Patents by Inventor Chung-Ling Liou

Chung-Ling Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Communication interface structure between processing die and memory die
    Patent number: 11515278
    Abstract: A communication interface structure for connection between dies is provided, including a memory die, processing dies and interconnection routings. The memory die includes a first interface edge, wherein the first interface edge is split into a plurality of interface groups. Each of the processing dies includes a second interface edge. Interconnection routings respectively connect the second interface edges of the processing dies to the interface groups of the memory die.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: November 29, 2022
    Assignees: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chieh Liao, Igor Elkanovich, Hung-Yi Chang, Li-Ken Yeh, Chung-Ling Liou
  • COMMUNICATION INTERFACE STRUCTURE BETWEEN PROCESSING DIE AND MEMORY DIE
    Publication number: 20220270996
    Abstract: A communication interface structure for connection between dies is provided, including a memory die, processing dies and interconnection routings. The memory die includes a first interface edge, wherein the first interface edge is split into a plurality of interface groups. Each of the processing dies includes a second interface edge. Interconnection routings respectively connect the second interface edges of the processing dies to the interface groups of the memory die.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chieh Liao, Igor Elkanovich, Hung-Yi Chang, Li-Ken Yeh, Chung-Ling Liou