Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first source/drain epitaxial feature formed over a substrate, a second source/drain epitaxial feature formed over the substrate, two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature, a gate electrode layer surrounding a portion of one of the two or more semiconductor layers, a first dielectric region disposed in the substrate and in contact with a first side of the first source/drain epitaxial feature, and a second dielectric region disposed in the substrate and in contact with a first side of the second source/drain epitaxial feature, the second dielectric region being separated from the first dielectric region by a substrate.

Abstract: A semiconductor device includes a fin structure, a metal gate stack, a barrier structure and an epitaxial source/drain region. The fin structure is over a substrate. The metal gate stack is across the fin structure. The barrier structure is on opposite sides of the metal gate stack. The barrier structure comprises one or more passivation layers and one or more barrier layers, and the one or more passivation layers have a material different from a material of the one or more barrier layers. The epitaxial source/drain region is over the barrier structure.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure and is configured to receive a foot. The upper includes a knitted component having a strobel portion that is configured to be disposed underneath the foot. The strobel portion defines an interior surface and an exterior surface of the knitted component. The strobel portion defines a strobel passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the strobel passage.

Abstract: A light-emitting device includes a semiconductor epitaxial structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and having holes; a first insulation layer disposed on the semiconductor epitaxial structure and having first and second grooves; a first pad electrically connected to the first semiconductor layer through the first grooves; and a second pad electrically connected to the second semiconductor layer through the second grooves. A projection of the first pad does not overlap projections of the holes. A projection of the second pad does not overlap the projections of the holes. The first pad includes a first pad connection portion and first pad extension portions; the second pad includes a second pad connection portion and second pad extension portions. Projections of the second grooves fall between projections of the first and second pad extension portions. Two other aspects of the light-emitting device are also provided.

Abstract: A light-emitting diode and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, an LED wafer is provided. The LED wafer includes a substrate and a light-emitting semiconductor stacking structure positioned on the surface of the substrate. The light-emitting semiconductor stacking structure includes a first type semiconductor layer, an active layer, and a second type semiconductor layer from a side of the substrate. Second, dicing lanes are defined on the upper surface of the LED wafer. Third, dicing is performed along the dicing lanes of the substrate using a laser. The laser is focused on the lower surface of the substrate to form a surface hole and focused inside the substrate to form an internal hole. The diameter of the surface hole is greater than the diameter of the internal hole. Fourth, the LED wafer is separated into LED chips along the dicing lanes.

Abstract: An integrated circuit structure includes a first metal feature formed into a first dielectric layer, a second metal feature formed into a second dielectric layer, the second dielectric layer being disposed on said first dielectric layer, and a via connecting the first metal feature to the second metal feature, wherein a top portion of the via is offset from a bottom portion of the via.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure and is configured to receive a foot. The upper includes a knitted component having a strobel portion that is configured to be disposed underneath the foot. The strobel portion defines an interior surface and an exterior surface of the knitted component. The strobel portion defines a strobel passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the strobel passage.

Abstract: The present utility invention provides a food forming apparatus, which comprises a mold frame and a clamping mold. The mold frame comprises a first pivot point and two second pivot points. The clamping mold comprises a first mold and a second mold. The present utility invention utilizes a mold frame and a clamping mold which is capable to be pivotably rotatable at different positions, to solve the technical issue during automation.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure and is configured to receive a foot. The upper includes a knitted component having a strobel portion that is configured to be disposed underneath the foot. The strobel portion defines an interior surface and an exterior surface of the knitted component. The strobel portion defines a strobel passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the strobel passage.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure and is configured to receive a foot. The upper includes a knitted component having a strobel portion that is configured to be disposed underneath the foot. The strobel portion defines an interior surface and an exterior surface of the knitted component. The strobel portion defines a strobel passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the strobel passage.

