Abstract: A flip-chip process includes the steps of disposing a plurality of spherical contact members on a surface of a wafer; forming a photo-curing adhesive layer on the surface of the wafer, wherein said photo-curing adhesive layer covers a part of each of the spherical contact members to expose the spherical contact members of the photo-curing adhesive layer; solidifying the photo-curing adhesive layer by exposure; cutting the wafer into a plurality of chip units; placing the chip units on a substrate to let the spherical contact members lie against contact points of the substrate; and pressurizing the chip units and then heating the spherical contact potions to enable the spherical contact members to be welded and electrically connected with the chip units and the contact points of the substrate

Abstract: A method of manufacturing a die stack package includes the steps of providing a wafer having a first surface and a second surface, said first surface having a plurality of cut ways thereon, the second surface being coated with adhesive of a predetermined thickness at a predetermined position thereof, removing parts of the adhesive by photo-lithography, each of the parts of the adhesive corresponds to the cut way and is wider than the cut way; cutting the wafer along the cut ways to make a plurality of dies, each of the dies having a part of the adhesive thereon; and stacking each of the dies, whose surface having the adhesive faces a lower-layer die, on the lower-layer die. Therefore, the method facilitates the stacking operation and saves the production cost.

Abstract: An IC packaging process includes the steps of preparing a substrate having a chip-receiving place formed on a front side thereof; creating a dam layer on the front side of the substrate; coating an ultraviolet adhesive layer on the dam layer; removing a part of the ultraviolet adhesive layer that corresponds to the chip-receiving place; removing a part of the dam layer that corresponds to the chip-receiving place; mounting a chip to the chip-receiving place in the open chamber and bonding wires between the substrate and the chip for electrical connection of the chip and the substrate; and mounting a cover layer on the ultraviolet adhesive layer and then heating the ultraviolet adhesive layer to adhesively fasten the cover layer on the dam layer. Accordingly, the IC packaging process effectively reduces the adhesive squeeze-out to prevent it from damage to the chip.

Abstract: An IC package having reduced thickness includes a lead frame, a chip, and a plurality of bonding wires. The lead frame includes a front side, a rear side, a plurality of pins located on the front side, and a hollow portion formed on the lead frame. The chip is larger than the rear side of the lead frame. The chip includes a plurality of electrodes and is adhered to the rear side of the lead frame. The electrodes correspond to the hollow portion. The bonding wires pass through the hollow portion to be connected with the pins and the electrodes. Accordingly, the IC package can effectively take good use of the space below the lead frame, reducing the height of the bonding wires and saving the packaging space above the lead frame, and reduce the thickness of the IC package without addition of the cost and equipment.

Abstract: A IC packaging process includes the steps of mounting at least one retaining member on a top side of a substrate, the retaining member defining a receiving space, a chip being mounted to the substrate and located in the receiving space; forming a photo-curing adhesive layer in the receiving space, the photo-curing adhesive layer being capable of shielding the chip completely; irradiating and developing the photo-curing adhesive layer to harden a part of the photo-curing adhesive layer to define a hardened portion thereof, the other part of the photo-curing adhesive layer defining a non-hardened portion corresponding to the chip; and removing the non-hardened portion to expose an active portion of the chip.

Abstract: An IC packaging process includes the steps of forming a photo-curing adhesive layer on a bottom side of a lead frame and then harden the photo-curing adhesive layer; mounting a chip fixedly on a top side of the lead frame and electrically connecting the chip to the lead frame; proceeding to wire bonding to let a plurality of soldering wires electrically connected with the chip and the lead frame; proceeding to molding to let a packaging material package the chip, the soldering wires, and the top side of the lead frame; and removing the photo-curing adhesive layer from the bottom side of the lead frame. In light of the steps, the photo-curing adhesive layer securely shields the bottom side of the lead frame and prevents the packaging material from inleakage into the bottom side of the lead frame to securely avoid the adhesive overflow.

Abstract: A method of arranging stacked chips by photo-curing adhesive includes the steps of disposing a first chip on a top side of a substrate and electrically connecting the first chip to the substrate by wire bonding; forming a photo-curing adhesive layer on a top side of the first chip; hardening the photo-curing adhesive layer by irradiation to convert it from colloid to solid for 70-80% degree of solidification; softening the photo-curing adhesive layer by heating of 50-80° C. to convert it from solid to semisolid to enable the photo-curing adhesive layer to be adherent; disposing a second chip on a top side of the photo-curing adhesive layer, then converting the photo-curing adhesive layer from semisolid to complete solid by heating of 100-150° C., and finally electrically connecting the second chip to the substrate by wire bonding.