Abstract: A method of forming an IC structure includes forming first and second power rails at a power rail level. First metal segments are formed at a first metal level above the power rail level. Each first metal segment of the plurality of first metal segments overlap one or both of the first power rail or the second power rail. First vias are formed between the power rail level and the first metal level. Second metal segments are formed at a second metal level above the first metal level. At least one second metal segment of the plurality of second metal segments overlaps the first power rail. At least one second metal segment of the plurality of second metal segments overlaps the second power rail. A plurality of second vias are formed between the first metal level and the second metal level.

Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

Abstract: An optical input device is provided to be operated by a user to generate a vector signal. The optical input device includes an operating stick and an optics module. A reflecting body is disposed at a lower end of the operating stick, and the optics module has a light source and an optical sensor. The light source projects light onto the reflecting body and the light is reflected to generate a reflected image into the optical sensor. The operating stick is moved to drive the reflecting body, such that the reflected image into the optical sensor is changed to generate the vector signal.