Patents by Inventor Chung-Long Lin

Chung-Long Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076422
    Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
  • Patent number: 6027371
    Abstract: An electrical connector connected to a printed circuit board includes an insulative housing, a plurality of contacts received in the housing, a spacer member including a body portion projecting from a mounting surface of the housing and a neck portion projecting from a top surface of the body portion, and a board lock member extending from the neck portion of the spacer member for engaging with a board lock reception hole defined in the printed circuit board. The neck portion of the spacer member is received in the board lock reception hole of the printed circuit board for preventing solder from flowing from a lower surface of the printed circuit board to an upper surface thereof via the board lock reception hole. The top surface of the body portion of the spacer abuts against the upper surface of the printed circuit board thereby forming a space between the mounting surface of the connector and the upper surface of the printed circuit board.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: February 22, 2000
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chung-Long Lin, Rong-Yuh Leu, Ming-Chung Ko