Patents by Inventor Chung-Liang Hsiao

Chung-Liang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310482
    Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 29, 2022
    Inventors: Sheng-Tsung Hsiao, Jen Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung
  • Publication number: 20220262705
    Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 18, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
  • Patent number: 11410910
    Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: August 9, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Tsung Hsiao, Jen Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung
  • Patent number: 11387164
    Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: July 12, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
  • Patent number: 9160422
    Abstract: A data capturing method of near-field communication (NFC) protocol and an NFC electronic device thereof are provided. The method can be applied to an NFC electronic device with an operation system, and the operation system includes a kernel mode and a user mode. The method includes following steps: detecting a readable element by an interface drive module in the kernel mode to obtain NFC original data transferred by the readable element; capturing the NFC original data from the interface drive module by a capturing module and outputting the NFC original data to an analyzing module in the user mode; and analyzing the NFC original data by the analyzing module to obtain NFC target data.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: October 13, 2015
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chung-Liang Hsiao, Chih-Yi Chen, Yuan-Jui Huang
  • Publication number: 20140164573
    Abstract: A data transmission system includes a plurality of electronic devices, an verification server, and at least one access server. The electronic devices are verified by the verification server, and a data transmission group formed by the verified electronic devices. A receiving end in the data transmission group sends a command to the rest of the electronic devices in the data transmission group by the verification server. When the rest of the electronic devices receive the command, the rest of the electronic devices output metadata to the access server. The receiving end receives the metadata via the access server. The receiving end requests the transmitting end in the data transmission group for a physical file according to the metadata. The transmitting end transmits the physical file to the access server, and the access server transmits the physical file to the receiving end.
    Type: Application
    Filed: December 5, 2013
    Publication date: June 12, 2014
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chung-Liang HSIAO, Chih-Yi CHEN, Ming-Bin LIN, Yuan-Jui HUANG, Wei-Ching CHUNG
  • Publication number: 20140141717
    Abstract: A data capturing method of near-field communication (NFC) protocol and an NFC electronic device thereof are provided. The method can be applied to an NFC electronic device with an operation system, and the operation system includes a kernel mode and a user mode. The method includes following steps: detecting a readable element by an interface drive module in the kernel mode to obtain NFC original data transferred by the readable element; capturing the NFC original data from the interface drive module by a capturing module and outputting the NFC original data to an analyzing module in the user mode; and analyzing the NFC original data by the analyzing module to obtain NFC target data.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 22, 2014
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chung-Liang Hsiao, Chih-Yi Chen, Yuan-Jui Huang
  • Patent number: 7872701
    Abstract: A method for fixing a flexible circuit board (FPC) of a display module includes providing a housing having at least a fixing pin, providing a display panel and an FPC having at least a fixing hole corresponding to the fixing pin, disposing the display panel and the FPC on the housing and folding back the FPC on another side of the housing such that the fixing pin passes through the fixing hole, and performing a hot mounting process to the fixing pin to enlarge the top end of the fixing pin to press the FPC onto the housing.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: January 18, 2011
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Chimei Innolux Corporation
    Inventors: Chuan-Pei Yu, Chung-Liang Hsiao
  • Publication number: 20100180050
    Abstract: A communication system compatible to universal serial bus (USB) and method thereof are described. The communication system includes a client electronic device and a remote electronic device. The client electronic device establishes a communication link to the peripheral device connected to the remote electronic device. The client electronic device has a virtual host controller unit and a client application program module. The virtual host controller unit receives the control command and stores the control command. The client application program module sends the control command. The remote electronic device has a remote application program module and a physical host controller unit. The remote application program module analyzes the control command from the client application program module. The physical host controller unit performs the analyzed control command.
    Type: Application
    Filed: April 27, 2009
    Publication date: July 15, 2010
    Inventors: Chung-liang Hsiao, Jin-min Lin
  • Patent number: 7639314
    Abstract: A method for fixing a flexible circuit board (FPC) of a display module includes providing a housing having at least a fixing pin, providing a display panel and an FPC having at least a fixing hole corresponding to the fixing pin, disposing the display panel and the FPC on the housing and folding back the FPC on another side of the housing such that the fixing pin passes through the fixing hole, and performing a hot mounting process to the fixing pin to enlarge the top end of the fixing pin to press the FPC onto the housing.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: December 29, 2009
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Innolux Display Corp.
