Patents by Inventor Chung-Kai Wang
Chung-Kai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964881Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.Type: GrantFiled: July 27, 2020Date of Patent: April 23, 2024Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Pu-Wei Wu, Yi-Chieh Hsieh, Han-Yi Wang, Kuang-Chih Tso, Tzu-Ying Chan, Chung-Kai Chang, Chi-Shih Chen, Yu-Ting Cheng
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Patent number: 11946771Abstract: An aerial vehicle including a body, a first ranging device, a second ranging device and a controller is provided. The first ranging device is disposed on the body and is configured to detect a first distance between the first ranging device and the reflector. The second ranging device is disposed on the body and is configured to detect a second distance between the second ranging device and the reflector. The controller is configured to obtain an included angle between a direction of the body and the reflector according to the first distance and the second distance.Type: GrantFiled: April 1, 2020Date of Patent: April 2, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yuan-Chu Tai, Chung-Hsien Wu, Yu-Kai Wang
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Patent number: 11943939Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.Type: GrantFiled: January 4, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Meng-Kai Hsu, Jerry Chang Jui Kao, Chin-Shen Lin, Ming-Tao Yu, Tzu-Ying Lin, Chung-Hsing Wang
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Publication number: 20240088033Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.Type: ApplicationFiled: March 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chao-Kai Chan, Chung-Hao Tsai, Chuei-Tang WANG, Wei-Ting Chen
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Patent number: 11742295Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.Type: GrantFiled: December 28, 2020Date of Patent: August 29, 2023Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Hao Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Chia-Hsiang Chang, Tsai-Ming Yang, Yen-Chung T. Chen, Ting-Hsu Chien, Yuan-Hung Lin, Chao-Ching Huang, Li-Ya Tseng, Pei Yu, Jia-Liang Chen, Yen-Wei Chen, Chung-Kai Wang, Chun-Hsu Chen, Yu-Ju Chang, Li-Hua Lin, Zanyu Yang
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Publication number: 20220208684Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.Type: ApplicationFiled: December 28, 2020Publication date: June 30, 2022Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Hao Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Chia-Hsiang Chang, Tsai-Ming Yang, Yen-Chung T. Chen, Ting-Hsu Chien, Yuan-Hung Lin, Chao-Ching Huang, Li-Ya Tseng, Pei Yu, Jia-Liang Chen, Yen-Wei Chen, Chung-Kai Wang, Chun-Hsu Chen, Yu-Ju Chang, Li-Hua Lin, Zanyu Yang
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Patent number: 10020284Abstract: A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.Type: GrantFiled: September 28, 2015Date of Patent: July 10, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ru Chang, Chung-Kai Wang, Ming-Che Wu
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Publication number: 20160020191Abstract: A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.Type: ApplicationFiled: September 28, 2015Publication date: January 21, 2016Inventors: Yu-Ru Chang, Chung-Kai Wang, Ming-Che Wu
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Patent number: 9147670Abstract: A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.Type: GrantFiled: February 24, 2012Date of Patent: September 29, 2015Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., Global Unichip Corp.Inventors: Yu-Ru Chang, Chung-Kai Wang, Ming-Che Wu
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Patent number: 9003875Abstract: A sheet thickness detection apparatus includes a bracket, a power device, a first linking lever, a second linking lever, a sheet pressing part, and a sensing device. The bracket has a base with a perforation. The sensing device includes a supporting part and a sensor. The power device, the first linking lever, the second linking lever and the sheet pressing part are disposed on a first surface of the bracket. The sensor is fixed on the supporting part. When the supporting part is connected to a second surface of the base, the sensor is penetrated through the perforation and exposed to a lateral side of the first linking lever. Moreover, the supporting part is movable, so that the position of the sensor relative to the first linking lever is adjustable.Type: GrantFiled: August 15, 2012Date of Patent: April 14, 2015Assignee: Primax Electronics Ltd.Inventors: Chung-Kai Wang, Chung-Jung Chiu, Wen-Lung Hung
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Patent number: 8827257Abstract: A sheet processing device includes a supporting plate, a stapler, a casing, a protrusion structure, and a swinging arm. The casing is disposed over the supporting plate. A sheet conveying channel is formed between the supporting plate and the casing. The protrusion structure is disposed on a lower surface of the casing, located beside the stapler and accommodated within the sheet conveying channel. During the process of introducing a sheet into the supporting plate, the stapled side of the sheet is flattened by the protrusion structure, and thus the possibility of upturning the sheet is minimized. During the process of introducing the plural sheets to the stapler, the stapled sides of the plural sheets are flattened by the protrusion structure, and thus the formation of the folded corners of the sheets is avoided.Type: GrantFiled: June 11, 2012Date of Patent: September 9, 2014Assignee: Primax Electronics Ltd.Inventors: Chung-Kai Wang, Wen-Lung Hung, Chung-Jung Chiu
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Publication number: 20130321304Abstract: A touch panel, a manufacturing method and a display device using the same are provided. The touch panel includes a substrate, a conductive layer, an insulating layer, a shielding layer and a flexible printed circuit board. The conductive layer is disposed on the substrate. The insulating layer is disposed on the conductive layer. The shielding layer is disposed on the insulating layer. The flexible printed circuit board has a ground trace electronically connected to the conductive layer. The shielding layer is electronically connected to the ground trace through at least one conductive through hole.Type: ApplicationFiled: May 14, 2013Publication date: December 5, 2013Applicant: Innolux CorporationInventor: Chung-Kai Wang
