Abstract: A power module package is provided. The power module package includes an electronic assembly that includes a substrate and a power device group. The substrate includes an insulating layer, a circuit pattern layer, and a conductive heat-dissipating layer. The circuit pattern layer and the conductive heat-dissipating layer are respectively disposed at two opposite sides of the insulating layer. The power device group is disposed on the circuit pattern layer, and the power device group and the circuit pattern layer are configured to form a common circuit. A total area of the conductive heat-dissipating layer is greater than that of the circuit pattern layer, and a thickness of the circuit pattern layer is greater than that of the insulating layer.

Abstract: A power module package is provided. The power module package includes an electronic assembly, a first terminal assembly and a second terminal assembly. The electronic assembly at least includes a substrate. The first terminal assembly includes a first power device terminal, and the second terminal assembly includes a second power device terminal. The first power device terminal and the second power device terminal respectively extend from different surfaces of the substrate to form a height difference therebetween. The first power device terminal includes a first contact section and a first non-contact section. The first contact section is directly connected to the substrate, and the first non-contact section is not in contact with the substrate. The substrate protrudes from the first contact section and extends to a position under the first non-contact section.

Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

Abstract: A power module including a carrier assembly and a power device disposed on the carrier assembly is provided. The carrier assembly includes a bottom board, a circuit board, a lead frame, and a pad group. The circuit board is disposed on the bottom board and includes a device mounting portion and an extending portion protruding from a side of the device mounting portion. The lead frame disposed on the bottom board includes a first conductive portion and a second conductive portion insulated from each other. The extending portion of the circuit board is disposed between the first and second conductive portions, and an upper surface of the lead frame is flush with a top surface of the extending portion. A pad group includes a first pad disposed on the extending portion, a second pad and a third pad respectively disposed on the first and second conductive portions.

Abstract: A power module including a carrier assembly and a power device disposed on the carrier assembly is provided. The carrier assembly includes a bottom board, a circuit board, a lead frame, and a pad group. The circuit board is disposed on the bottom board and includes a device mounting portion and an extending portion protruding from a side of the device mounting portion. The lead frame disposed on the bottom board includes a first conductive portion and a second conductive portion insulated from each other. The extending portion of the circuit board is disposed between the first and second conductive portions, and an upper surface of the lead frame is flush with a top surface of the extending portion. A pad group includes a first pad disposed on the extending portion, a second pad and a third pad respectively disposed on the first and second conductive portions.

Abstract: A one-way conduction device includes a first transistor and a driving circuit. The driving circuit includes a first circuit, a second circuit and a detection circuit. The first transistor is coupled between an input end and an output end of the one-way conduction device. In the first circuit, a first conduction unit is coupled between the input end of the one-way conduction device and a first resistor. In the second circuit, a second conduction unit is coupled between the output end of the one-way conduction device and a second resistor. In the driving circuit, the detection circuit detects whether a current flows from the first circuit to the second circuit, and accordingly turns on or turns off the first transistor. In this manner, the driving circuit can control the turning on and off of the one-way conduction device.

Abstract: A one-way conduction device includes a first transistor and a driving circuit. The driving circuit includes a first circuit, a second circuit and a detection circuit. The first transistor is coupled between an input end and an output end of the one-way conduction device. In the first circuit, a first conduction unit is coupled between the input end of the one-way conduction device and a first resistor. In the second circuit, a second conduction unit is coupled between the output end of the one-way conduction device and a second resistor. In the driving circuit, the detection circuit detects whether a current flows from the first circuit to the second circuit, and accordingly turns on or turns off the first transistor. In this manner, the driving circuit can control the turning on and off of the one-way conduction device.

Abstract: A power conversion apparatus is provided. The power conversion apparatus receives an AC input power by an input side and includes a capacitor, an AC-to-DC conversion unit and a discharge unit. The capacitor is connected with the input side. The AC-to-DC conversion unit is coupled to the input side, and configured to convert the AC input power after receiving the AC input power to generate a DC output power. The discharge unit is coupled to the capacitor and has at least two switch elements. The discharge unit enables the at least two switch elements when supply of the AC input power is interrupted, such that one of a first discharge path and a second discharge path formed by the at least two switch elements is taken to discharge or drain the energy stored in the capacitor.

Abstract: A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a plurality of chips on the carrier; forming a plurality of adhesive layers on a surface of the corresponding chips; covering a conductive cover plate, bonding the conductive cover plate with the chips through the adhesive layers, and dividing out a plurality of packaging spaces by the conductive cover plate for disposing the chips respectively; and providing an insulation material to fill the packaging spaces through via holes on the conductive cover plate to form a first insulation structure; finally, removing the carrier.