    Inventors: Chuan-Pei Yu, Chung-Liang Hsiao
  • Patent number: 7495894
    Abstract: A structure of a liquid crystal display includes a first housing, a display panel module, a second housing, and a frame-structure layer. The first housing includes a first wall forming a compartment for the display panel module. The second housing includes a covering plane and a second wall. An edge of the display panel module is covered by the covering plane, and the first wall is surrounded by the second wall. The frame-structure layer is positioned between the first housing and the second housing.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: February 24, 2009
    Assignees: Innocom Technology (Shenzhen) Co. Ltd, Innolux Display Corp.
    Inventors: Chuan-Pei Yu, Chung-Liang Hsiao
  • Publication number: 20070103854
    Abstract: A structure of a liquid crystal display includes a first housing, a display panel module, a second housing, and a frame-structure layer. The first housing includes a first wall forming a compartment for the display panel module. The second housing includes a covering plane and a second wall. An edge of the display panel module is covered by the covering plane, and the first wall is surrounded by the second wall. The frame-structure layer is positioned between the first housing and the second housing.
    Type: Application
    Filed: February 8, 2006
    Publication date: May 10, 2007
    Inventors: Chuan-Pei Yu, Chung-Liang Hsiao
  • Publication number: 20070013824
    Abstract: A method for fixing a flexible circuit board (FPC) of a display module includes providing a housing having at least a fixing pin, providing a display panel and an FPC having at least a fixing hole corresponding to the fixing pin, disposing the display panel and the FPC on the housing and folding back the FPC on another side of the housing such that the fixing pin passes through the fixing hole, and performing a hot mounting process to the fixing pin to enlarge the top end of the fixing pin to press the FPC onto the housing.
    Type: Application
    Filed: December 21, 2005
    Publication date: January 18, 2007
    Applicant: JEMITEK ELECTRONICS CORP.
    Inventors: Chuan-Pei Yu, Chung-Liang Hsiao
  • Publication number: 20040207066
    Abstract: A lead on chip package comprises a chip, a leadframe, a nickel layer, a silver layer, an interfacial plating layer, and a tape. The chip comprises an active surface and bonding pads disposed on the active surface. The leadframe comprises leads and each lead comprises an inner lead and an outer lead, wherein the inner leads extend to the active surface of the chip. The nickel layer is plated onto the surface of the leadframe. The silver layer is plated onto the nickel layer on the inner lead. The interfacial plating layer improves the adhesion between the nickel and silver layers. The tape is adhered between the inner leads and the chip. Bonding wires electrically connect the silver layer on the inner leads and the bonding pads. Molding material encapsulates the chip and the inner leads and exposes the outer leads.
    Type: Application
    Filed: April 21, 2003
    Publication date: October 21, 2004
    Inventors: CHUNG-LIANG HSIAO, CHIH-KUNG HUANG
  • Publication number: 20040036151
    Abstract: A packaging structure is constructed from a double-leadframe structure that comprises a first and a second leadframe stacked on each other. The first leadframe includes a plurality of first leads that respectively have first outer leads. The second leadframe includes a plurality of second leads that respectively extend into inner leads and second outer leads. The second leadframe is stacked on the first leadframe in a manner that the second outer leads are correspondingly placed over the first outer leads.
    Type: Application
    Filed: April 18, 2003
    Publication date: February 26, 2004
    Inventors: Chung-Liang Hsiao, Chih-Kung Huang
  • Publication number: 20030124831
    Abstract: A method of forming a bump includes performing wet etching a bonding pad on the wafer, and then sequentially forming an under ball metallurgy layer and a bump. Hillocks on the bonding pad can be removed after the wet etching process, and the bump has a planar or concave surface, whereby no nodules are formed on the bump.
    Type: Application
    Filed: December 27, 2001
    Publication date: July 3, 2003
    Inventors: Chung-Liang Hsiao, Chien-Hsin Ko
  • Patent number: 5692632
    Abstract: This invention relates to a container with a self-contained evacuation lid. The container is provided for preserving food and is closed on the top by the evacuation lid. The lid includes a piston rod to be reciprorated up and down such that air inside the container is pumped out. An elastic element is fitted under the piston rod to bias a depressed part of the lid upward for an upward stroke when the depressed part is released after the downward movement. A valve rod is pulled to release the vacuum of the container for removal of the lid.
    Type: Grant
    Filed: May 1, 1996
    Date of Patent: December 2, 1997
    Inventors: Chien-Hsing Hsieh, Chung-Liang Hsiao