Patents by Inventor CHUNG-KAI HSU

CHUNG-KAI HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240172273
    Abstract: Examples pertaining to preamble puncturing negotiation in wireless communications are described. A station (STA) may receive a control frame, and, in response, apply the MRU pattern for one or more transmissions or receptions in a transmission opportunity (TXOP). In the control frame, either a plurality of first reserved bits in a SERVICE field or a plurality of bits in a User Info field are set to indicate a multiple resource unit (MRU) pattern regarding preamble puncturing.
    Type: Application
    Filed: November 15, 2023
    Publication date: May 23, 2024
    Inventors: Cheng-Yi Chang, Kun-Sheng Huang, Yi-Hsuan Chung, Chung-Kai Hsu, Chia-Hsiang Chang, Kai Ying Lu
  • Patent number: 9010406
    Abstract: A heat dissipation module includes a fan, a heat sink and a heat pipe. The fan defines an air outlet at one side thereof. The duct extends from the fan and away from the air outlet. The duct includes a first open end communicating with the fan and a second open end adjacent to a heat generating component. The located is located at the air outlet of the fan. The heat pipe thermally interconnects the heat sink and the heat generating component. The duct guides a part of airflow generated by the fan to the heat generating component during operation of the fan.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Yu-Hsuan Wang, Chung-Kai Hsu, Chia-Yang Liu
  • Publication number: 20130168047
    Abstract: A heat dissipation module includes a fan, a heat sink and a heat pipe. The fan defines an air outlet at one side thereof. The duct extends from the fan and away from the air outlet. The duct includes a first open end communicating with the fan and a second open end adjacent to a heat generating component. The located is located at the air outlet of the fan. The heat pipe thermally interconnects the heat sink and the heat generating component. The duct guides a part of airflow generated by the fan to the heat generating component during operation of the fan.
    Type: Application
    Filed: March 29, 2012
    Publication date: July 4, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YU-HSUAN WANG, CHUNG-KAI HSU, CHIA-YANG LIU