Abstract: An inspection system includes an excitation light source, a voltage-sensing film, an illumination light source, an image capture device. The excitation light source provides an excitation beam to light-emitting diodes to generate open-circuit voltages. The voltage-sensing film is at a top side of the light-emitting diodes and includes a voltage-sensing medium layer and a first electrode layer. The first electrode layer is in the voltage-sensing medium layer to provide a gain effect of the open-circuit voltages, so that the voltage-sensing medium layer senses the open-circuit voltages, and a display of the voltage-sensing medium layer is changed with a portion or all of the open-circuit voltages. The illumination light source provides an illumination beam to the voltage-sensing film to generate a sensing image according to a display change. The image capture device is on a transmission path of the sensing image and receives the sensing image to generate an inspection result.

Abstract: A method for inspecting LED dies includes the following steps. First electrodes and second electrodes of LED dies to be inspected are short-circuited via a conductive layer on an inspection substrate, or an inspection bias voltage is applied between the first electrodes and the second electrodes of the LED dies. An excitation light is irradiated on the LED dies to be inspected on the inspection substrate such that the LED dies to be inspected emit a secondary light. When the first electrodes and the second electrodes of the LED dies to be inspected are open, short-circuited, and/or subjected to the inspection bias voltage, the secondary light is captured via an optical sensor. An output of the optical sensor is received via a computer and a spectrum difference of the secondary light is calculated to determine whether the LED dies are abnormal or to classify the LED dies to be inspected.

Abstract: A method of training AI for label-free cell viability determination includes a step of providing a cell sample, a step of obtaining a fluorescence image and a DHM image of the cell sample, a step of determining a first cell viability of the cell sample according to the fluorescence image of the cell sample, a step of labeling the DHM image of the cell sample as a model specifying the first cell viability, and a step of performing AI training by using the model containing the DHM image of the cell sample.

Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer.

Abstract: A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.

Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.

Abstract: An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer.

Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.

Abstract: An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

Abstract: An eye tracking apparatus and an eye tracking method for the eye tracking apparatus are provided. The eye tracking apparatus includes an image capture device and a computing device. The image capture device is adapted to capture at least one face image. The computing device is coupled to the image capture device. The computing device receives the face image to obtain an eye image and identifies at least one iris region of the eye image. The computing device chooses the largest iris region from the iris regions to obtain a fitting pattern of the largest iris region and obtains a gaze point of the eye image based on the fitting pattern.

Abstract: An eye tracking apparatus and an eye tracking method for the eye tracking apparatus are provided. The eye tracking apparatus includes an image capture device and a computing device. The image capture device is adapted to capture at least one face image. The computing device is coupled to the image capture device. The computing device receives the face image to obtain an eye image and identifies at least one iris region of the eye image. The computing device chooses the largest iris region from the iris regions to obtain a fitting pattern of the largest iris region and obtains a gaze point of the eye image based on the fitting pattern.

Abstract: A computer-based system and method for generating a primary document characterizing a device from multiple secondary documents is provided. In one example, the method includes defining a primary document template and multiple input files. Each input file defines the source and type of information for a section of the primary document template. A document generation engine parses the secondary documents and inserts information from them into the primary document template based on the input files. After the primary document is generated, related technologies or devices may be identified and notified of changes to the device in the primary document. The related technologies or devices may then be updated if desired.

Abstract: A computer-based system and method for generating a primary document characterizing a device from multiple secondary documents is provided. In one example, the method includes defining a primary document template and multiple input files. Each input file defines the source and type of information for a section of the primary document template. A document generation engine parses the secondary documents and inserts information from them into the primary document template based on the input files. After the primary document is generated, related technologies or devices may be identified and notified of changes to the device in the primary document. The related technologies or devices may then be updated if desired.