Abstract: A benzoxazine resin and a method for manufacturing the same, and a resin composition are provided. The benzoxazine resin is obtained from a condensation polymerization reaction of a phenolic compound, formaldehyde, and a primary amine compound that are used as a reactant. The phenolic compound includes a dicyclopentadiene phenol resin and bisphenol A. The primary amine compound includes 2,6-dimethylaniline and m-xylylenediamine. The resin composition includes the benzoxazine resin, an epoxy resin, and a bismaleimide resin. Based on a total weight of the benzoxazine resin, the epoxy resin, and the bismaleimide resin being 100 phr, an amount of the benzoxazine resin ranges from 30 phr to 50 phr.

Abstract: A frozen food heating apparatus is disclosed, which includes a boiler body, a water tank in communication with the boiler body, and a container for containing food, a spray nozzle in communication with both the boiler body and the water tank being provided above the container, where a first solenoid valve or an electric ball valve is provided on a connection pipeline between the water tank and the spray nozzle, the spray nozzle is in communication with an upper end of the boiler body and a second solenoid valve is provided on a connection pipeline, and the water tank is in communication with the lower end of the boiler body and a third solenoid valve is provided on a connection pipeline.

Abstract: A silver-indium transient liquid phase method of bonding a semiconductor device and a heat-spreading mount, and a semiconductor structure having a silver-indium transient liquid phase bonding joint are provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.

Abstract: The present invention discloses a shredding device. The shredding device according to one or more embodiments of the present invention comprises: a shredding body for shredding materials; a frame for supporting the shredding body; and a power supply device that provides electric power to the shredding body. The shredding body comprises a housing, and the housing is provided with a power supply chamber for accommodating at least part of the power supply device. The shredding device according to the present invention features a compact structure, and is easy and safe to operate.

Abstract: The present invention discloses a shredding mechanism, a shredding device and a control system and method thereof. The shredding mechanism comprises a shredding component and an adjusting component, wherein the shredding component is used to shred materials, the adjusting component and the shredding component define an operation space for shredding operation, and the adjusting component and the shredding component are configured to be able to move relative to each other so as to change the size of the operation space. The present invention also discloses a shredding device and a control system and method thereof. The shredding mechanism and device according to the present invention feature improved safety, convenience and service life.

Abstract: A heat treatment method of a component for a vehicle includes: heating an inner space of a heat treatment furnace in which a component for a vehicle is disposed in the inner space; stabilizing hydrogen (H2) by injecting the H2 into the inner space; and performing nitrification heat treatment for the component by injecting only ammonia (NH3) into the inner space after the stabilizing. The heat treatment method may adjust the degree of vacuum and the flow rate instead of a Kn without additionally injecting the H2 gas into an NH3 gas, thereby implementing the nitrification heat treatment of a quality similar to that of a conventional nitrification heat treatment for a short time.

Abstract: A method for operating non-volatile storage disclosed herein. The method comprises performing an operation on a set of non-volatile storage elements. The operation on the set of non-volatile storage elements includes providing temperature compensation based on an operation temperature of the set of non-volatile storage elements. The providing temperature compensation includes determining if the operation temperature is outside a temperature range where constant compensation is valid and applying the temperature compensation based on the determination.

Abstract: A circuit board includes a substrate, a plurality of contacts disposed on a surface of the substrate, and a solder mask. The contacts have a plurality of plating regions and a metal layer on the plating regions, and the plating regions have at least two different sizes. The solder mask covers the surface of the substrate and covers edges of the plating regions, in which topmost surfaces of the contacts are below a top surface of the solder mask, and a gap between the topmost surfaces of the contacts and the top surface of the solder mask is larger than 0 ?m and is smaller than 5 ?m.

Abstract: A fingerprint sensing apparatus includes a plurality of fingerprint sensors and a fingerprint readout circuit. The fingerprint sensors may be configured to operate in a fingerprint sensing cycle. The fingerprint readout circuit may be coupled to the plurality of fingerprint sensors via a plurality of sensing lines. The fingerprint readout circuit may be configured to control the fingerprint sensors to operate in the fingerprint sensing cycle. The fingerprint sensing cycle includes an initialization period, an exposure period and a readout period. A voltage of a reset node in each fingerprint sensor among the fingerprint sensors is reset to a first voltage in a reset period before the fingerprint sensing cycle starts. The voltage of the reset node in each fingerprint sensor is initialized to an initial voltage in the initialization period. The initial voltage is different from the first voltage.

Abstract: A wireless communication device for a transmission end of a wireless communication system is provided. The wireless communication device includes a wireless analog transmission unit, for transmitting a data packet on a data transmission channel; and a packet generating unit, for generating the data packet and at least one protection packet; wherein before transmitting the data packet on the data transmission channel, the wireless communication device transmits the at least one protection packet on at least one adjacent channel of the data transmission channel to indicate to at least one user of the at least one adjacent channel to stop using the at least one adjacent channel before transmission of the data packet is completed, and at least one frequency band of the at least one adjacent channel overlaps a frequency band of the data transmission channel.

