Abstract: A mould with a heating device is disclosed. The mould mainly comprises an upper mould, a lower mould, a conductive layer, an insulating layer, at least a pair of electrodes capable of being arranged in the conductive layer in a conductive manner, at least one first conductive unit and at least one second conductive unit.

Abstract: A forming method for a cooling system of a rapid heating mold comprises: preparing a solid cooling waterway object (30) of a default cooling waterway, the solid cooling waterway object (30) comprising multiple interconnected attachment portions (31) and multiple subbranch portions (32); placing the solid cooling waterway object (30) into a container (40) provided with a perfusion groove (41), and the attaching the attachment portions (31) onto a groove bottom surface (411) of the perfusion groove (41); preparing a perfusion material, and perfusing the perfusion material into the perfusion groove (41) of the container (40) to form a mold fixing layer (50) of the solid cooling waterway object (30) after cooling; and taking out the mold fixing layer (50), heating the mold fixing layer (50), enabling the solid cooling waterway object (30) to be in a gas state or a liquid state, and discharging the object in the gas state or the liquid state, so as to form a cooling waterway (52) corresponding to the solid cooling

Abstract: A mould with a heating device is disclosed. The mould mainly comprises an upper mould, a lower mould, a conductive layer, an insulating layer, at least a pair of electrodes capable of being arranged in the conductive layer in a conductive manner, at least one first conductive unit and at least one second conductive unit.

Abstract: A mould assembly with a heating device comprises: an upper mould with an upper joint surface, a lower mould, two conductive plates and two conductive wires. The lower mould includes a conductive layer, a lower joint surface which is formed on the conductive layer and faces the upper joint surface, an insulating surface which is formed on the conductive layer and faces in an opposite direction from the lower joint surface, an insulating formed on the insulating surface. The two conductive plates are disposed on the conductive layer of the lower mould. The two conductive wires are connected to the conductive plates and each have a resistivity lower than a resistivity of the conductive layer. The mould assembly with a heating device is low cost and capable of making the temperature distribution on the surface of the mould assembly more uniform.

Abstract: An electronic device includes an image capturing device disposed on a housing and including a casing that is disposed partly in an inner receiving space in the housing and that is pivotable relative to the housing, an imaging lens mounted on the casing for generating an optical image of an object, an image sensing module disposed in the inner receiving space in the housing and adjacent to the casing for sensing the optical image generated by the imaging lens, and a reflector disposed in the case so as to reflect the optical image from the imaging lens toward the image sensing module such that the optical image is received by the image sensing module.

Abstract: A cover plate of a portable electronic device has an outer plate, an inner plate, and a protective layer. The protective layer is arranged between the outer plate and the inner plate, and the protective layer is a uniform reticulated structure. The outer further includes first a plating, a second plating and a third plating. Moreover, the method for fabricating the cover plate is also disclosed herein.