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Publication number: 20130276526Abstract: A sheet thickness detection apparatus includes a bracket, a power device, a first linking lever, a second linking lever, a sheet pressing part, and a sensing device. The bracket has a base with a perforation. The sensing device includes a supporting part and a sensor. The power device, the first linking lever, the second linking lever and the sheet pressing part are disposed on a first surface of the bracket. The sensor is fixed on the supporting part. When the supporting part is connected to a second surface of the base, the sensor is penetrated through the perforation and exposed to a lateral side of the first linking lever. Moreover, the supporting part is movable, so that the position of the sensor relative to the first linking lever is adjustable.Type: ApplicationFiled: August 15, 2012Publication date: October 24, 2013Applicant: PRIMAX ELECTRONICS LTD.Inventors: Chung-Kai Wang, Chung-Jung Chiu, Wen-Lung Hung
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Publication number: 20130249160Abstract: A sheet processing device includes a supporting plate, a stapler, a casing, a protrusion structure, and a swinging arm. The casing is disposed over the supporting plate. A sheet conveying channel is formed between the supporting plate and the casing. The protrusion structure is disposed on a lower surface of the casing, located beside the stapler and accommodated within the sheet conveying channel. During the process of introducing a sheet into the supporting plate, the stapled side of the sheet is flattened by the protrusion structure, and thus the possibility of upturning the sheet is minimized. During the process of introducing the plural sheets to the stapler, the stapled sides of the plural sheets are flattened by the protrusion structure, and thus the formation of the folded corners of the sheets is avoided.Type: ApplicationFiled: June 11, 2012Publication date: September 26, 2013Applicant: PRIMAX ELECTRONICS LTD.Inventors: Chung-Kai Wang, Wen-Lung Hung, Chung-Jung Chiu
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Publication number: 20130234384Abstract: A stapling device for use with a printing device is provided. The stapling device is disposed on the printing device. The stapling device includes an exit, a conveying channel, and a channel base plate. The channel base plate is located at a bottom side of said first conveying channel. In addition, the channel base plate has a movable contact plate, which may be moved relative to the channel base plate. In a case that a paper jam event occurs within the stapling device, the user may move the movable contact plate. As the movable contact plate is moved, the jammed paper sheet is correspondingly moved to a position near the exit. Consequently, the jammed paper sheet can be easily removed through the exit by the user.Type: ApplicationFiled: June 11, 2012Publication date: September 12, 2013Applicant: PRIMAX ELECTRONICS LTD.Inventors: Chung-Kai Wang, Ching-Tse Wang, Chung-Jung Chiu, Wen-Lung Hung
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Publication number: 20130221542Abstract: A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.Type: ApplicationFiled: February 24, 2012Publication date: August 29, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ru Chang, Chung-Kai Wang, Ming-Che Wu
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Patent number: 8436973Abstract: A liquid crystal display device includes a liquid crystal display panel and a flexible printed circuit board electrically connected to the liquid crystal display panel. The liquid crystal display panel includes a first substrate and a controller disposed on the first substrate. The controller is accommodated in a space between the first substrate and the flexible printed circuit board, and is covered by the flexible printed circuit board.Type: GrantFiled: November 22, 2010Date of Patent: May 7, 2013Assignee: Chimei Innolux CorporationInventor: Chung-Kai Wang
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Patent number: 8398066Abstract: An image forming apparatus with a stapling function is provided. The image forming apparatus includes a printing device and a stapling device. The printing device is used for printing images on plural papers. The printed papers are transmitted to the stapling device and stapled by the stapling device. The printing device has a printing device casing. The stapling device includes a minor casing and a main casing, which are respectively connected with a first surface and a second surface of the printing device casing. Since the stapling device is connected with two difference surfaces of the printing device casing, the overall height of the image forming apparatus is reduced.Type: GrantFiled: January 4, 2011Date of Patent: March 19, 2013Assignee: Primax Electronics, Ltd.Inventors: Chung-Kai Wang, Ching-Tse Wang, Ming-Han Chiu
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Patent number: 8393606Abstract: The present invention discloses a printing device with a detachable stapling device including a printing device housing, a connecting frame and a stapling device. The connecting frame has a locating post and a fixing hook and is connected with the stapling device. The position of the connecting frame can be adjusted by the locating post of the connecting frame, and the connecting frame can be assembled on the printing device housing or detached from the printing device housing by the fixing hook.Type: GrantFiled: June 14, 2011Date of Patent: March 12, 2013Assignee: Primax Electronics, Ltd.Inventors: Chung-Kai Wang, Ching-Tse Wang, Ming-Han Chiu, Chung-Jung Chiu
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Publication number: 20120267841Abstract: The present invention discloses a printing device with a detachable stapling device including a printing device housing, a connecting frame and a stapling device. The connecting frame has a locating post and a fixing hook and is connected with the stapling device. The position of the connecting frame can be adjusted by the locating post of the connecting frame, and the connecting frame can be assembled on the printing device housing or detached from the printing device housing by the fixing hook.Type: ApplicationFiled: June 14, 2011Publication date: October 25, 2012Applicant: PRIMAX ELECTRONICS LTD.Inventors: Chung-Kai Wang, Ching-Tse Wang, Ming-Han Chiu, Chung-Jung Chiu