Abstract: A heat dissipation structure of lighting devices is disclosed, which comprises a light emitting mechanism; a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation unit, combined with an end of the light emitting mechanism; and a socket, electrically connected to the light emitting mechanism, and combined with an end of the carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation unit. As such, a thermal transmission efficiency is promoted, a thermal transfer bottleneck is effectively decreased, heat sink is never necessary, a heat dissipation cost is largely reduced, a volume and weight of the device is reduced, and a waste of the raw material, carbon, and energy consumption can be reduced.

Abstract: A heat dissipation structure of lighting devices is disclosed, which comprises a light emitting mechanism; a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation unit, combined with an end of the light emitting mechanism; and a socket, electrically connected to the light emitting mechanism, and combined with an end of the carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation unit. As such, a thermal transmission efficiency is promoted, a thermal transfer bottleneck is effectively decreased, heat sink is never necessary, a heat dissipation cost is largely reduced, a volume and weight of the device is reduced, and a waste of the raw material, carbon, and energy consumption can be reduced.

Abstract: A thermal transfer catalytic heat dissipation structure is disclosed, which comprises a thermal conductive carrier; a heat source which disposed on a face of the thermal conductive carrier; and a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film, at least disposed on the other face of the thermal conductive carrier. A carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film is used to dissipate a heat source when a thermal conductive carrier absorbs the heat from heat source, so that the heat is effectively transferred to the ambient through the film, avoiding a thermal transfer gap with respect to the ambient (like as air).

Abstract: A thermal transfercatalytic heat dissipation method is disclosed, comprises steps of disposing a thermal transfer interface on a heat source; and disposing a carbon nanoparticles which have a hexagonal carbon ring geometry based heat dissipation film on at least a face of the thermal transfer interface, so that the hexagonal carbon ringed nanometer heat dissipation film dissipates the heat source after the thermal transfer interface absorbs the heat source, so that the heat is directed effectively to the ambient through the film, avoiding a thermal transfer drop between the thermal transfer interface and the air, and achieving in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck is effectively reduced, heat dissipation fins are saved, a heat dissipation cost is largely reduced, a volume and weight is reduced, a consumption of the raw material is reduced and a purpose of energy saving and carbon reduction is achieved.

Abstract: By introducing a carefully controlled anneal step after the deposition of tungsten silicide (onto a layer of polysilicon) but before the deposition of a layer of silicon oxide, interaction between the tungsten silicide and a subsequently deposited layer of silicon oxide is greatly reduced or eliminated. This gives good values for the resistance of gate lines formed from the composite as well as for the contact resistance between the polysilicon and the tungsten silicide.