Patents by Inventor Chung-l Chiang

Chung-l Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP BONDING PROCESS
    Publication number: 20120318851
    Abstract: A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip and/or the carrier, and a positive pressure is applied onto the at least one chip.
    Type: Application
    Filed: October 25, 2011
    Publication date: December 20, 2012
    Applicant: WALSIN LIHWA CORPORATION
    Inventors: Wei-Cheng LOU, Ming-Tang Chen, Ting-Yu Chou, Jung-Kun Wu, Chung-l Chiang