Patents by Inventor Chung-Shan Peng

Chung-Shan Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITE NONWOVEN TEXTILE HAVING INCREASED PILLING RESISTANCE THROUGH USE THERMAL BONDING
    Publication number: 20220136154
    Abstract: Aspects herein are directed to a composite nonwoven textile suitable for use in apparel and other articles that are resistant to pilling. The composite nonwoven textile may be finished by one or more of applying a chemical binder to a first face of the composite nonwoven textile and forming thermal bonding sites. The chemical binder and the thermal bonding sites help to secure fiber terminal ends and minimize the formation of pills.
    Type: Application
    Filed: October 26, 2021
    Publication date: May 5, 2022
    Inventors: Dallas Lund, Yang-Hua Ou, Jung-Fu Chien, Chung-Shan Peng