Patents by Inventor Chung-Kai Hung

Chung-Kai Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240406093
    Abstract: A method of determining routing path for a TSN system includes determining a plurality of candidate disjoint path pairs of each of a first plurality of streams according to a network topology; initializing a plurality of final routing path pairs used for the first plurality of streams and a plurality of background streams according to a first plurality of lengths of the first plurality of candidate disjoint path pairs; selecting a plurality of temporary routing path pairs used for the first plurality of streams and the plurality of background streams according to the first plurality of parameters; updating the first plurality of parameters according to the plurality of temporary routing path pairs; and replacing the plurality of temporary routing path pairs with the plurality of final routing path pairs in response to the plurality of temporary routing path pairs being better than the plurality of final routing path pairs.
    Type: Application
    Filed: November 29, 2023
    Publication date: December 5, 2024
    Applicant: Moxa Inc.
    Inventors: Ching-Chih Chuang, Yuan-Yao Shih, Chung-Kai Hung, Ai-Chun Pang, Chung-Wei Lin
  • Publication number: 20020148974
    Abstract: The present invention is a kind of wafer improved thermal desorption system. Mainly, a fixed infrared heating source is supplemental attached to a heating chamber with fixed type, also, and a fixed heat reflection mask is equipped at the bottom place of the fixed heating chamber respectively. Furthermore, the invent which a contact area between heating chamber and wafer and an air detracted device supplemental attached at one terminal of carrier gas to connect with the wafer thermal desorption chamber and adsorbent tube for collecting these substances to be analyzing. Thus, the invention can adapt with different brands of thermal desorption instruments, Thermal Desorption-Gas Chromatographic-Mass Spectroscopy (TD/GC/MS), and so on, for proceeding the analysis the micro contamination on the surface of wafer.
    Type: Application
    Filed: February 26, 2001
    Publication date: October 17, 2002
    Inventors: Chung-Kai Hung, Tsong-Hsueh Wu, Feng-Tsair Wang, Wen-Ching Wei