Patents by Inventor Chung-Pan Wu

Chung-Pan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT SOURCE MODULE AND BULB LAMP
    Publication number: 20140071656
    Abstract: A light source module includes a base plate, a projection, and a plurality of light-emitting devices. The projection is disposed on the base plate. The light-emitting devices surround the projection and are disposed on the projection.
    Type: Application
    Filed: January 16, 2013
    Publication date: March 13, 2014
    Applicant: APM COMMUNICATION, INC.
    Inventors: Tzyy-Jang Tseng, Cheng-Yi Wang, Yung-Cheng Sung, Chung-Pan Wu
  • T-bar lamp
    Patent number: 8529091
    Abstract: A T-bar lamp including a T-bar lamp housing and at least a light engine module is provided. The T-bar lamp housing has an opening. The light engine module is fixed in the T-BAR lamp housing, and the light engine module at least includes a chip on board (COB) type LED light source.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: September 10, 2013
    Assignee: APM Communication, Inc.
    Inventors: Yung-Cheng Sung, Chung-Pan Wu
  • T-BAR LAMP
    Publication number: 20130016513
    Abstract: A T-bar lamp including a T-bar lamp housing and at least a light engine module is provided. The T-bar lamp housing has an opening. The light engine module is fixed in the T-BAR lamp housing, and the light engine module at least includes a chip on board (COB) type LED light source.
    Type: Application
    Filed: June 13, 2012
    Publication date: January 17, 2013
    Applicant: APM COMMUNICATION, INC.
    Inventors: Yung-Cheng Sung, Chung-Pan Wu
  • Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure
    Patent number: 8242594
    Abstract: A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: August 14, 2012
    Assignee: Unimicron Technology Corp.
    Inventor: Chung-Pan Wu
  • CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20100264534
    Abstract: A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire.
    Type: Application
    Filed: August 17, 2009
    Publication date: October 21, 2010
    Applicant: Unimicron Technology Corp.
    Inventor: Chung-Pan Wu
  • Lighting bulb
    Patent number: D729961
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: May 19, 2015
    Assignee: APM COMMUNICATION, INC.
    Inventors: Yung-Cheng Sung, Chung-Pan Wu, Tzyy-Jang Tseng