Abstract: A touch sensor panel is disclosed. The touch sensor panel can include a plurality of touch nodes, the plurality of touch nodes including a first set of touch nodes and a second set of touch nodes, different from the first set of the touch nodes. In some examples, sense circuitry can be configured to, during a first scan, sense a first combined touch signal of the first set of the touch nodes, and during a second scan, sense a second combined touch signal of the second set of the touch nodes. A touch processor can be configured to determine a touch image at the plurality of touch nodes based on the first and second combined touch signals.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure and is configured to receive a foot. The upper includes a knitted component having a strobel portion that is configured to be disposed underneath the foot. The strobel portion defines an interior surface and an exterior surface of the knitted component. The strobel portion defines a strobel passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the strobel passage.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure. The upper includes a knitted component having a base portion that is configured to be disposed adjacent the sole structure. The base portion defines an interior surface and an exterior surface of the knitted component. The base portion defines a base portion passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the base portion passage.

Abstract: An upper for an article of footwear is configured to be connected to a sole structure. The upper includes a knitted component having a base portion that is configured to be disposed adjacent the sole structure. The base portion defines an interior surface and an exterior surface of the knitted component. The base portion defines a base portion passage between the interior surface and the exterior surface. Also, the upper includes a tensile strand that extends through the base portion passage.

Abstract: Fetuin-beads, a manufacturing method thereof and a method of concentrating and detecting influenza virus by the fetuin-beads are disclosed. The method of concentrating and detecting an influenza virus by the fetuin-beads comprises the steps of preparing fetuin-beads; mixing the fetuin-beads and a solution capable of providing salt ions to obtain a fetuin-bead solution; mixing the fetuin-bead solution and a sample comprising the influenza virus to concentrate the influenza virus onto the fetuin-beads to obtain a plurality of fetuin bead-influenza virus combinations; and collecting the fetuin bead-influenza virus combinations and using a virus testing method to detect the influenza virus on the fetuin bead-influenza virus combinations. Therefore, an easy and fast method to detect the influenza virus with timeliness and high accuracy is provided.

Abstract: A hub assembly for a disk brake of a bicycle includes a support shaft, a hub body pivotally mounted on the support shaft and provided with two drum disks, a mounting portion protruding from one of the drum disks, a threaded section protruding from the mounting portion, a brake disk resting on the end face of the mounting portion, and a chainwheel screwed onto the threaded section and pressing the brake disk so that the brake disk is clamped between the mounting portion and the chainwheel closely. Thus, the brake disk is mounted on and detached from the hub body by screwing and unscrewing the chainwheel, so that the hub assembly is assembled and disassembled easily and rapidly, thereby facilitating a user assembling and disassembling the hub assembly.

Abstract: A portable long-running lighting device having a manual power generator of the present invention can generate electricity effectively and also can radiate for a long time. The portable long-running lighting device includes a manual power generator module, an electricity storage module, an LED (light-emitting diode) module and a housing. The manual power generator module includes an electricity generator, a transmission mechanism and a base. The electricity storage module is coupled to an electricity generator of the manual power generator module. The LED module includes a plurality of light-emitting diodes and a circuit. The circuit further includes a power saving circuit coupled between the electricity storage module and the light-emitting diodes. With a three-stage discharge mode, a discharge speed of the electricity storage module can be stabilized, so as to achieve an electricity saving effect.

Abstract: A compound having the formula: in which R1, R2, R3, T, W, m, x, and y are defined as in the specification. Also disclosed is a method of treating enterovirus infection by using a compound described above.

Abstract: An optical system has a correction half-sphere lens having multiple secondary mirrors mounted on an outer periphery of the correction half-sphere lens. A primary half-sphere mirror is coaxial and shares a same curvature center with the correction half-sphere lens. The primary half-sphere mirror has multiple through holes each corresponding to one of the secondary mirrors and having a second correction lens received therein to receive light from the corresponding secondary mirror. A cap is provided on top of the primary half-sphere mirror and has a shutter in a center of the cap to control incident light coming to the system.

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.