Abstract: Various examples pertaining to camera view synthesis on head-mounted display (HMD) for virtual reality (VR) and augmented reality (AR) are described. A method involves receiving, from a plurality of tracking cameras disposed around a HMD, image data of a scene which is on a first side of the HMD. The method also involves performing, using the image data and depth information pertaining to the scene, view synthesis to generate a see-through effect of viewing the scene from a viewing position on a second side of the HMD opposite the first side thereof.

Abstract: The utility model discloses a long-rod-type electric tool, comprising: a handle assembly, the handle assembly comprising a power supply unit; a machine head assembly, the machine head assembly comprising a driving unit and an operating unit connected to the driving unit; a long rod assembly, the long rod assembly being arranged between the handle assembly and the machine head assembly; and at least one interface. The long-rod-type electric tool is configured to make an orientation of the operating unit relative to the long rod assembly adjustable in at least one degree of freedom by means of the at least one interface.

Abstract: A technique includes detecting a presence of a hardware security module in a computer. The hardware security module performs trusted computing base measurements in response to the boot of the computer. The technique includes detecting an intention to change firmware of the computer and regulating providing a message warning about an impact of the change based on the determination. The regulation includes determining whether an operating system of the computer binds operations to the trusted computing base measurements and allowing communication of the message based on the determination.

Abstract: An electronic circuit adapted to drive a display panel is provided. The display panel includes touch sensors and fingerprint sensors. The electronic circuit includes a touch sensing circuit, a fingerprint sensing circuit and a display driving circuit. The touch sensing circuit senses a touch of a finger and determines a first area corresponding to the touch on the display panel. The fingerprint sensing circuit senses a fingerprint image of the finger corresponding to the first area. The display driving circuit drives pixels of the first area with respective first gray levels and pixels of a second area outside the first area with respective second gray levels. The display driving circuit processes respective third gray levels to obtain the respective second gray levels. The display driving circuit generates gamma voltages corresponding to the respective first gray levels and the respective second gray levels according to the same gamma curve.

Abstract: A method of fabricating a circuit board includes forming a conductive layer on a surface of a substrate, and patterning the conductive layer to define a plurality of plating regions and a plurality of plating lines. The plating regions have at least two different sizes, a first group of the plating regions are interconnected by a first plating line of the plating lines, and a second group of the plating regions are interconnected by a second plating line of the plating lines. A ratio of a total area of the first group of the plating regions to a total area of the second group of the plating regions is from about 1 to about 5. A solder mask is formed on the surface of the substrate to cover the plating lines and partially expose the plating regions. At least one metal layer is electroplated on the exposed plating regions.

Abstract: A method of fabricating a circuit board includes forming a conductive layer on a surface of a substrate, and patterning the conductive layer to define a plurality of plating regions and a plurality of plating lines. The plating regions have at least two different sizes, a first group of the plating regions are interconnected by a first plating line of the plating lines, and a second group of the plating regions are interconnected by a second plating line of the plating lines. A ratio of a total area of the first group of the plating regions to a total area of the second group of the plating regions is from about 1 to about 5. A solder mask is formed on the surface of the substrate to cover the plating lines and partially expose the plating regions. At least one metal layer is electroplated on the exposed plating regions.

Abstract: A molding method includes providing a molding device, wherein the molding device includes a mold cavity, a feeding port in communication with the mold cavity, and a junction point in connection with the mold cavity; engaging an outlet of an injector to the feeding port; injecting a molding material including a blowing agent into the mold cavity from the feeding port by the injector; and injecting a gas into the mold cavity through the junction point to increase a pressure inside the mold cavity to a predetermined pressure for maintaining the blowing agent in a supercritical state.

Abstract: A carburizing steel includes, based on a total wt % of the carburizing steel: 0.1 wt % or more and 0.3 wt % or less of C (carbon); 2.0 wt % or more and 2.7 wt % or less of Cr (chrome); 0.4 wt % or more of Si (silicon); 0.3 wt % or more and 0.7 wt % or less of Mo (molybdenum); less than 0.7 wt % of Mn (manganese); and 0.6 wt % or more and 1.5 wt % or less of Ni (nickel).

Abstract: A product substance inspection system includes an expansion module, an inspection module, and a preference-setting module. The expansion module expends regulatory information into a plurality of substance thresholds. The inspection module obtains material composition corresponding to a constituent from the aggregate material composition stored in a database, and compares each element in the material composition with the corresponding substance threshold. When the inspection module determines that the value of a specific element in the material composition exceeds the corresponding substance threshold, the preference-setting module replaces the constituent to which the specific element belongs according to the preference settings.

Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.