Abstract: The present invention provides a method of arranging a huge amount of chips, comprising the sequential steps: a providing step of providing a substrate and a plurality of chips; a spreading step of spreading a plurality of chips on the surface of the substrate; a tilting step of tilting the substrate by an angle to slide down the plurality of chips along the surface of the substrate so that the trapping stoppers trap the plurality of chips respectively in such a manner that the blocked chips are placed in the chip placing areas respectively; an adhering step of adhering, onto the chip placing areas, the chips with the working surface upward; and a removing step of removing, from the substrate, the chips which are not adhered onto the chip placing areas. A huge number of chips can be transferred efficiently by the method of the present invention.

Abstract: A resistor comprises a substrate, an upper ohmic region disposed on a selective one of an upper surface and a lower surface of the substrate and a lower ohmic region disposed on the other one of the upper surface and the lower surface of the substrate. An upper metal conducting layer overlies on the substrate and the upper ohmic region, and a lower metal conducting layer overlies on the lower ohmic region. When the upper and lower metal conducting layers are electrified, the upper ohmic region and the lower ohmic region are electrically connected, and a contact interface between the substrate and the upper metal conducting layer forms an enlarged depletion region to block electrical conduction therebetween. As a result, a resistance value of the resistor is increased when an applied voltage on the resistor is increased.

Abstract: A resistor comprises a substrate, an upper ohmic region disposed on a selective one of an upper surface and a lower surface of the substrate and a lower ohmic region disposed on the other one of the upper surface and the lower surface of the substrate. An upper metal conducting layer overlies on the substrate and the upper ohmic region, and a lower metal conducting layer overlies on the lower ohmic region. When the upper and lower metal conducting layers are electrified, the upper ohmic region and the lower ohmic region are electrically connected, and a contact interface between the substrate and the upper metal conducting layer forms an enlarged depletion region to block electrical conduction therebetween. As a result, a resistance value of the resistor is increased when an applied voltage on the resistor is increased.

Abstract: This invention provides a method of packaging and manufacturing a contact lens in a container, wherein the container comprises a central recess formed of a curved surface with a ring-shaped protruding portion surrounding the curved surface, the method comprising the steps of: providing the container; injecting a lens-forming monomer mixture into the central recess to form the contact lens along the curved surface of the central recess; combining the container and a hand-held section; pouring a solution into the container to immerse the contact lens in the container; and sealing the container with a lid for sealing the contact lens and the solution in the container; wherein the curved surface of the central recess has one or a plurality of continuous radii of curvature Rrecess less than a radius of curvature Rlens of the contact lens in its hydrous state.

Abstract: The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires and at least one chip unit. A DC power or an AC power is directly electrically connected with the two electrodes through wires to drive the LED device to emit light. The present invention minimizes device components and fabrication steps, effectively reduces cost and promotes reliability and yield.

Abstract: This invention provides a contact lens for myopia control comprising: an object-side surface comprising a central zone, a transition zone and a peripheral zone which are concentric and have different refractive power, at least one of the three zones being aspheric; and an image-side surface; wherein the central zone provides correction power to focus a foveal image on the retina, the peripheral zone provides a myopic defocus effect by generating a para-fovea image in front of the retina, and the transition zone with one or more focuses provides a refractive power in diopter (D) ranging from +0.25 D to +8.00 D.

Abstract: This invention provides a contact lens for myopia control comprising: an object-side surface comprising a central zone, a transition zone and a peripheral zone which are concentric and have different refractive power, at least one of the three zones being aspheric; and an image-side surface; wherein the central zone provides correction power to focus a foveal image on the retina, the peripheral zone provides a myopic defocus effect by generating a para-fovea image in front of the retina, and the transition zone with one or more focuses provides a refractive power in diopter (D) ranging from +0.25 D to +8.00 D.

Abstract: Contact lenses with pores having high oxygen permeability and a manufacturing method thereof. The manufacturing method comprises the steps of uniformly mixing water-soluble salts and the formula of contact lenses having hydrophilic monomers to form a mixed formula; molding and forming the mixed formula to obtain contact lenses; dissolving and dialyzing the water-soluble salts by a water solution so as to form a plurality of pores with a predetermined diameter on a surface and in the interior of the contact lenses. The diameter of pore size has an allowable range between 0.03 ?m and 0.05 ?m such that the contact lenses with high oxygen permeability can be obtained.

Abstract: This invention provides a container for a contact lens, comprising: a central recess; a peripheral groove surrounding the central recess; and a rim surrounding the peripheral groove; wherein the central recess is a curved surface having one or a plurality of continuous R values less than an R value of the contact lens in its natural state, and wherein the R value is a radius of curvature of a curved surface.

Abstract: The present invention discloses a method for fabricating an AC LED package device, which comprises steps: providing a plurality of LED modular chips each having a plurality of LEDs in same polar direction in series; connecting forward and reversely the LED modular chips with a wire-bonding method to form an AC LED package device; and connecting the AC LED package device with an AC power source. In the present invention, the LED modular chips, each of which have LEDs all connected in same polar direction, are used to form an AC LED package device. Therefore, the present invention is using less-complicated photomasks compared with prior art. Accordingly, the present invention simplifies the process, promotes the yield and lowers the cost.

Abstract: The present invention discloses a solderable aluminum-based material, wherein electron donors combine with the non-bonded atoms on the surface of an aluminum-based material. The bonding between the electron donors and the aluminum atoms on the surface generates a protective film to prevent from the formation of an aluminum oxide layer on the surface of the aluminum-based material. The present invention improves the conventional aluminum-based material, and has lightweightness, a low price, a high economic value, a high electric conductivity, a high thermal conductivity and a superior solderability. Thereby, a normal soldering, a total-face soldering or a double-side soldering can be easily performed on the solderable aluminum-based material of the present invention with a common soldering technology.

Abstract: The invention relates to a nanoneedle chip, which comprises a support having an interface region; and a plurality of shafts connected to and extending from said interface region of the solid support, wherein each said shaft is in a cone-like or cylinder shape, the tip of each shaft ranges from about 0.1 nm to less than about 1 &mgr;m in diameter, the base of each shaft ranges from about 1 nm to less than about 1 &mgr;m in diameter and the height of shaft is at least three times than the diameter of the base. Also disclosed in the processes for producing the nanoneedle array of the invention.