Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.

Abstract: Various embodiments of the present application are directed towards a group III-V device including a rough buffer layer. The rough buffer layer overlies a silicon substrate, a buffer structure overlies the rough buffer layer, and a heterojunction structure overlies the buffer structure. The buffer structure causes band bending and formation of a two-dimensional hole gas (2DHG) in the rough buffer layer. The rough buffer layer includes silicon or some other suitable semiconductor material and, in some embodiments, is doped. A top surface of the rough buffer layer and/or a bottom surface of the rough buffer layer is/are rough to promote carrier scattering along the top and bottom surfaces. The carrier scattering reduces carrier mobility and increases resistance at the 2DHG. The increased resistance increases an overall resistance of the silicon substrate, which reduces substrate loses and increases a power added efficiency (PAE).

Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: Disclosed herein are methods for selecting an antibody fragment specific to an influenza virus. According to certain embodiments of the present disclosure, the influenza virus may be influenza virus type A (IAV) or influenza virus type B (IBV). Also disclosed herein are the selected antibodies, recombinant antibody produced from the selected antibodies, and the uses thereof in the diagnosis of influenza virus infection.

Abstract: Disclosed herein are recombinant antibodies or the fragment thereof for detecting severe acute respiratory syndrome coronavirus (SARS-CoV). According to some embodiments, the SARS-CoV is SARS-CoV-1. According to some alternative embodiments, the SARS-CoV is SARS-CoV-2. Also disclosed herein are a kit comprising the recombinant antibodies, and a method for diagnosing the infection of SARS-CoV by using the recombinant antibody or the kit.

Abstract: Disclosed herein are methods for high-throughput screening of a virus-specific neutralizing antibody. According to certain embodiments of the present disclosure, the virus is an influenza virus. Also disclosed herein are the antibodies selected by the high-throughput screening method, and the uses thereof in the prophylaxis and/or treatment of viral infection.

Abstract: Provided herein is a method for treating neurodegenerative diseases, such as Alzheimer's disease (AD), by use of monoclonal antibody, which exhibits a binding affinity to Siglec-3 receptor. According to some embodiments of the present disclosure, the monoclonal antibody is capable of enhancing phagocytosis of neurotoxic peptides by immune cells thereby providing a neuroprotective effect to a subject in need thereof.

Abstract: A wire drawing process of a light storage wire includes a feeding step, a mixing step, a first drying step, a hot melt extrusion step, a first cooling step, a shaping/organizing wire step, a hot-temperature remodeling step, a stretching step, a second cooling step, a strand winding/rolling step, and a second drying step.

Abstract: A method for manufacturing a composite fabric includes the steps of feeding, mixing and stirring, first drying, hot melt extrusion, first cooling, stretch extension, second cooling, winding-strands-into-roll, second drying, and weaving. The composite fabric is composed of multiple first threads and multiple second threads which are woven to the first threads. The first threads and the second threads are respectively reflective threads and glowing threads so that the composite fabric includes both features of light reflection and glowing in dark.

Abstract: The thread drawing processes include the steps of feeding, mixing and stirring, first drying, hot melt extrusion, first cooling, stretch extension, second cooling, winding-strands-into-roll, and second drying. The threads made by the processes mainly use thermoplastic polyurethane particles which are easily prepared. When fabric made by the threads is attached to objects, the fabric is flat and neat.

Abstract: The adhesive thread drawing processes include the steps of feeding, mixing and stirring, first drying, hot melt extrusion, first cooling, stretch extension, second cooling, winding-strands-into-roll, and second drying. The threads made by the processes are woven into fabric which has a certain level of stickiness so as to be attached onto objects without using glue and adhesive, and the fabric is flat and neat when it is attached to an object.

Abstract: Disclosed herein is a novel monoclonal antibody exhibiting binding affinity to Siglec-3 receptor. According to the embodiment, the monoclonal antibody is capable of reversing HBV-induced immunosuppression. Accordingly, also disclosed herein are the uses thereof in the treatment and/or prophylaxis of hepatitis B virus (HBV) infection.

Abstract: A wire drawing process of a light storage wire includes a feeding step, a mixing step, a first drying step, a hot melt extrusion step, a first cooling step, a shaping/organizing wire step, a hot-temperature remodeling step, a stretching step, a second cooling step, a strand winding/rolling step, and a second drying step.

Abstract: Disclosed herein are methods for high-throughput screening of a virus-specific neutralizing antibody. According to certain embodiments of the present disclosure, the virus is an influenza virus. Also disclosed herein are the antibodies selected by the high-throughput screening method, and the uses thereof in the prophylaxis and/or treatment of viral infection.

Abstract: The thread drawing processes include the steps of feeding, mixing and stirring, first drying, hot melt extrusion, first cooling, stretch extension, second cooling, winding-strands-into-roll, and second drying. The threads made by the processes mainly use thermoplastic polyurethane particles which are easily prepared. When fabric made by the threads is attached to objects, the fabric is flat and neat.

Abstract: Disclosed herein are methods for high-throughput screening of a functional antibody fragment for an immunoconjugate that targets a protein antigen. The method combines a phage-displayed synthetic antibody library and high-throughput cytotoxicity screening of non-covalently assembled immunotoxins or cytotoxic drug to identify highly functional synthetic antibody fragments for delivering toxin payloads.