, Shun-Jen CHIANG, Po-Yu HUANG, Chung-Kai CHENG
-
Publication number: 20180002567Abstract: A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.Type: ApplicationFiled: June 29, 2017Publication date: January 4, 2018Applicant: ETERNAL MATERIALS CO., LTD.Inventors: Po-Yu HUANG, Chih-Min AN, Chung-Jen WU, Meng-Yen CHOU, Chang-Hong HO, Shun-Jen CHIANG, Chung-Kai CHENG