Patents by Inventor Chung-Lun Wu

Chung-Lun Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-gate devices and fabricating the same with etch rate modulation
    Patent number: 11949001
    Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Ching Wang, Chung-I Yang, Jon-Hsu Ho, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Flexible printed circuit and fabrication method thereof
    Patent number: 8344257
    Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: January 1, 2013
    Assignee: HTC Corporation
    Inventors: Chung-Lun Wu, Fu-An Chu, Ja-Ee Li
  • FLEXIBLE PRINTED CIRCUIT AND FABRICATION METHOD THEREOF
    Publication number: 20100314164
    Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
    Type: Application
    Filed: September 28, 2009
    Publication date: December 16, 2010
    Inventors: Chung-Lun WU, Fu-An Chu, Ja-Ee Li
  • PLANAR MOVING APPARATUS
    Publication number: 20100095798
    Abstract: A planar moving apparatus includes a moving stage, a first driving apparatus, a second driving apparatus and a base member. The base member carries the stage, the first driving apparatus and the second driving apparatus. The first driving apparatus drives the moving stage along a first axial direction and the second driving apparatus drives the moving stage along a second axial direction. The first driving apparatus and the second driving apparatus operate independently and do not interfere with each other when the moving stage moves along either the first axial direction or the second axial direction.
    Type: Application
    Filed: April 2, 2009
    Publication date: April 22, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: LIANG CHIH CHANG, CHAO JUNG CHEN, CHYAN CHYI WU, SHENG HANG WANG, TA CHANG YU, CHUNG LUN WU