Patents by Inventor Chung Li-Lee

Chung Li-Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11000923
    Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: May 11, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
  • Publication number: 20180050425
    Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.
    Type: Application
    Filed: October 31, 2017
    Publication date: February 22, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Yen CHEN, Tzi-Yi SHIEH, Yuh-Sen CHANG, Chung-Li LEE
  • Patent number: 9808891
    Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: November 7, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
  • Publication number: 20150201502
    Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 16, 2015
    Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
    Inventors: Shih-Yen Chen, Tzi-Yi Shieh, Yuh-Sen Chang, Chung-Li Lee
  • Patent number: 5366593
    Abstract: A chemical pulp which contains reactants capable of generating dioxirane within the pulp is produced in a process which comprises mixing a pulp with reactants comprising a carbonyl compound, preferably acetone, and an oxygen donor, preferably monoperoxysulfate, in proportions which produce a water-soluble dioxirane having a molecular diameter of less than 140 angstrom units. Such a pulp bleaching process which employs dioxirane as a bleaching agent is rendered environmentally and economically acceptable by recycling the reactants employed to produce the dioxirane.
    Type: Grant
    Filed: August 11, 1992
    Date of Patent: November 22, 1994
    Assignees: Pulp & Paper Research Institute of Canada, The Curators of the University of Missouri
    Inventors: Chung-Li Lee, Robert W. Murray, Kenneth Hunt, James T. Wearing, Robert M. Hogikyan, Colin W. Oloman, Jianxin Chen
  • Patent number: 4693875
    Abstract: A process of abstracting sulfur from H.sub.2 S and generating hydrogen is disclosed comprising dissolving Pd.sub.2 X.sub.2 (.mu.-dppm).sub.2 in a solvent and then introducing H.sub.2 S. The palladium complex abstracts sulfur, forming hydrogen and a (.mu.-S) complex. The (.mu.-S) complex is readily oxidizable to a (.mu.-SO.sub.2) adduct which spontaneously loses SO.sub.2 and regenerates the palladium complex.
    Type: Grant
    Filed: August 27, 1986
    Date of Patent: September 15, 1987
    Assignee: Battelle Memorial Institute
    Inventors: Brian R. James, Chung Li-Lee, Michael A. Lilga, David A. Nelson