Abstract: A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a plurality of chips on the carrier; forming a plurality of adhesive layers on a surface of the corresponding chips; covering a conductive cover plate, bonding the conductive cover plate with the chips through the adhesive layers, and dividing out a plurality of packaging spaces by the conductive cover plate for disposing the chips respectively; and providing an insulation material to fill the packaging spaces through via holes on the conductive cover plate to form a first insulation structure; finally, removing the carrier.

Abstract: A power conversion apparatus is provided. The power conversion apparatus receives an AC input power by an input side and includes a capacitor, an AC-to-DC conversion unit and a discharge unit. The capacitor is connected with the input side. The AC-to-DC conversion unit is coupled to the input side, and configured to convert the AC input power after receiving the AC input power to generate a DC output power. The discharge unit is coupled to the capacitor and has at least two switch elements. The discharge unit enables the at least two switch elements when supply of the AC input power is interrupted, such that one of a first discharge path and a second discharge path formed by the at least two switch elements is taken to discharge or drain the energy stored in the capacitor.

Abstract: A LED current-balance driving circuit having a current-balance coil set, a switching unit, and a control circuit is provided. The current-balance coil set has at least a first coil and a second coil, both of which are in connection with respective LED strings, for balancing currents flowing through the LED strings. The switching unit and a leakage inductance of current-balance coil set are utilized to facilitate the voltage conversion for driving the LED strings. A duty cycle of the switching unit is controlled by the control circuit according to the currents flowing through the LED strings.

Abstract: A power semiconductor package and a method of method of manufacturing the same are disclosed, where the power semiconductor package includes a lead frame, a first die, a second die and a single connecting strip. The lead frame includes a voltage plate, a grounding plate, an output plate, a first gate plate and a second gate plate. The first die is disposed on the voltage plate, and a high side transistor within the first die is connected to the first gate plate. The second die is disposed on the grounding plate, and a low side transistor within the second die is connected to the second gate plate. The connecting strip is disposed on the first and second dies and the output plate and electrically connects to a source of the high side transistor and a drain of the low side transistor.

Abstract: A LED current-balance driving circuit having a current-balance coil set, a switching unit, and a control circuit is provided. The current-balance coil set has at least a first coil and a second coil, both of which are in connection with respective LED strings, for balancing currents flowing through the LED strings. The switching unit and a leakage inductance of current-balance coil set are utilized to facilitate the voltage conversion for driving the LED strings. A duty cycle of the switching unit is controlled by the control circuit according to the currents flowing through the LED strings.

Abstract: A driving controller, power conversion circuit, and method for modulating driving voltage level with respect to a load are disclosed. In which the method, controller and circuit are applied for modulating the driving voltage of a transistor in a power converter. The driving controller includes a load parameter measurement unit, a voltage modulation unit, and a driving control unit. In which the load parameter measurement unit detects a load parameter which represents the magnitude of the load of the power conversion circuit. The voltage modulation unit then modulates the potential level of the driving voltage of the transistors in response to the load parameter for reducing unnecessary power consumption associated with the transistors in the power converter and enhancing overall power efficiency of the power conversion circuit.

Abstract: A light-emitting diode (LED) driving circuit and a secondary side controller for controlling the same control an output voltage of the LED driving circuit at a first driving voltage or a second driving voltage. When the output voltage is controlled at the first driving voltage, an LED module driven by the LED driving circuit is in a stably lighting state; and when the output voltage is controlled at the second driving voltage, the output voltage is approximately a threshold voltage of the LED module but higher than zero volt, so that the LED module is close to not emitting light. Therefore, in a dimming operation, the variation of voltage applied across the LED module is smaller than that in the conventional LED driving circuits to thereby protect the LED module against an excessive voltage stress and avoid the problem of inaccurate dimming.

Abstract: A light-emitting diode (LED) driving circuit and a secondary side controller for controlling the same control an output voltage of the LED driving circuit at a first driving voltage or a second driving voltage. When the output voltage is controlled at the first driving voltage, an LED module driven by the LED driving circuit is in a stably lighting state; and when the output voltage is controlled at the second driving voltage, the output voltage is approximately a threshold voltage of the LED module but higher than zero volt, so that the LED module is close to not emitting light. Therefore, in a dimming operation, the variation of voltage applied across the LED module is smaller than that in the conventional LED driving circuits to thereby protect the LED module against an excessive voltage stress and avoid the problem of inaccurate dimming.

Abstract: A method for adjusting the brightness of an LCD display has the steps of: (a) dividing an adjustable brightness range of the LCD display into three stages, a high brightness stage, a normal brightness stage and a low brightness stage, (b) determining which stage of said three stages has corresponded to a brightness adjust command, (c) adjusting luminance intensity of an LCD panel or luminance intensity of a lamp based on the brightness adjust command. An apparatus for performing the method has a microprocessor to receive the brightness adjust command, a PWM unit coupled to the microprocessor to adjust the current intensity of the lamp, and a voltage level controller coupled to the microprocessor to adjust the voltage level applied on the LCD panel.