Patents by Inventor Chung-Kuei Huang
Chung-Kuei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170314127Abstract: A susceptor is provided. The susceptor comprises: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring, wherein the outer ring comprises multiple sub-elements separated from each other and detachably connected to the base part; wherein the inner ring and the outer ring separate the holders from one another, and the inner ring comprises multiple first extensions each protruding outwardly toward the outer ring, and each sub-element comprises a second extension extending inwardly toward the inner ring.Type: ApplicationFiled: July 18, 2017Publication date: November 2, 2017Inventors: Yuan-Hung HUANG, Chung-Kuei HUANG, Ai-Fa LEE, Shang-Po CHIEN, Meng-Tu CHIANG, Chi-Ling LEE, Ying-Chun CHUANG, Wen-Hsien LO
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Patent number: 9738974Abstract: A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another. A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; a cover comprising a first surface facing the base part, and a second surface opposite to the first surface; a first positioning structure; a second positioning structure formed in the first surface; and a third positioning structure formed in the base part, wherein the cover connects to the base part by associating the first positioning structure with the second positioning structure and the third positioning structure.Type: GrantFiled: July 2, 2015Date of Patent: August 22, 2017Assignee: Epistar CorporationInventors: Yuan-Hung Huang, Chung-Kuei Huang, Ai-Fa Lee, Shang-Po Chien, Meng-Tu Chiang, Chi-Ling Lee, Ying-Chun Chuang, Wen-Hsien Lo
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Patent number: 9396983Abstract: A susceptor, comprises: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another.Type: GrantFiled: June 2, 2014Date of Patent: July 19, 2016Assignee: EPISTAR CORPORATIONInventors: Yuan-Hung Huang, Chung-Kuei Huang
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Publication number: 20150348822Abstract: A susceptor, comprises: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another.Type: ApplicationFiled: June 2, 2014Publication date: December 3, 2015Applicant: EPISTAR CORPORATIONInventors: Yuan-Hung HUANG, Chung-Kuei HUANG
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Publication number: 20150345016Abstract: A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another. A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; a cover comprising a first surface facing the base part, and a second surface opposite to the first surface; a first positioning structure; a second positioning structure formed in the first surface; and a third positioning structure formed in the base part, wherein the cover connects to the base part by associating the first positioning structure with the second positioning structure and the third positioning structure.Type: ApplicationFiled: July 2, 2015Publication date: December 3, 2015Inventors: Yuan-Hung HUANG, Chung-Kuei HUANG, Ai-Fa LEE, Shang-Po CHIEN, Meng-Tu CHIANG, Chi-Ling LEE, Ying-Chun CHUANG, Wen-Hsien LO
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Patent number: 8664686Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.Type: GrantFiled: October 25, 2011Date of Patent: March 4, 2014Assignee: Epistar CorporationInventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Cheng-Yi Hsu, Chung-Kuei Huang
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Publication number: 20120040480Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.Type: ApplicationFiled: October 25, 2011Publication date: February 16, 2012Inventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Cheng-Yi Hsu, Chung-Kuei Huang
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Patent number: 8067780Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.Type: GrantFiled: September 5, 2007Date of Patent: November 29, 2011Assignee: Epistar CorporationInventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Cheng-Yi Hsu, Chung-Kuei Huang
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Publication number: 20080054290Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.Type: ApplicationFiled: September 5, 2007Publication date: March 6, 2008Applicant: EPISTAR CORPORATIONInventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Chung-Yi Hsu, Chung-Kuei Huang
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Patent number: 6762069Abstract: A method for manufacturing light-emitting device on non-transparent substrate includes the steps of forming a semiconductor epitaxial layer, a first conductive layer, a reflecting layer and a first conduction layer on a first substrate, and forming second conduction layer on a second substrate. Afterward, the first conduction layer and the second conduction layer is bounded by thermal pressing. The first substrate is then removed and a second conductive layer is formed to complete a light-emitting device. The light-emitting device can be incorporated with wetting layer and blocking layer to prevent inner diffusion and enhance external quantum efficiency.Type: GrantFiled: November 19, 2002Date of Patent: July 13, 2004Assignee: United Epitaxy Company, Ltd.Inventors: Chung-Kuei Huang, Chih-Sung Chang, Tzer-Perng Chen, Kuang-Neng Yang
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Publication number: 20040096998Abstract: A method for manufacturing light-emitting device on non-transparent substrate includes the steps of forming a semiconductor epitaxial layer, a first conductive layer, a reflecting layer and a first conduction layer on a first substrate, and forming second conduction layer on a second substrate. Afterward, the first conduction layer and the second conduction layer is bounded by thermal pressing. The first substrate is then removed and a second conductive layer is formed to complete a light-emitting device. The light-emitting device can be incorporated with wetting layer and blocking layer to prevent inner diffusion and enhance external quantum efficiency.Type: ApplicationFiled: November 19, 2002Publication date: May 20, 2004Applicant: UNITED EPITAXY COMPANY LTDInventors: Chung-Kuei Huang, Chih-Sung Chang, Tzer-Perng Chen, Kuang-Neng Yang