Abstract: Disclosed are a heater in the form of a film and a method for manufacturing the same. A film-type heater includes an upper film, a lower film, and a heating element having a heating part of a pattern of heating part set between the upper film and the lower film, wherein the films have a shape of a pattern of heating part by removing films other than the pattern of heating part.

Abstract: A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.

Abstract: A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.

Abstract: An ultra-slim sensor device, comprising: a sensor element; lead wires (or lead frames) connected to the sensor element; a support for protecting the sensor element and the lead wires disposed therein; and upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them, wherein a thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.

Abstract: An ultra thin temperature sensor device includes a temperature sensor element, lead frames for allowing the temperature sensor element to be interposed and fastened between the lead frames, a supporter for protecting the temperature sensor element, and a film for enclosing and insulating the temperature sensor element, the lead frames, and the supporter. The supporter is formed to be larger than the temperature sensor element.

Abstract: A sensor element assembly, including: a sensor element; lead frames provided with the sensor element therebetween, the lead frames fixing the sensor element; a first head protection film protecting the sensor element fixed between the lead frames; an insulating film covering the first head protection film and the lead frames to insulate the lead frames; and a second head protection film (resin layer) further covering the head covered with the insulating film. The sensor element assembly is advantageous in that an epoxy resin layer is formed on a film layer covering a sensor element, so that the strength of the sensor element assembly can be maintained by the epoxy resin layer itself, thereby improving the impact resistance and compressive strength thereof.

Abstract: An ultra-slim sensor device, comprising: a sensor element; lead wires (or lead frames) connected to the sensor element; a support for protecting the sensor element and the lead wires disposed therein; and upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them, wherein a thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.

Abstract: An ultra thin temperature sensor device includes a temperature sensor element, lead frames for allowing the temperature sensor element to be interposed and fastened between the lead frames, a supporter for protecting the temperature sensor element, and a film for enclosing and insulating the temperature sensor element, the lead frames, and the supporter. The supporter is formed to be larger than the temperature sensor element.

Abstract: A sensor element assembly, including: a sensor element; lead frames provided with the sensor element therebetween, the lead frames fixing the sensor element; a first head protection film protecting the sensor element fixed between the lead frames; an insulating film covering the first head protection film and the lead frames to insulate the lead frames; and a second head protection film (resin layer) further covering the head covered with the insulating film. The sensor element assembly is advantageous in that an epoxy resin layer is formed on a film layer covering a sensor element, so that the strength of the sensor element assembly can be maintained by the epoxy resin layer itself, thereby improving the impact resistance and compressive strength thereof.

Abstract: An ESD protective device having a low capacitance and stability characteristics constructed by installing a voltage sensitive material between electrodes. The voltage sensitive material comprises a fluorescent substance. The voltage sensitive material may be barium aluminate. The voltage sensitive material may be zinc silicate. The voltage sensitive material may be zinc sulfide. The voltage sensitive material is doped with a metal atom such as Mn, Cu and Eu. The device does not distort a signal wave pattern and have low capacitance of 0.5 pF or lower.

Abstract: Provided is a distributed constant type filter. In a stacked body formed by stacking a plurality of printed circuit boards, signal line coil patterns on adjacent printed circuit boards face each another and are electrically connected together at both ends, and ground line coil patterns on adjacent printed circuit boards face each other and are electrically connected together at both ends. Accordingly, the distributed constant type filter has an attenuation characteristic superior to conventional distributed constant type filters while having an equivalent circuit completely different to the conventional distributed constant type filters. In addition, attenuation characteristics can be obtained without being greatly affected by a deviation upon a manufacturing process, and a process of manufacturing the filter is simple.

Abstract: Provided is a distributed constant type filter. In a stacked body formed by stacking a plurality of printed circuit boards, signal line coil patterns on adjacent printed circuit boards face each another and are electrically connected together at both ends, and ground line coil patterns on adjacent printed circuit boards face each other and are electrically connected together at both ends. Accordingly, the distributed constant type filter has an attenuation characteristic superior to conventional distributed constant type filters while having an equivalent circuit completely different to the conventional distributed constant type filters. In addition, attenuation characteristics can be obtained without being greatly affected by a deviation upon a manufacturing process, and a process of manufacturing the filter is simple.