Patents by Inventor CHUNG-KAI SHYU

CHUNG-KAI SHYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK, MANUFACTURING METHOD THEREOF AND TESTING METHOD OF HEAT-DISSIPATING CAPABILITY
    Publication number: 20140060790
    Abstract: An exemplary heat sink includes a heat-conducting substrate and a heat-conducting film formed on an outer surface of the substrate. A heat resistance of the heat-conducting film is lower than that of the heat-conducting substrate. A heat conductivity coefficient of the heat-conducting film is higher than that of the heat-conducting film. The heat-conducting film is thinner than the heat-conducting substrate, and a thickness of the heat-conducting film is in a range from about 0.025 mm to about 0.05 mm.
    Type: Application
    Filed: October 11, 2012
    Publication date: March 6, 2014
    Inventors: CHUNG-KAI SHYU, MING-HSIU CHUNG