Abstract: An electroless plating catalyst contains: carbon material powders which include oxygen functional groups. The oxygen functional groups at least consisting of any one of lactol, ester, hydroxyl, epoxy, and ketone, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

Abstract: An electroless plating catalyst contains: carbon material powders which include oxygen functional groups, wherein the carbon material powders include oxide of any one of graphene, graphite, carbon nanotube, carbon black, and activated carbon with/without oxidization treatment. Oxygen content of the carbon material powders is 5 wt % to 50 wt % of a total weight of carbon powder material. The carbon material powders include a combination, and the combination is any one of nitrogen (N), sulfur (S), boron (B), fluorine (F), and phosphorus (P), wherein a content of the combination is 1 wt % to 20 wt % of the total weight of the carbon powder material.

Abstract: A combination of a RFID antenna and an illumination device contains: a casing, a lighting unit, and a RFID antenna. The casing includes a metal plate and a fixing frame which has an opening and being mounted on a front end of the metal plate. The lighting unit includes a light guide plate and multiple light emitting elements, wherein the lighting unit is defined between the metal plate and the fixing frame, the light guide plate is fixed between the metal plate and the fixing frame, and the light guide plate has a transporting face facing the opening of the fixing frame so that the lights illuminate to the transporting face of the light guide plate from the multiple light emitting element. The RFID antenna is accommodated in the front end of the metal plate and is defined between the light guide plate and the metal plate.

Abstract: A combination of a RFID antenna and an illumination device contains: a casing, a lighting unit, and a RFID antenna. The casing includes a metal plate and a fixing frame which has an opening and being mounted on a front end of the metal plate. The lighting unit includes a light guide plate and multiple light emitting elements, wherein the lighting unit is defined between the metal plate and the fixing frame, the light guide plate is fixed between the metal plate and the fixing frame, and the light guide plate has a transporting face facing the opening of the fixing frame so that the lights illuminate to the transporting face of the light guide plate from the multiple light emitting element. The RFID antenna is accommodated in the front end of the metal plate and is defined between the light guide plate and the metal plate.

Abstract: A RFID security structure for a document contains: a RFID antenna and a RFID chip. The RFID antenna is made of conductive inks printed on the document, and the RFID chip is attached on and is electrically connected with the RFID antenna. When the covering layer is removed from the document, the RFID antenna is broken. Accordingly, a portion of the RFID antenna attaches on the covering layer, and the other portion of the PRID antenna remains on the RFID security document or the substrate, hence the RFID security document is not tampered or is not imitated.

Abstract: A wireless detectable diaper contains: a body and a shiftable-frequency RFID tag. The body includes a water-permeable lining layer, a waterproof layer, and an absorption layer. The RFID tag includes a chip and an antenna, wherein the antenna has a main part and an extending part, the extending part is arranged on a water-absorbing substrate, the extending part and the substrate contact with the absorption layer and are arranged on a wetting position of the body, and the main part and the chip are arranged on a non-wetting position of the body. When the body is not wet, a first frequency reading section of the antenna departs from a second frequency reading section of the monitoring equipment. The substrate absorbs urine or water in the absorption layer and is soaked by the urine or the water, such that a dielectric coefficient of the substrate is changed.

Abstract: A method of making a LED light bulb with thermal radiation filaments contains steps of: A. providing a substrate which includes multiple conductive portions formed on two ends of the substrate respectively so as to electrically connect with an electronic circuit; B. molding LED chips, wires, and phosphors on a front face of the substrate so as to produce a LED filament sheet; C. forming a thermal radiation dissipation film on a back face of the substrate before or after producing the LED filament sheet; D. cutting the substrate into the thermal radiation filaments, wherein each of the thermal radiation filaments has a part of the thermal radiation dissipation film, a part of the LED filament sheet, and parts of the multiple conductive portions respectively; and E. fixing the thermal radiation filaments into the LED light bulb.

Abstract: Binder-free conductive carbon-based ink is printed on flexible polymeric substrates such as PET and paper as an antenna for wireless devices. Without addition of polymer binder, conductivity of the carbon-based ink can be greatly improved. Owing to the enhance of conductivity, carbon-based ink proposed in this patent can be applied to antenna application, such as RFID, and enormously decreases the antenna cost. Further compression and protective coating will further enhance adhesion of antenna.

Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.

Abstract: A method of making a LED light bulb with thermal radiation filaments contains steps of: A. providing a substrate which includes multiple conductive portions formed on two ends of the substrate respectively so as to electrically connect with an electronic circuit; B. molding LED chips, wires, and phosphors on a front face of the substrate so as to produce a LED filament sheet; C. forming a thermal radiation dissipation film on a back face of the substrate before or after producing the LED filament sheet; D. cutting the substrate into the thermal radiation filaments, wherein each of the thermal radiation filaments has a part of the thermal radiation dissipation film, a part of the LED filament sheet, and parts of the multiple conductive portions respectively; and E. fixing the thermal radiation filaments into the LED light bulb.

Abstract: A bonding structure of a chip and an electronic circuit contains: a chip holder, a chip accommodated in the chip holder, multiple conductive feet electrically connected with the chip, and an electronic circuit. The chip and the multiple conductive feet are covered by a packaging material, and a part of each of the multiple conductive feet exposes outside the packaging material to form an extension. The electronic circuit includes a porous substrate and an electric circuit connected on the porous substrate, wherein the electric circuit is formed from conductive inks which penetrate into the porous substrate, and the extension is inserted through the electric circuit, hence the extension is electrically connected with the electric circuit.

Abstract: A method of making a LED light bulb with the Graphene filament contains steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate; C. cutting the printed circuit board (PCB) on which a graphene-based heat dissipation film is coated to form plural Graphene filaments; D. fixing the plural Graphene filaments into a light bulb. The flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. The graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. In addition, the Graphene filaments are fixed in a bended or arched position.

Abstract: A binder-free conductive ink with a conductive cage architecture for the wireless antenna with adhesion enhancement by carbon powders that aims to enormously reduce the solid content of conductor and can be used to print antennas. For example, silver content of the ink composition is greatly decreased due to the absence of insulated binder. Carbon powders (such as graphene nanoplatelets) are added as a conductive “cage” to reduce the use of insulated binder and significantly improve the conductivity of ink under low addition of conductor. Compression after printing is an innovative finding that not only improves the adhesion of a binder-free conductive ink with a conductive cage architecture but also enhances its conductivity. Such effects are credited to excellent contact between interfaces of particles and substrate. The unique recipe and process save printing from high-temperature sintering, further reducing processing cost and widening applicable substrates.

Abstract: A heat dissipation coating layer contains: a heat dissipation filler and a binder which are synthesized in a water bathing manner. The heat dissipation filler includes a metal core formed on a central portion of the heat dissipation filler, and the heat dissipation filler also includes a metal shell surrounding the metal core, wherein the metal core has metal particles, and the metal shell has porous metal oxide particles and porous metal hydroxide particles, a size of each of the porous metal oxide particles and the porous metal hydroxide particles is less than 500 nm.

Abstract: A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems.

Abstract: A method of making a LED light bulb with the Graphene filament contains steps of: A. providing a flexible substrate, wherein the flexible substrate is flexible printed circuit board (PCB); B. coating graphene-based heat dissipation ink on a back side of the flexible substrate; C. cutting the printed circuit board (PCB) on which a graphene-based heat dissipation film is coated to form plural Graphene filaments; D. fixing the plural Graphene filaments into a light bulb. The flexible substrate has copper lines formed on both sides thereof for electronic circuits and heat conduction, and LED chips are mounted on a front side of the flexible substrate. The graphene-based heat dissipation ink is coated on the back side of the flexible substrate before or after LED chips/phosphor molding and then is dried. In addition, the Graphene filaments are fixed in a bended or arched position.

Abstract: A highly porous heat dissipation coating by graphene-rich baking varnish consists of: graphene nanoflakes, at least one dispersants, binders, and carriers. The amount of graphene-rich nanoflakes accounts for 10 to 70 wt % of solid composition of a graphene baking varnish. The at least one dispersant is non-ionic or ionic dispersant. The binder is made of thermoplastic polymers. The carrier is selected from aqueous liquids, organic solvents, or a combination thereof. A post-baking treatment at relative high temperature (100 to 400° C.) is applied for enhancing the adhesion of heat dissipation coating on metal surface. Accordingly, the graphene-rich baking varnish enhances adhesion and improves heat dissipation rate by convection and radiation.