Patents by Inventor Chung-Ren Yang

Chung-Ren Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136447
    Abstract: A semiconductor device is provided. The semiconductor device includes a semiconductor substrate, a first deep well region, at least two second well regions, at least one isolation structure and an implantation region. The first deep well region is disposed in the semiconductor substrate, wherein the first deep well region has a first conductivity type. The second well regions are disposed on the first deep well region, wherein the second well regions have a second conductivity type. The isolation structure covers a portion of the first deep well region and surrounds at least a portion of the second well regions. The implantation region is located under a top surface of the semiconductor substrate, wherein the implantation region has a discontinuous portion, and the discontinuous portion partially overlaps the first deep well region.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chung-Ren LAO, Hsiao-Ying YANG, Hsing-Chao LIU, Ching-Chung CHEN
  • Publication number: 20060013265
    Abstract: A bus architecture and a data transmission method thereof are applicable to a signal transmission environment between functioning components of an information system, so as to transmit data, addresses and/or control signals between any two of the functioning components of the information system in a serial transmission manner via at least one wire. During the data transmission method, the bus architecture can convert a parallel signal to a serial signal and/or convert a serial signal to a parallel signal, and the sequence of the two conversions being performed or the proceeding of only one or both of the conversions depends on practical requirements.
    Type: Application
    Filed: July 14, 2004
    Publication date: January 19, 2006
    Applicant: CULTURE.COM TECHNOLOGY (MACAU) LTD.
    Inventors: Tian-Bao Hu, Chung-Ren Yang, Li-Chien Chen