Abstract: A package structure and a manufacturing method thereof are disclosed. The structure includes at least one semiconductor die, a redistribution layer disposed on the at least one semiconductor die, and connectors there-between. The connectors are disposed between the at least one semiconductor die and the redistribution layer, and electrically connect the at least one semiconductor die and the redistribution layer. The redistribution layer includes a dielectric layer with an opening and a metallic pattern layer disposed on the dielectric layer, and the metallic pattern layer includes a metallic via located inside the opening with a dielectric spacer surrounding the metallic via and located between the metallic via and the opening.

Abstract: An electrostatic capacitance type weight sensor includes a sheet-like upper support plate and a sheet-like lower support plate with their respective end portions secured together and having a pair of electrodes sandwiched therebetween. The upper support plate is coupled to a loaded element. Either sides of the upper and lower support plates adjacent their respective end portions are provided with bridge type elastic arms having a surface area smaller than that of a central portion of the upper support plate and the lower support plates. When the loaded element carries a load, causing one of the end portions of the upper support plate and the lower support plate to displace downwardly, the elastic arms flex in compensation so that the electrodes remain parallel to each other even when the space therebetween varies, thus enhancing measuring precision in addition to providing a thin and easily assembled weight sensor.