Abstract: A case, such as a suitcase or a photo case, for holding an object at an exterior thereof includes a case body and a hinge edge frame arrangement. The hinge edge frame arrangement includes a first edge frame, a second edge frame and a resilient element. The first edge frame is extended along the utility edge of the case body to retain a utility panel in position, wherein the first edge frame has an elongated holding slot formed between an outer and an inner wall along a utility edge. The second edge frame includes an elongated pivot arm, having an enlarged end portion, pivotally received in and extended along the holding slot of the first edge frame, and a clipping member extended from the pivot arm, wherein the clipping member is adapted to fold between a clipping position and a releasing position for detachably clipping an object by the clipping member.

Abstract: An improved barrier layer stack and method for forming the same for preserving an aluminum alloy interconnect resistivity, the method comprising providing a semiconductor process wafer comprising an exposed conductive region; forming a first barrier layer comprising a barrier layer stack over the exposed conductive region comprising one of a TiN or Ti layer in contact with the conductive region; forming at least one additional barrier layer comprising the barrier layer stack to form an alternating sequence of TiN and Ti layers; forming an uppermost barrier layer of TiN comprising the barrier layer stack; forming an overlying aluminum alloy region in contact with the uppermost barrier layer; and, subjecting the semiconductor process wafer to at least one process comprising a temperature of greater than temperatures greater than about 350 ° C.